# US 2019/0174653 A1 · Liquid-cooling heat dissipating module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0174653 A1 - Document ID: US20190174653A1 - Status: Published application - Kind: A1 - Application number: 15/866,524 - Filed: 2018-01-10 - Published: 2019-06-06 - Earliest claimed: 2017-12-06 - Assignees: Auras Technology Co., Ltd. - Applicants: AURAS Technology Co., Ltd. - Inventors: MU-SHU FAN; CHE-CHIA CHANG; CHIEN-CHIH SU - Web page: https://patentgrep.com/patent/US20190174653A1 ## CPC - H05K 7/20263: {Heat dissipaters releasing heat from coolant} - G06F 1/20: Cooling means - H05K 7/20272: {Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds} - H10W 40/47: by flowing liquids, e.g. forced water cooling - G06F 2200/201: Cooling arrangements using cooling fluid - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A liquid-cooling heat dissipating module includes a liquid-cooling radiator, a liquid-cooling head, a liquid pump, a first pipe, a second pipe and a shielding cover. The liquid-cooling radiator, the liquid-cooling head and the liquid pump are in fluid communication with each other through the first pipe, the second pipe and an external pump tube of the liquid pump. The liquid-cooling head is in thermal contact with a heat source. The liquid pump drives a fluid medium to circularly flow within the closed loop. At least a part of the liquid pump is sheltered by the shielding cover. Consequently, at least a portion of a sound generated by the liquid pump is obstructed from outputting to surroundings. ## Claims ### Claim 1 A liquid-cooling heat dissipating module, comprising: a liquid-cooling radiator comprising a radiator main body, a radiator outlet and a radiator inlet; a liquid-cooling head in thermal contact with a heat source, and comprising a head main body, a head outlet and a head inlet; a first pipe, wherein two ends of the first pipe are connected with the head outlet of the liquid-cooling head and the radiator inlet of the liquid-cooling radiator, respectively; a liquid pump comprising a pump main body, a pump outlet, a pump inlet and an external pump tube, wherein two ends of the external pump tube are connected with the pump outlet of the liquid pump and the head inlet of the liquid-cooling head, respectively; a second pipe, wherein two ends of the second pipe are connected with the pump inlet of the liquid pump and the radiator outlet of the liquid-cooling radiator, respectively; and a shielding cover, wherein at least a part of the liquid pump is sheltered by the shielding cover, so that at least a portion of a sound generated by the liquid pump is obstructed from outputting to surroundings, wherein a chamber of the head main body, the first pipe, a chamber of the radiator main body, the second pipe, a chamber of the pump main body and the external pump tube are in fluid communication with each other to define a closed loop, and the shielding cover is isolated from and not in fluid communication with the closed loop. ### Claim 2 (depends on 1) The liquid-cooling heat dissipating module according to claim 1, wherein the shielding cover comprises a cover body and a buffering structure, wherein the buffering structure is filled in a space between the cover body and the liquid pump. ### Claim 3 (depends on 2) The liquid-cooling heat dissipating module according to claim 2, wherein the buffering structure is a sound-absorbing foam structure or a sound-insulating foam structure. ### Claim 4 (depends on 1) The liquid-cooling heat dissipating module according to claim 1, wherein the liquid pump is fixed on the liquid-cooling head. ### Claim 5 (depends on 4) The liquid-cooling heat dissipating module according to claim 4, wherein the shielding cover is fixed on the liquid-cooling head. ### Claim 6 (depends on 5) The liquid-cooling heat dissipating module according to claim 5, wherein an outer periphery of the head main body of the liquid-cooling head comprises at least one locking hole, wherein when the at least a part of the liquid pump is sheltered by the shielding cover, at least one screwing element is penetrated through the at least one locking hole and tightened into the shielding cover, so that the shielding cover is fixed on the liquid-cooling head. ### Claim 7 (depends on 1) The liquid-cooling heat dissipating module according to claim 1, wherein the shielding cover is fixed on an object that is located outside the liquid-cooling heat dissipating module. ### Claim 8 (depends on 7) The liquid-cooling heat dissipating module according to claim 7, wherein the object is an electronic component with the heat source. ### Claim 9 (depends on 7) The liquid-cooling heat dissipating module according to claim 7, wherein an outer periphery of the shielding cover comprises at least one locking hole, wherein when the at least a part of the liquid pump is sheltered by the shielding cover, at least one screwing element is penetrated through the at least one locking hole and tightened into the object, so that the shielding cover is fixed on the object. ### Claim 10 (depends on 1) The liquid-cooling heat dissipating module according to claim 1, wherein the shielding cover comprises a first opening and a second opening, wherein the external pump tube is penetrated through the first opening, and the second pipe is penetrated through the second opening. ### Claim 11 (depends on 10) The liquid-cooling heat dissipating module according to claim 10, wherein the shielding cover further comprises a third opening, and the first pipe is penetrated through the third opening. ### Claim 12 (depends on 1) The liquid-cooling heat dissipating module according to claim 1, wherein the liquid-cooling heat dissipating module further comprises a fan module, and the fan module is located beside the liquid-cooling radiator.