# US 2019/0174639 A1 · Resin multilayer substrate

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- Number: US 2019/0174639 A1
- Document ID: US20190174639A1
- Status: Published application
- Kind: A1
- Application number: 16/270,659
- Filed: 2019-02-08
- Published: 2019-06-06
- Earliest claimed: 2016-08-23
- Assignees: Murata Manufacturing Co., Ltd.
- Applicants: Murata Manufacturing Co., Ltd.
- Inventors: Yoshihito OTSUBO; Asato FUJIMOTO
- Web page: https://patentgrep.com/patent/US20190174639A1

## CPC

- H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)}
- H05K 1/032: {consisting of one material}
- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 1/186: {manufactured by mounting on or connecting to patterned circuits before or during embedding}
- H05K 3/4664: {Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders (H05K3/4647 takes precedence)}
- H05K 3/4697: {having cavities, e.g. for mounting components (H05K3/4691 takes precedence)}
- H05K 1/0284: {Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014)}
- H05K 1/0298: {Multilayer circuits}
- H05K 1/11: Printed elements for providing electric connections to or between printed circuits
- H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence)
- H05K 2201/0129: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
- H05K 2201/0141: Liquid crystal polymer [LCP]
- H05K 2201/09827: Tapered, e.g. tapered hole, via or groove
- H05K 2203/1105: Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A resin multilayer substrate includes a stacked body including resin layers, a component, one or more first conductor patterns, and one or more second conductor patterns each disposed in a gap between the resin layers. At least a portion of an outline of each of the one or more first conductor patterns overlaps with the component. An outline of each of the one or more second conductor patterns does not overlap with the component. A resin portion is adjacent to each of the one or more first conductor patterns along a portion of the outline of each of the one or more first conductor patterns that overlaps with the component. The resin portion is made of a resin paste including thermoplastic resin powder as a main material. The resin portion is not disposed in a portion along the outline of each of the one or more second conductor patterns.

## Claims

### Claim 1

A resin multilayer substrate comprising:
a stacked body including a plurality of resin layers each made of a thermoplastic resin as a main material and stacked on each other;
a component embedded in the stacked body;
one or more first conductor patterns each disposed in a gap between the plurality of resin layers inside the stacked body, the one or more first conductor patterns each including an outline in a view seen in one direction of a stacking direction of the stacked body; and
one or more second conductor patterns each disposed in a gap between the plurality of resin layers inside the stacked body, the one or more second conductor patterns each including an outline in the view seen in the one direction of the stacking direction of the stacked body; wherein
at least a portion of the outline of each of the one or more first conductor patterns overlaps with the component in the view seen in the one direction of the stacking direction of the stacked body;
the outline of each of the one or more second conductor patterns does not overlap with the component in the view seen in the one direction of the stacking direction of the stacked body;
a resin portion is provided adjacent to an outside of each of the one or more first conductor patterns along a portion of the outline of each of the one or more first conductor patterns overlapping with the component;
the resin portion is made of a resin paste including thermoplastic resin powder as a main material;
a liquid component of the resin paste is not substantially present in the resin portion; and
the resin portion is not disposed in a portion along the outline of each of the one or more second conductor patterns.

### Claim 2 (depends on 1)

The resin multilayer substrate according to claim 1, wherein
the thermoplastic resin of each of the plurality of resin layers is a liquid crystal polymer; and
the thermoplastic resin of the resin portion is a liquid crystal polymer.

### Claim 3 (depends on 2)

The resin multilayer substrate according to claim 2,
wherein the liquid crystal polymer of each of the plurality of resin layers and the liquid crystal polymer of the resin portion are made of a same or substantially a same liquid crystal polymer material.

### Claim 4

A resin multilayer substrate comprising:
a stacked body including a plurality of resin layers each made of a thermoplastic resin as a main material and stacked on each other;
a cavity provided in the stacked body so as to be recessed in a stacking direction of the stacked body;
one or more first conductor patterns each disposed in a gap between the plurality of resin layers inside the stacked body and each including an outline in a view seen in one direction of the stacking direction of the stacked body; and
one or more second conductor patterns each disposed in a gap between the plurality of resin layers inside the stacked body and each including an outline in the view seen in the one direction of the stacking direction of the stacked body; wherein
at least a portion of the outline of each of the one or more first conductor patterns overlaps with the cavity in the view seen in the one direction of the stacking direction of the stacked body;
the outline of each of the one or more second conductor patterns does not overlap with the cavity in the view seen in the one direction of the stacking direction of the stacked body;
a resin portion is provided adjacent to an outside of each of the one or more first conductor patterns along a portion of the outline of each of the one or more first conductor patterns that overlaps with the cavity;
the resin portion is made of a resin paste including thermoplastic resin powder as a main material;
a liquid component of the resin paste is not substantially present in the resin portion; and
the resin portion is not disposed in a portion along the outline of each of the one or more second conductor patterns.

