# US 2019/0174637 A1 · Method of manufacturing a polymer printed circuit board

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- Number: US 2019/0174637 A1
- Document ID: US20190174637A1
- Status: Published application
- Kind: A1
- Application number: 16/265,956
- Filed: 2019-02-01
- Published: 2019-06-06
- Earliest claimed: 2017-01-10
- Assignees: Bgt Materials Limited
- Applicants: BGT Materials limited
- Inventors: Kuo-Hsin CHANG; Jia-Cing CHEN; We-Jei KE; Jingyu ZHANG; Chung-Ping LAI
- Web page: https://patentgrep.com/patent/US20190174637A1

## CPC

- H05K 3/388: {by the use of a metallic or inorganic thin film adhesion layer}
- H05K 3/381: {by special treatment of the substrate}
- H05K 1/0346: {containing N}
- H05K 3/16: by cathodic sputtering
- H05K 3/182: {characterised by the patterning method}
- H05K 3/188: {by direct electroplating}
- H05K 2201/0154: Polyimide
- H05K 2201/0257: Nanoparticles
- H05K 2201/0323: Carbon
- H05K 2203/107: Using laser light
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A method of manufacturing a polymer printed circuit board contains steps of: A. providing a material layer consisting of polymer; B. forming circuit pattern on the material layer; C. depositing metal nanoparticles on the LIG of the circuit pattern so as to use as a metal seed; D. pressing the circuit pattern; and E. forming a metal layer on the LIG of the circuit pattern. In the step of B, the circuit pattern includes laser induced graphene, and the laser induced graphene is porous. Thereby, the circuit pattern is adhered on the material layer securely and has outstanding electric conductivity after being pressed in the step D.

## Claims

### Claim 1

A method of manufacturing a polymer printed circuit board comprising steps of:
A. providing a material layer consisting of polymer;
B. forming circuit pattern on the material layer, wherein the circuit pattern is comprised of laser induced graphene, and the laser induced graphene is porous;
C. depositing metal nanoparticles on the LIG of the circuit pattern so as to use as a metal seed;
D. forming a metal layer on the LIG of the circuit pattern; and
E. pressing the circuit pattern.

### Claim 2 (depends on 1)

The method as claimed in claim 1, wherein the material layer is a polymer film or a substrate on which the polymer is coated.

### Claim 3 (depends on 1)

The method as claimed in claim 1, wherein the polymer is selected from the group of polyimide (PI) and polyetherimide (PEI).

### Claim 4 (depends on 1)

The method as claimed in claim 1, wherein the LIG is formed on the material layer in a laser induction reacting process which is controlled by a computer.

### Claim 5 (depends on 4)

The method as claimed in claim 4, wherein a predetermined area of the material layer is irradiated by laser beams in the laser induction reacting process, and a temperature of the predetermined area of the material layer rises up to at least 1500° C.

### Claim 6 (depends on 1)

The method as claimed in claim 1, wherein the metal seed is selected from the group of platinum, gold, palladium, silver, copper, nickel, and zinc.

### Claim 7 (depends on 1)

The method as claimed in claim 1, wherein in the step E, the circuit pattern is pressed in a rolling manner or in a laminating manner.

### Claim 8 (depends on 7)

The method as claimed in claim 7, wherein the circuit pattern is pressed and is heated within a room temperature to a temperature of 500° C.

### Claim 9 (depends on 1)

The method as claimed in claim 1, wherein the metal layer is formed on the LIG of the circuit pattern in any one of electroplating, electroless plating, and sputtering manners.