# US 2019/0174636 A1 · Fully encapsulated electronics and printed circuit boards

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- Number: US 2019/0174636 A1
- Document ID: US20190174636A1
- Status: Published application
- Kind: A1
- Application number: 16/270,721
- Filed: 2019-02-08
- Published: 2019-06-06
- Earliest claimed: 2017-05-18
- Assignees: Covidien LP
- Applicants: Covidien LP
- Inventors: Anthony Sgroi, JR.; Patrick Mozdzierz; Stephen Paul; David Valentine; Scott Firth
- Web page: https://patentgrep.com/patent/US20190174636A1

## CPC

- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- A61B 17/07207: {the staples being applied sequentially}
- A61B 17/1155: {Circular staplers comprising a plurality of staples}
- B29C 45/14549: {Coating rod-like, wire-like or belt-like articles (B29C45/14426 takes precedence)}
- B29C 45/14639: {for obtaining an insulating effect, e.g. for electrical components}
- B29C 45/14836: {Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage (B29C45/14434 takes precedence)}
- H01R 12/62: connecting to rigid printed circuits or like structures
- H05K 1/0281: {Reinforcement details thereof}
- H05K 5/0026: {provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units}
- H05K 5/062: {sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ}
- A61B 2017/00017: {Electrical control of surgical instruments}
- A61B 2017/00398: {using powered actuators, e.g. stepper motors, solenoids}
- A61B 2017/0046: {with a releasable handle; with handle and operating part separable}
- A61B 2017/00473: {Distal part, e.g. tip or head (A61B2017/00464 takes precedence)}
- A61B 2017/00526: {Methods of manufacturing}
- A61B 2017/00734: {battery operated}
- A61B 2090/064: {for measuring force, pressure or mechanical tension}
- A61B 2090/0813: {Accessories designed for easy sterilising, i.e. re-usable}
- B29C 45/14065: {Positioning or centering articles in the mould}
- B29C 2045/14844: {Layers protecting the insert from injected material}
- B29L 2031/3481: {Housings or casings incorporating or embedding electric or electronic elements}
- H05K 2203/1316: Moulded encapsulation of mounted components
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D)
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES

## Abstract

A method of encapsulating and hermetically sealing a printed circuit board of a flex cable includes: positioning a printed circuit board portion of a flex cable into a channel defined in a first mold half of a mold, the printed circuit board portion including a substrate and electronic components mounted on the substrate; mounting a second mold half onto the first mold half to enclose the channel of the first mold half and form a cavity within the mold; and filling the cavity of the mold with an encapsulation material through an inlet opening defined through the mold.

## Claims

### Claim 1

A method of encapsulating and hermetically sealing a printed circuit board of a flex cable, the method comprising:
positioning a printed circuit board portion of a flex cable into a channel defined in a first mold half of a mold, the printed circuit board portion including a substrate and electronic components mounted on the substrate;
mounting a second mold half onto the first mold half to enclose the channel of the first mold half and form a cavity within the mold; and
filling the cavity of the mold with an encapsulation material through an inlet opening defined through the mold.

### Claim 2 (depends on 1)

The method according to claim 1, further comprising positioning arm portions of the flex cable in grooves defined in the first mold half, the grooves extending from opposed sides of the channel.

### Claim 3 (depends on 2)

The method according to claim 2, wherein mounting the second mold half onto the first mold half further includes retaining the arm portions under tension between the first and second mold halves such that the printed circuit board portion of the flex cable is disposed in spaced relation relative to inner surfaces of the first and second mold halves defining the cavity of the mold.

### Claim 4 (depends on 3)

The method according to claim 3, wherein filling the cavity of the mold further includes completely covering the printed circuit board portion of the flex cable with the encapsulation material.

### Claim 5 (depends on 1)

The method according to claim 1, wherein filling the cavity of the mold further includes filling the cavity until the encapsulation material vents through an outlet opening defined through the mold.

### Claim 6 (depends on 1)

The method according to claim 1, further comprising:
opening the mold after the encapsulation material has solidified within the cavity; and
removing the flex cable from the mold.

### Claim 7 (depends on 1)

The method according to claim 1, further comprising curing the encapsulation material within the cavity of the mold under vacuum.

### Claim 8 (depends on 6)

The method according to claim 6, further comprising clamping outer edges of the encapsulation material to enhance the bond between the encapsulation material and the flex cable.

### Claim 9 (depends on 1)

The method according to claim 1, further comprising attaching a rigidizing layer to the substrate of the printed circuit board portion of the flex cable prior to positioning the printed circuit board portion into the channel of the first mold half.

### Claim 10

A method of encapsulating and hermetically sealing electronic components of a flex cable assembly and integrating the flex cable assembly into a surgical device, comprising:
positioning a printed circuit board portion of a flex cable assembly into a channel defined in a first housing half of an encapsulation housing, the printed circuit board portion including a substrate of a first flex cable of the flex cable assembly and electronic components mounted on the substrate;
mounting a second housing half onto the first housing half to enclose the channel of the first housing half and form a cavity within the encapsulation housing; and
filling the cavity of the encapsulation housing with an encapsulation material through an inlet opening defined through the encapsulation housing.

### Claim 11 (depends on 10)

The method according to claim 10, further comprising positioning arm portions of the flex cable through cut-outs defined in side surfaces of the first housing half of the encapsulation housing.

### Claim 12 (depends on 10)

The method according to claim 10, wherein the printed circuit board portion of the flex cable assembly is disposed in spaced relation relative to the inner surfaces of the first and second housing halves defining the cavity of the encapsulation housing and filling the cavity of the encapsulation housing further includes completely covering the printed circuit board portion of the flex cable assembly with the encapsulation material.

### Claim 13 (depends on 12)

The method according to claim 12, wherein the inner surface of the first housing half includes standoffs disposed thereon to maintain space between the printed circuit board portion of the flex cable assembly and the inner surface of the first housing half, and positioning the printed circuit board portion into the channel further includes positioning the printed circuit board portion on top of the standoffs.

### Claim 14 (depends on 10)

The method according to claim 10, wherein filling the cavity of the encapsulation housing further includes filling the cavity until the encapsulation material vents through an outlet opening defined through the encapsulation housing.

### Claim 15 (depends on 14)

The method according to claim 14, further comprising orienting the encapsulation housing so that the inlet opening is lower than the outlet opening prior to filling the cavity with the encapsulation material.

### Claim 16 (depends on 10)

The method according to claim 10, further comprising curing the encapsulation material within the encapsulation housing and attaching the encapsulation housing to a component disposed within a surgical device.

### Claim 17 (depends on 16)

The method according to claim 16, wherein attaching the encapsulation housing to the component further includes placing the flex cable assembly and the encapsulation housing into an adapter assembly of the surgical device.

### Claim 18 (depends on 10)

The method according to claim 10, further comprising:
connecting an electrical contact region of a second flex cable of the flex cable assembly to a rigid printed circuit board;
positioning a second encapsulation housing over the rigid printed circuit board such that electronic components of the rigid printed circuit board and the electrical contact region of the second flex cable are disposed within a cavity defined between the encapsulation housing and the rigid printed circuit board; and
filling the cavity with an encapsulation material through an inlet opening defined through the second encapsulation housing.

### Claim 19 (depends on 18)

The method according to claim 18, further comprising curing the encapsulation material within the second encapsulation housing and attaching the second encapsulation housing to a component disposed within a surgical device.