### Claim 5 (depends on 4)

The resin multilayer substrate according to claim 4, wherein
the thermoplastic resin of each of the plurality of resin layers is a liquid crystal polymer; and
the thermoplastic resin of the resin portion is a liquid crystal polymer.

### Claim 6 (depends on 5)

The resin multilayer substrate according to claim 5, wherein the liquid crystal polymer of each of the plurality of resin layers and the liquid crystal polymer of the resin portion are made of a same or substantially a same liquid crystal polymer material.

### Claim 7

A resin multilayer substrate comprising:
a stacked body including a plurality of resin layers each made of a thermoplastic resin as a main material and stacked on each other;
a first conductive foil embedded in the stacked body;
one or more first conductor patterns each disposed in a gap between the plurality of resin layers inside the stacked body and each including an outline in a view seen in one direction of a stacking direction of the stacked body; and
one or more second conductor patterns each disposed in a gap between the plurality of resin layers inside the stacked body and each including an outline in the view seen in the one direction of the stacking direction of the stacked body; wherein
the first conductive foil is thicker than each of the one or more first conductor patterns and each of the one or more second conductor patterns;
at least a portion of the outline of each of the one or more first conductor patterns overlaps with the first conductive foil in the view seen in the one direction of the stacking direction of the stacked body;
the outline of each of the one or more second conductor patterns does not overlap with the first conductive foil in the view seen in the one direction of the stacking direction of the stacked body;
a resin portion is provided adjacent to an outside of each of the one or more first conductor patterns along a portion of the outline of each of the one or more first conductor patterns that overlaps with the first conductive foil;
the resin portion is made of a resin paste including thermoplastic resin powder as a main material;
a liquid component of the resin paste is not substantially present in the resin portion; and
the resin portion is not disposed in a portion along the outline of each of the one or more second conductor patterns.

### Claim 8 (depends on 7)

The resin multilayer substrate according to claim 7, wherein
the thermoplastic resin of each of the plurality of resin layers is a liquid crystal polymer; and
the thermoplastic resin of the resin portion is a liquid crystal polymer.

### Claim 9 (depends on 8)

The resin multilayer substrate according to claim 8, wherein the liquid crystal polymer of each of the plurality of resin layers and the liquid crystal polymer of the resin portion are made of a same or substantially a same liquid crystal polymer material.

### Claim 10

A resin multilayer substrate comprising:
a stacked body including a plurality of resin layers each made of a thermoplastic resin as a main material and stacked on each other;
a component embedded in the stacked body;
one or more conductor-via first joint portions each corresponding to a first joining portion between first conductor vias each penetrating through one of the plurality of resin layers inside the stacked body such that the first conductor vias are continuous to each other in a stacking direction of the stacked body, the one or more conductor-via first joint portions each including an outline of a first joining surface in a view seen in one direction of the stacking direction of the stacked body; and
one or more conductor-via second joint portions each corresponding to a second joining portion between second conductor vias each penetrating through one of the plurality of resin layers inside the stacked body such that the second conductor vias are continuous to each other in the stacking direction of the stacked body, the one or more conductor-via second joint portions each including an outline of a second joining surface in the view seen in the one direction of the stacking direction of the stacked body; wherein
at least a portion of the outline of each of the one or more conductor-via first joint portions overlaps with the component in the view seen in the one direction of the stacking direction of the stacked body;
the outline of each of the one or more conductor-via second joint portions does not overlap with the component in the view seen in the one direction of the stacking direction of the stacked body;
a resin portion is provided adjacent to an outside of each of the one or more conductor-via first joint portions along a portion of the outline of each of the one or more conductor-via first joint portions that overlaps with the component;
the resin portion is made of a resin paste including thermoplastic resin powder as a main material;
a liquid component of the resin paste is not substantially present in the resin portion; and
the resin portion is not disposed in a portion along the outline of each of the one or more conductor-via second joint portions.

### Claim 11 (depends on 10)

The resin multilayer substrate according to claim 10, wherein
the thermoplastic resin of each of the plurality of resin layers is a liquid crystal polymer; and
the thermoplastic resin of the resin portion is a liquid crystal polymer.

