# US 2019/0174087 A1 · Substrate structures for image sensor modules and image sensor modules including the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0174087 A1 - Document ID: US20190174087A1 - Status: Published application - Kind: A1 - Application number: 16/129,010 - Filed: 2018-09-12 - Published: 2019-06-06 - Earliest claimed: 2017-12-05 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Ji-Hwang KIM; Hyo-Eun KIM; Jong-Bo SHIM; Cha-Jea JO; Sang-Uk HAN - Web page: https://patentgrep.com/patent/US20190174087A1 ## CPC - G02B 27/646: {compensating for small deviations, e.g. due to vibration or shake (movement of one or more optical elements for control of motion blur in cameras, projectors or printers G03B2205/0007; image stabilisation in cameras peculiar to the presence or use of an electronic image sensor H04N23/68)} - H04N 25/79: Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors - G02B 5/20: Filters (polarising elements G02B5/30) - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - H10F 39/804: {Containers or encapsulations} - H10F 39/806: {Optical elements or arrangements associated with the image sensors} - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION ## Abstract A substrate structure for an image sensor module includes a module substrate including a sensor mounting hole, a reinforcing plate on a lower surface of the module substrate, an image sensor chip on the reinforcing plate within the sensor mounting hole, and a reinforcing pattern in the module substrate. The reinforcing plate covers the sensor mounting hole. An upper surface of the image sensor chip may be exposed by the module substrate. The reinforcing pattern is adjacent to the sensor mounting hole and extends in at least one direction. ## Claims ### Claim 1 A substrate structure for an image sensor module, the substrate structure comprising: a module substrate including a sensor mounting hole; a reinforcing plate on a lower surface of the module substrate, the reinforcing plate covering the sensor mounting hole; an image sensor chip on the reinforcing plate within the sensor mounting hole, such that an upper surface of the image sensor chip is exposed by the module substrate; and a reinforcing pattern in the module substrate, the reinforcing pattern adjacent to the sensor mounting hole and extending within the module substrate in at least one direction. ### Claim 2 (depends on 1) The substrate structure of claim 1, wherein the reinforcing pattern has a ring shape such that the reinforcing pattern extends around the sensor mounting hole within the module substrate. ### Claim 3 (depends on 1) The substrate structure of claim 1, wherein the reinforcing pattern includes a plurality of support patterns, the plurality of support patterns spaced apart from each other along an entirety of a perimeter of the sensor mounting hole, such that the plurality of support patterns are isolated from direct contact with each other. ### Claim 4 (depends on 1) The substrate structure of claim 1, wherein the reinforcing pattern includes a pair of support patterns, the pair of support patterns extending within opposing first and second sidewalls of the sensor mounting hole, respectively. ### Claim 5 (depends on 1) The substrate structure of claim 1, wherein the reinforcing pattern is in a through hole which extends through the module substrate, such that the reinforcing pattern extends through the module substrate. ### Claim 6 (depends on 1) The substrate structure of claim 1, wherein the reinforcing pattern includes a plurality of stacked wiring patterns in a wiring layer of the module substrate. ### Claim 7 (depends on 1) The substrate structure of claim 1, wherein the reinforcing pattern and a wiring of the module substrate include a common material. ### Claim 8 (depends on 1) The substrate structure of claim 1, wherein the reinforcing pattern and a wiring of the module substrate include different materials. ### Claim 9 (depends on 1) The substrate structure of claim 1, further comprising: a plurality of substrate pads on an upper surface of the module substrate, the plurality of substrate pads extending along a sidewall of the sensor mounting hole, the plurality of substrate pads configured to be electrically connected to the image sensor chip. ### Claim 10 (depends on 9) The substrate structure of claim 9, wherein each substrate pad of the plurality of substrate pads is isolated from direct contact with the sidewall of the sensor mounting hole by a first distance, the reinforcing pattern is isolated from direct contact with the sidewall of the sensor mounting hole by a second distance, and the second distance is greater than the first distance. ### Claim 11 A substrate structure for an image sensor module, the substrate structure comprising: a module substrate having an upper surface and a lower surface, the module substrate including a sensor mounting hole; a reinforcing plate on a lower surface of the module substrate, the reinforcing plate covering the sensor mounting hole; an image sensor chip on the reinforcing plate within the sensor mounting hole, such that an upper surface of the image sensor chip is exposed by the module substrate; and a reinforcing pattern in at least a portion of the module substrate, the reinforcing pattern extending within the module substrate around the sensor mounting hole. ### Claim 12 (depends on 11) The substrate structure of claim 11, wherein the reinforcing pattern has a ring shape such that the reinforcing pattern extends around the sensor mounting hole within the module substrate. ### Claim 13 (depends on 11) The substrate structure of claim 11, wherein the reinforcing pattern includes a plurality of support patterns, the plurality of support patterns spaced apart from each other along an entirety of a perimeter of the sensor mounting hole, such that the plurality of support patterns are isolated from direct contact with each other. ### Claim 14 (depends on 11) The substrate structure of claim 11, wherein the reinforcing pattern includes a plurality of stacked wiring patterns in a wiring layer of the module substrate. ### Claim 15 (depends on 11) The substrate structure of claim 11, further comprising: a plurality of substrate pads on the upper surface of the module substrate, each substrate pad of the plurality of substrate pads further from a sidewall of the sensor mounting hole than the reinforcing pattern. ### Claim 16 An image sensor module, comprising: a module substrate having an upper surface and a lower surface, the module substrate including a sensor mounting hole; a reinforcing plate on a lower surface of the module substrate, the reinforcing plate covering the sensor mounting hole; an image sensor chip on the reinforcing plate within the sensor mounting hole, such that an upper surface of the image sensor chip is exposed by the module substrate; a reinforcing pattern in at least a portion of the module substrate, the reinforcing pattern extending within the module substrate around the sensor mounting hole; and an optical system on the upper surface of the module substrate, the optical system configured to focus light received from an external object to the image sensor chip. ### Claim 17 (depends on 16) The image sensor module of claim 16, further comprising: an optical filter extending over the module substrate such that the optical filter covers the image sensor chip; and a bracket configured to support fixedly the optical filter. ### Claim 18 (depends on 16) The image sensor module of claim 16, wherein the reinforcing plate includes a thermal conductive material. ### Claim 19 (depends on 16) The image sensor module of claim 16, wherein the upper surface of the image sensor chip is proximate to the reinforcing plate in relation to the upper surface of the module substrate. ### Claim 20 (depends on 16) The image sensor module of claim 16, wherein the reinforcing pattern has a ring shape such that the reinforcing pattern extends around the sensor mounting hole within the module substrate.