# US 2019/0174625 A1 · Light-Emitting Device And Method For Manufacturing Same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0174625 A1 - Document ID: US20190174625A1 - Status: Published application - Kind: A1 - Application number: 16/321,324 - Filed: 2017-07-28 - Published: 2019-06-06 - Earliest claimed: 2016-07-28 - Assignees: Linxens Holding - Applicants: Linxens Holding - Inventors: Eric EYMARD; Christophe MATHIEU; Jerome DESCHAMPS - Web page: https://patentgrep.com/patent/US20190174625A1 ## CPC - H05K 1/0296: {Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18)} - F21S 4/20: with light sources held by or within elongate supports - F21S 4/22: flexible or deformable, e.g. into a curved shape - F21S 4/24: of ribbon or tape form, e.g. LED tapes - F21S 4/26: of rope form, e.g. LED lighting ropes, or of tubular form - F21V 19/0025: {the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections} - F21V 21/002: making direct electrical contact, e.g. by piercing (F21V21/35 takes precedence) - F21V 21/35: with direct electrical contact between the supporting element and electric conductors running along the guiding element - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)} - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/181: associated with surface mounted components - H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs - H05K 3/103: {by bonding or embedding conductive wires or strips} - H05K 3/328: by welding - H05K 2201/0129: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer - H05K 2201/10106: Light emitting diode [LED] - H05K 2201/10287: Metal wires as connectors or conductors - H05K 2203/0285: Using ultrasound, e.g. for cleaning, soldering or wet treatment - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F21S: NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR ## Abstract A light radiation emitting device including at least one LED-type device capable of generating a light radiation in a predefined wavelength range and having two electrical contact pads, and a support delimited by first and second opposite sides defining together a thickness of the support, the support supporting at least one LED luminous device and at least one conductive electric track. The electric track is formed of conductive wires. All or part of the conductive wires are bonded to the support along all or part of their length. All or part of the conductive wires have at least one contact portion exposed towards at least one of the first and second sides of the support. Each of the contact pads of the LED-type device is positioned opposite a contact portion of one of the conductive wires and is electrically connected to the contact portion. ## Claims ### Claim 1 A light radiation emitting device, comprising: at least one LED-type device capable of generating a light radiation in a predefined wavelength range and comprising at least two electrical contact pads; a support delimited by opposite first and second sides defining together a thickness of the support, said support supporting at least said LED-type device and at least one electrically-conductive track; characterized: in that the electric track is formed of conductive wires, all or part of the conductive wires being bonded to the support along all or part of their length, all or part of the conductive wires having at least one contact portion exposed towards at least one of the first and second sides of the support; in that each of the contact pads of the LED-type device is positioned opposite a contact portion of one of the conductive wires and is electrically connected to said contact portion. ### Claim 2 (depends on 1) The device of claim 1, characterized in that the support has at least one area deformable in at least one deformation direction and wherein a portion of at least one of said conductive wires is positioned according to a pattern authorizing the deformation of said deformable area and of the conductive track in said deformation direction, with no breakage of the conductive wires. ### Claim 3 (depends on 2) The device of claim 2, characterized in that the LED-type device is formed of a substrate comprising at least one reception structure and at least one pair of connection structures, the reception structure receiving at least one LED chip or module, each connection structure being formed of at least a first portion forming one block with a second portion, said first portion being electrically coupled to one of the electrodes of the LED chip or module, and the second portion forming one of said contact pads connected to one of the contact portions of one of the conductive wires of the conductive track. ### Claim 4 (depends on 1) The device of claim 1, characterized in that the LED-type device is a LED module comprising at least one LED chip arranged on a substrate and encapsulated in an encapsulation body, or at least one packaged LED, the two contact pads being positioned on the substrate and being electrically coupled to the electrodes of the LED chip. ### Claim 5 (depends on 1) The device of claim 1, characterized in that the LED-type device is a LED chip or at least one packaged LED, integrating at least two electrodes forming said contact pads, each of the electrodes being electrically connected to one of the contact portions of the conductive wires. ### Claim 6 (depends on 1) The device of claim 1, characterized: in that each conductive wire is embedded within the thickness of the support from an embedment surface formed by the first or the second side of the support; in that the contact portions of each conductive wire are available to be electrically connected. ### Claim 7 (depends on 6) The device of claim 6, characterized in that the support is provided with at least one housing open on at least one of the sides of the support, said housing comprising at least said LED-type device and at least the contact portions to which said LED-type device is connected. ### Claim 8 (depends on 1) The device of claim 1, characterized in that the support is formed of two substrates enclosing the conductive wires, and in that at least one of the two substrates comprises at least one recess authorizing said exposure of the contact portions, said LED device being positioned inside of said recess. ### Claim 9 (depends on 1) The device of claim 1, characterized in that the conductive wires are laid on one of the first and/or second surfaces of the support and are bonded to said surface along all or part of their length. ### Claim 10 (depends on 1) The device of claim 1, characterized in that the conductive track comprises at least one resistor and/or one heat sink formed by at least one of the conductive wires. ### Claim 11 (depends on 1) The device of claim 1, characterized in that each conductive wire is covered with an insulating sheath, the contact portions connected to the contact pads of the LED luminous device or to the electrodes of the LED chip, having no insulating sheath. ### Claim 12 (depends on 1) The device of claim 1, characterized in that it comprises a keying system configured to allow a correct positioning of the LED-type devices on the support. ### Claim 13 (depends on 1) A mechanical part integrating at least one light radiation emitting device of claim 1. ### Claim 14 (depends on 1) A method of manufacturing the light-emitting device of claim 1, characterized in that it comprises: forming at least one conductive track by bonding conductive tracks to a support along all or part of their length and according to an interconnection pattern, the support being delimited by first and second opposite sides defining together a thickness of the support, all or part of the conductive wires having at least one contact portion exposed towards at least one of the first and second sides of the support; assembling and connecting to the conductive track at least one LED-type device capable of generating a light radiation in a predefined wavelength range and comprising two electrical contact pads, each of the contact pads of the LED-type device being placed opposite a contact portion of one of the conductive wires and being electrically connected to said contact portion. ### Claim 15 (depends on 14) The manufacturing method of claim 14, characterized in that the forming of the conductive track comprises forming on the support an area deformable in at least one deformation direction and wherein a portion of at least one of said conductive wires is positioned according to a pattern authorizing the deformation of said deformable area and of the conductive track in said deformation direction with no breakage of the conductive wires. ### Claim 16 (depends on 14) The manufacturing method of claim 14, characterized in that the fastening of the conductive wires to the support is obtained by embedding the conductive wires within the support thickness from one of the first and second sides of the support. ### Claim 17 (depends on 14) The manufacturing method of claim 14, characterized in that the bonding of the conductive wires is obtained by gluing or lamination of the conductive wires or of the conductive track on one of the first and second sides of the support.