### Claim 12 (depends on 11)

The resin multilayer substrate according to claim 11, wherein the liquid crystal polymer of each of the plurality of resin layers and the liquid crystal polymer of the resin portion are made of a same or substantially a same liquid crystal polymer material.

### Claim 13

A resin multilayer substrate comprising:
a stacked body including a plurality of resin layers each made of a thermoplastic resin as a main material and stacked on each other;
a cavity provided in the stacked body so as to be recessed in a stacking direction of the stacked body;
one or more conductor-via first joint portions each corresponding to a first joining portion between first conductor vias each penetrating through one of the plurality of resin layers inside the stacked body such that the first conductor vias are continuous to each other in the stacking direction of the stacked body, the one or more conductor-via first joint portions each including an outline of a first joining surface in a view seen in one direction of the stacking direction of the stacked body; and
one or more conductor-via second joint portions each corresponding to a second joining portion between second conductor vias each penetrating through one of the plurality of resin layers inside the stacked body such that the second conductor vias are continuous to each other in the stacking direction of the stacked body, the one or more conductor-via second joint portions each including an outline of a second joining surface in the view seen in the one direction of the stacking direction of the stacked body; wherein
at least a portion of the outline of each of the one or more conductor-via first joint portions overlaps with the cavity in the view seen in the one direction of the stacking direction of the stacked body;
the outline of each of the one or more conductor-via second joint portions does not overlap with the cavity in the view seen in the one direction of the stacking direction of the stacked body;
a resin portion is provided adjacent to an outside of each of the one or more conductor-via first joint portions along a part of the outline of each of the one or more conductor-via first joint portions that overlaps with the cavity;
the resin portion is made of a resin paste including thermoplastic resin powder as a main material;
a liquid component of the resin paste is not substantially present in the resin portion; and
the resin portion is not disposed in a portion along the outline of each of the one or more conductor-via second joint portions.

### Claim 14 (depends on 13)

The resin multilayer substrate according to claim 13, wherein
the thermoplastic resin of each of the plurality of resin layers is a liquid crystal polymer; and
the thermoplastic resin of the resin portion is a liquid crystal polymer.

### Claim 15 (depends on 14)

The resin multilayer substrate according to claim 14, wherein the liquid crystal polymer of each of the plurality of resin layers and the liquid crystal polymer of the resin portion are made of a same or substantially a same liquid crystal polymer material.

### Claim 16

A resin multilayer substrate comprising:
a stacked body including a plurality of resin layers each made of a thermoplastic resin as a main material and stacked on each other;
a first conductive foil embedded in the stacked body;
one or more conductor-via first joint portions each corresponding to a first joining portion between first conductor vias each penetrating through one of the plurality of resin layers inside the stacked body such that the first conductor vias are continuous to each other in a stacking direction of the stacked body, the one or more conductor-via first joint portions each including an outline of a first joining surface in a view seen in one direction of the stacking direction of the stacked body; and
one or more conductor-via second joint portions each corresponding to a second joining portion between second conductor vias each penetrating through one of the plurality of resin layers inside the stacked body such that the first conductor vias are continuous to each other in the stacking direction of the stacked body, the one or more conductor-via second joint portions each including an outline of a second joining surface in the view seen in the one direction of the stacking direction of the stacked body; wherein
the first conductive foil is thicker than each of other conductive foils disposed inside the stacked body;
at least a portion of the outline of each of the one or more conductor-via first joint portions overlaps with the first conductive foil in the view seen in the one direction of the stacking direction of the stacked body;
the outline of each of the one or more conductor-via second joint portions does not overlap with the first conductive foil in the view seen in the one direction of the stacking direction of the stacked body;
a resin portion is provided adjacent to an outside of each of the one or more conductor-via first joint portions along a portion of the outline of each of the one or more conductor-via first joint portions that overlaps with the first conductive foil;
the resin portion is made of a resin paste including thermoplastic resin powder as a main material;
a liquid component of the resin paste is not substantially present in the resin portion; and
the resin portion is not disposed in a portion along the outline of each of the one or more conductor-via second joint portions.

### Claim 17 (depends on 16)

The resin multilayer substrate according to claim 16, wherein
the thermoplastic resin of each of the plurality of resin layers is a liquid crystal polymer; and
the thermoplastic resin of the resin portion is a liquid crystal polymer.

### Claim 18 (depends on 17)

The resin multilayer substrate according to claim 17, wherein the liquid crystal polymer of each of the plurality of resin layers and the liquid crystal polymer of the resin portion are made of a same or substantially a same liquid crystal polymer material.