# US 2019/0174580 A1 · Infrared panel radiator and process for production of the infrared panel radiator

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- Number: US 2019/0174580 A1
- Document ID: US20190174580A1
- Status: Published application
- Kind: A1
- Application number: 16/320,752
- Filed: 2017-07-05
- Published: 2019-06-06
- Earliest claimed: 2016-07-27
- Assignees: Heraeus Noblelight GmbH
- Applicants: Heraeus Noblelight GmbH
- Inventors: Lotta GAAB; Thomas PIELA; Christoph STERNKIKER; Jürgen WEBER
- Web page: https://patentgrep.com/patent/US20190174580A1

## CPC

- H05B 3/26: heating conductor mounted on insulating base {(for transparent areas H05B3/84, H05B3/86)}
- H05B 3/12: characterised by the composition or nature of the conductive material
- H05B 3/22: non-flexible
- H05B 2203/004: using zigzag layout
- H05B 2203/005: using multiple resistive elements or resistive zones isolated from each other
- H05B 2203/013: Heaters using resistive films or coatings
- H05B 2203/017: Manufacturing methods or apparatus for heaters
- H05B 2203/032: Heaters specially adapted for heating by radiation heating
- H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL

## Abstract

An infrared panel radiator includes a substrate made of an electrically insulating material. A printed conductor is applied to a surface to the substrate. The printed conductor is made of an electrically conductive resistor material that generates heat when current flows through it. A process for producing the infrared panel radiator includes: (a) providing the substrate; and (b) applying the printed conductor to a surface of the substrate. To produce an infrared radiator that features homogeneous radiation emission at high radiation power per unit area, the substrate is manufactured from a composite material including an amorphous matrix component and an additional component in the form of a semiconductor material. The printed conductor is provided as a form part with a fixed geometric shape. The printed conductor is applied to the surface of the substrate such that the printed conductor and the substrate are permanently connected to each other.

## Claims

### Claim 1

A method of producing an infrared panel radiator, the method comprising the steps:
(a) providing a substrate made of an electrically insulating material; and
(b) applying a printed conductor to a surface of the substrate, the printed conductor being made of a resistor material that is electrically conductive and generates heat when current flows through the resistor material,
wherein, during step (a), the substrate is provided to be manufactured from a composite material that includes an amorphous matrix component and an additional component in the form of a semiconductor material, and during step (b) the printed conductor is provided as a form part, which is applied appropriately to the surface of the substrate such that the printed conductor and the substrate are permanently connected to each other.

### Claim 2 (depends on 1)

The method of claim 1 wherein during step (b) the printed conductor and the substrate are connected by at least one of mechanical joining, gluing, and welding.

### Claim 3 (depends on 1)

The method of claim 1 wherein the printed conductor is connected to the surface of the substrate during step (b) using a non-conductive layer.

### Claim 4 (depends on 1)

The method of claim 1, wherein the form part is manufactured from a sheet of metal through the use of a thermal separating process or by punching.

### Claim 5 (depends on 1)

The method of claim 1, wherein a workpiece made of silicon carbide (SiC), molybdenum disilicide (MoSi2), tantalum (Ta) or high temperature-resistant steel is used to produce the form part.

### Claim 6 (depends on 1)

The method of claim 1, wherein prior to the applying of the printed conductor to the surface of the substrate in step (b), the form part is provided, on its ends, with a conduction track whose cross-sectional surface area is larger than a cross-sectional surface area of a line pattern of the printed conductor.

### Claim 7 (depends on 6)

The method of claim 6, wherein the conduction track and the printed conductor are manufactured from the same material.

### Claim 8

An infrared panel radiator comprising:
a substrate made of an electrically insulating material; and
a printed conductor applied to a surface of the substrate, the printed conductor being made of a resistor material that is electrically conductive and generates heat when current flows through the resistor material, wherein the substrate is manufactured from a composite material that includes an amorphous matrix component and an additional component in the form of a semiconductor material, and the printed conductor is provided as a form part and is applied to the surface of the substrate such that the printed conductor and the substrate are permanently connected to each other.

### Claim 9 (depends on 8)

The infrared panel radiator of claim 8, wherein the printed conductor includes a plurality of printed conductor form parts applied to the substrate, wherein each of the printed conductor form parts can be electrically triggered individually.

### Claim 10 (depends on 2)

The method of claim 2 wherein the printed conductor is connected to the surface of the substrate during step (b) using a non-conductive layer.

### Claim 11 (depends on 2)

The method of claim 2, wherein the form part is manufactured from a sheet of metal through the use of a thermal separating process or by punching.

### Claim 12 (depends on 3)

The method of claim 3, wherein the form part is manufactured from a sheet of metal through the use of a thermal separating process or by punching.

### Claim 13 (depends on 2)

The method of claim 2, wherein a workpiece made of silicon carbide (SiC), molybdenum disilicide (MoSi2), tantalum (Ta) or high temperature-resistant steel is used to produce the form part.

### Claim 14 (depends on 3)

The method of claim 3, wherein a workpiece made of silicon carbide (SiC), molybdenum disilicide (MoSi2), tantalum (Ta) or high temperature-resistant steel is used to produce the form part

### Claim 15 (depends on 4)

The method of claim 4, wherein a workpiece made of silicon carbide (SiC), molybdenum disilicide (MoSi2), tantalum (Ta) or high temperature-resistant steel is used to produce the form part

### Claim 16 (depends on 2)

The method of claim 2, wherein prior to the applying of the printed conductor to the surface of the substrate in step (b), the form part is provided, on its ends, with a conduction track whose cross-sectional surface area is larger than a cross-sectional surface area of a line pattern of the printed conductor.

### Claim 17 (depends on 3)

The method of claim 3, wherein prior to the applying of the printed conductor to the surface of the substrate in step (b), the form part is provided, on its ends, with a conduction track whose cross-sectional surface area is larger than a cross-sectional surface area of a line pattern of the printed conductor.

### Claim 18 (depends on 4)

The method of claim 4, wherein prior to the applying of the printed conductor to the surface of the substrate in step (b), the form part is provided, on its ends, with a conduction track whose cross-sectional surface area is larger than a cross-sectional surface area of a line pattern of the printed conductor.

### Claim 19 (depends on 5)

The method of claim 5, wherein prior to the applying of the printed conductor to the surface of the substrate in step (b), the form part is provided, on its ends, with a conduction track whose cross-sectional surface area is larger than a cross-sectional surface area of a line pattern of the printed conductor.
