# US 2019/0174630 A1 · Burned-in Component Assembly

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- Number: US 2019/0174630 A1
- Document ID: US20190174630A1
- Status: Published application
- Kind: A1
- Application number: 15/889,003
- Filed: 2018-02-05
- Published: 2019-06-06
- Earliest claimed: 2007-05-08
- Assignees: VNS Portfolio LLC
- Applicants: VNS Portfolio LLC
- Inventors: Joseph Charles Fjelstad
- Web page: https://patentgrep.com/patent/US20190174630A1

## CPC

- H05K 1/189: characterised by the use of flexible or folded printed circuits
- B32B 37/153: {at least one layer is extruded and immediately laminated while in semi-molten state}
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H10W 72/0198: {batch processes}
- H10W 72/30: Die-attach connectors
- H10W 90/00: Package configurations
- B32B 37/12: characterised by using adhesives
- B32B 2307/202: Conductive
- B32B 2457/08: PCBs, i.e. printed circuit boards
- B32B 2519/02: RFID tags
- H05K 3/007: {Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence)}
- H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB]
- H05K 2201/10719: Land grid array [LGA]
- H05K 2203/0156: Temporary polymeric carrier or foil, e.g. for processing or transferring
- H05K 2203/0173: Template for holding a PCB having mounted components thereon
- H05K 2203/1469: Circuit made after mounting or encapsulation of the components
- H10W 70/681: {comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage}
- H10W 70/682: {comprising holes having chips therein}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07304: {the auxiliary member being temporary, e.g. a sacrificial coating}
- H10W 72/07331: {Connecting techniques}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/351: {Materials of die-attach connectors}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/354: {comprising polymers}
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/931: {Shapes of bond pads}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A component support fixture having a plurality of oversized compartments of the same size mounted on a top surface of an anisotropic adhesive film such that each of a plurality of burned-in components of different heights and widths are accommodated within a compartment. Patterned traces are formed on the bottom surface of the anisotropic film. The leads of the burned-in components are in electrically communication with those traces through the anisotropic film.

## Claims

### Claim 1

An apparatus comprising;
an anisotropic adhesive film having a top surface and a bottom surface;
at least one patterned trace formed on said bottom surface;
a plurality of burned-in components of different heights and widths within a size range, each of said plurality of burned-in components further having a bottom side and at least one lead formed on said bottom side;
wherein each of said plurality of burned-in components is mounted on the top surface of said adhesive film; and
further wherein said at least one lead each of said plurality of burned-in components is in contact with said top surface; and
a component support fixture having a plurality of oversized compartments of the same size mounted on said top side of said adhesive film such that each of said plurality of burned-in components is accommodated within a compartment of said plurality of oversized compartments.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein said burned-in components are covered on all sides but said bottom side with an insulating material.

### Claim 3 (depends on 2)

The apparatus of claim 2, wherein each compartment has a vent hole.