# US 2019/0174584 A1 · Solder reflow apparatus and method of manufacturing an electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0174584 A1 - Document ID: US20190174584A1 - Status: Published application - Kind: A1 - Application number: 16/138,120 - Filed: 2018-09-21 - Published: 2019-06-06 - Earliest claimed: 2017-12-06 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Sin-Yeob LEE; Dong-Woo SHIN; Hyun-Seok CHOI - Web page: https://patentgrep.com/patent/US20190174584A1 ## CPC - H05B 6/6447: {Method of operation or details of the microwave heating apparatus related to the use of detectors or sensors} - H05B 6/80: Apparatus for specific applications (stoves or ranges F24C7/02) - H10P 34/40: with high-energy radiation - H10P 72/0436: {mainly by radiation} - H10P 95/90: Thermal treatments, e.g. annealing or sintering - H10W 90/00: Package configurations - H10W 72/012: {of bump connectors, dummy bumps or thermal bumps} - H10W 72/016: {of strap connectors} - H10W 72/0711: {Apparatus therefor} - H10W 72/07125: {Means for controlling the bonding environment, e.g. valves or vacuum pumps} - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - H10W 72/07152: {Means for cooling} - H10W 72/072: {of bump connectors} - H10W 72/07211: {Treating the bond pad before connecting, e.g. by applying flux or cleaning} - H10W 72/07235: {Applying EM radiation, e.g. induction heating or using a laser} - H10W 72/07236: {Soldering or alloying} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract In a method of manufacturing an electronic device, a solder paste is coated on a substrate pad of a substrate. An electronic product is disposed on the substrate such that a solder on an input/output pad of the electronic product makes contact with the solder paste. A first microwave is generated toward the solder paste during a reflow stage to heat the solder paste. A phase of the first microwave is changed during the reflow stage. Heating of the solder paste causes the solder to reflow, thereby forming a solder bump between the substrate pad and the input/output pad. ## Claims ### Claim 1 A method of manufacturing an electronic device, comprising: coating a solder paste on a substrate pad of a substrate; disposing an electronic product on the substrate such that a solder on an input/output pad of the electronic product makes contact with the solder paste; generating a first microwave toward the solder paste during a reflow stage to heat the solder paste; and changing a phase of the first microwave during the reflow stage, wherein heating of the solder paste causes the solder to reflow, thereby forming a solder bump between the substrate pad and the input/output pad. ### Claim 2 (depends on 1) The method of claim 1, wherein the first microwave has a predetermined frequency. ### Claim 3 (depends on 1) The method of claim 1, wherein the first microwave has a predetermined power. ### Claim 4 (depends on 1) The method of claim 1, wherein changing the phase of the first microwave comprises shifting the phase continuously or in stages at a predetermined phase shift value per unit time. ### Claim 5 (depends on 4) The method of claim 4, wherein the predetermined phase shift value per unit time is at least π/3 rad/s. ### Claim 6 (depends on 1) The method of claim 1, wherein the first microwave has a first power to heat the solder paste to a first temperature, and prior to generating the first microwave the method further comprises: generating a second microwave having a second power to pre-heat the solder paste to a second temperature; and generating a third microwave having a third power greater than the second power to pre-heat the solder paste to a third temperature greater than the second temperature, wherein the first power is greater than the third power and the first temperature is greater than the third temperature. ### Claim 7 (depends on 6) The method of claim 6, wherein generating the second microwave having the second power comprises heating the solder paste within a first heating chamber, and generating the third microwave having the third power comprises heating the solder paste within a second heating chamber. ### Claim 8 (depends on 7) The method of claim 7, wherein generating the first microwave having the first power comprises heating the solder paste within a third heating chamber. ### Claim 9 (depends on 1) The method of claim 1, further comprising moving the substrate in a first direction while generating the first microwave. ### Claim 10 (depends on 1) The method of claim 1, wherein the electronic product comprises a semiconductor chip or a semiconductor package, and the substrate comprises a module substrate or a package substrate. ### Claim 11 A method of manufacturing an electronic device, comprising: printing a solder paste on a plurality of substrate pads of a substrate; forming solders on input/output pads of an electronic product respectively; disposing the electronic product on the substrate such that the solders are interposed between the input/output pad and the solder paste; generating a first microwave toward the solder paste during a reflow stage to heat the solder paste; and changing a phase of the first microwave during the reflow stage, wherein heating of the solder paste causes the solders to reflow, thereby forming a solder bump between the corresponding substrate pad and the input/output pad. ### Claim 12 (depends on 11) The method of claim 11, wherein changing the phase of the first microwave comprises shifting the phase continuously or in stages at a predetermined phase shift value per unit time. ### Claim 13 (depends on 11) The method of claim 11, wherein the first microwave has a first power to heat the solder paste to a first temperature, and prior to generating the first microwave the method further comprises: generating a second microwave having a second power to pre-heat the solder paste to a second temperature; and generating a third microwave having a third power greater than the second power to pre-heat the solder paste to a third temperature greater than the second temperature, wherein the first power is greater than the third power and the first temperature is greater than the third temperature. ### Claim 14 (depends on 13) The method of claim 13, wherein generating the second microwave having the second power comprises heating the solder paste within a first heating chamber, and generating the third microwave having the third power comprises heating the solder paste within a second heating chamber. ### Claim 15 (depends on 11) The method of claim 11, further comprising moving the substrate in a first direction while generating the first microwave. ### Claim 16 A method of manufacturing an electronic device, comprising: coating a solder paste on a substrate pad of a substrate; disposing an electronic product on the substrate such that a solder on an input/output pad of the electronic product makes contact with the solder paste; generating a first microwave toward the solder paste during a preheat stage to pre-heat the solder paste; generating a second microwave toward the solder paste during a reflow stage to heat the solder paste; and changing a phase of the second microwave during the reflow stage, wherein heating of the solder paste during the reflow stage causes the solder to reflow, thereby forming a solder bump between the substrate pad and the input/output pad. ### Claim 17 (depends on 16) The method of claim 16, wherein changing the phase of the second microwave comprises shifting the phase of the second microwave continuously or in stages at a predetermined phase shift value per unit time. ### Claim 18 (depends on 16) The method of claim 16, wherein the first microwave has a first power to pre-heat the solder paste to a first temperature, and wherein the second microwave has a second power greater than the first power to heat the solder paste to a second temperature greater than the first temperature. ### Claim 19 (depends on 18) The method of claim 18, further comprising: prior to generating the first microwave, generating a third microwave toward the solder paste during the preheat stage to pre-heat the solder paste, wherein the third microwave has a third power lower than the first power to pre-heat the solder paste to third temperature lower than the first temperature. ### Claim 20 (depends on 16) The method of claim 16, further comprising moving the substrate in a first direction while generating the first and second microwaves.