# US 2019/0173582 A1 · Re-generation and re-transmission of millimeter waves for building penetration using dongle transceivers > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0173582 A1 - Document ID: US20190173582A1 - Status: Published application - Kind: A1 - Application number: 16/185,491 - Filed: 2018-11-09 - Published: 2019-06-06 - Earliest claimed: 2017-03-22 - Assignees: Nxgen Partners IP, LLC - Applicants: NxGen Partners IP, LLC - Inventors: SOLYMAN ASHRAFI - Web page: https://patentgrep.com/patent/US20190173582A1 ## CPC - H04B 10/40: Transceivers - H01Q 1/007: {specially adapted for indoor communication} - H01Q 21/0025: {Modular arrays} - H01Q 21/065: {Patch antenna array} - H01Q 25/005: {providing two patterns of opposite direction; back to back antennas (H01Q25/004 takes precedence)} - H04B 5/266: {One coil at each side, e.g. with primary and secondary coils} - H04B 7/15: Active relay systems - H04B 10/11: Arrangements specific to free-space transmission, i.e. transmission through air or vacuum - H04B 10/90: Non-optical transmission systems, e.g. transmission systems employing non-photonic corpuscular radiation - H04L 27/00: Modulated-carrier systems - H04L 25/02: Details {; arrangements for supplying electrical power along data transmission lines (systems for transmitting signals via power distribution lines H04B3/54)} - H04L 27/34: Amplitude- and phase-modulated carrier systems, e.g. quadrature-amplitude modulated carrier systems - H04W 84/12: WLAN [Wireless Local Area Networks] - H04B: TRANSMISSION - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H04L: TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION (arrangements common to telegraphic and telephonic communication H04M) - H04W: WIRELESS COMMUNICATION NETWORKS (broadcast communication H04H; communication systems using wireless links for non-selective communication, e.g. wireless extensions H04M1/72) ## Abstract A system for enabling signal penetration into a building comprises first circuitry, located on an outside of the building, for receiving RF signals and converting the RF signals into a format that overcomes losses caused by penetrating a structure of the building over a wireless communications link. The first circuitry further comprises a first transceiver dongle including a signal processing chipset for converting the received RF signals to the format that overcomes the losses occurring when the signals penetrate the structure of the building. Second circuitry, located on the interior of the building, receives the signals in the format that overcomes the losses caused by penetrating the structure of the building over the wireless communications link and converts the signals to a second format for transmission to the wireless devices within the building. The second circuitry further comprises a second transceiver dongle including the signal processing chipset for converting the received signals in the format that overcomes the losses caused by penetrating into the interior of the building into the second format. ## Claims ### Claim 1 A system for enabling signal penetration into a building, comprising: first circuitry, located on an outside of the building, for receiving millimeter wave signals and converting the millimeter wave signals into a format that overcomes losses caused by penetrating a structure of the building over a wireless communications link, wherein the first circuitry further comprises: a first transceiver dongle including a signal processing chipset for converting the received millimeter wave signals to the format that overcomes the losses occurring when the millimeter wave signals penetrate the structure of the building; and second circuitry, located on the interior of the building, for receiving the signals in the format that overcomes the losses caused by penetrating the structure of the building over the wireless communications link and converting the signals in the format that overcomes the losses caused by penetrating the structure of the building to a second format for transmission to the wireless devices within the building, wherein the second circuitry further comprises: a second transceiver dongle including the signal processing chipset for converting the received millimeter signals in the format that overcomes the losses caused by penetrating the structure of the building into the second format. ### Claim 2 (depends on 1) The system of claim 1, wherein the first and the second transceiver dongles further comprise: transceiver circuitry for transmitting and receiving signals in the format that overcomes the losses caused by penetrating the structure of the building; baseband circuitry for converting between the millimeter wave signals and the signals in the format that overcomes the losses caused by penetrating the structure of the building; and a patch antenna array for transmitting the signals in the format that overcomes the losses caused by penetrating the structure of the building. ### Claim 3 (depends on 1) The system of claim 1, wherein the patch antenna array further comprises: a first patch antenna array comprising a plurality of patch antennas located at a first level; and a second patch antenna array comprising a second plurality of patch antennas located at a second level above the first level. ### Claim 4 (depends on 1) The system of claim 1 further comprising an amplifier dish for amplifying transmissions to/from the patch antenna array. ### Claim 5 (depends on 1) The system of claim 1, wherein the signal processing chipset comprises a Peraso chipset. ### Claim 6 (depends on 1) The system of claim 1, wherein the first transceiver dongle and the second transceiver dongle further include a USB connector for interconnecting with the first circuitry and the second circuitry respectively. ### Claim 7 (depends on 1) The system of claim 1, wherein the second circuitry further comprises a WiFi router to transmit signals to the wireless devices within the building. ### Claim 8 (depends on 1) The system of claim 1 further including an inductive coupling system for providing power to the first circuitry, the inductive coupling system further comprising: a first inductive coil located on the interior of the building and connected to a power system located in the interior of the building; and a second inductive coil located on the exterior of the building and inductively coupled to the first inductive coil, the second inductive coil connected to provide electrical energy to the first circuitry. ### Claim 9 (depends on 1) The system of claim 1, wherein the losses further include at least one of absorption losses, scattering losses and reflection losses. ### Claim 10 (depends on 1) The system of claim 1, further including: first power circuitry for providing power to the first circuitry located on the outside of the building; and second power circuitry for providing power to the second circuitry located on the interior of the building. ### Claim 11 A system for enabling signal penetration into a building, comprising: first circuitry, located on an outside of the building, for receiving RF signals and converting the RF signals into a format that overcomes losses caused by penetrating a structure of the building over a wireless communications link, wherein the first circuitry further comprises: a first transceiver dongle including a signal processing chipset for converting the received RF signals to the format that overcomes the losses occurring when the signals penetrates the structure of the building; and second circuitry, located on the interior of the building, for receiving the signals in the format that overcomes the losses caused by penetrating the structure of the building over the wireless communications link and converting the signals to a second format for transmission to the wireless devices within the building, wherein the second circuitry further comprises: a second transceiver dongle including the signal processing chipset for converting the received signals in the format that overcomes the losses caused by penetrating into the interior of the building into the second format. ### Claim 12 (depends on 11) The system of claim 11, wherein the first and the second transceiver dongles further comprise: transceiver circuitry for transmitting and receiving signals in the format that overcomes the losses caused by penetrating the structure of the building; baseband circuitry for converting between the RF signals and the signals in the format that overcomes the losses caused by penetrating the structure of the building; and a patch antenna array for transmitting the signals in the format that overcomes the losses caused by penetrating the structure of the building. ### Claim 13 (depends on 11) The system of claim 11, wherein the patch antenna array further comprises: a first patch antenna array comprising a plurality of patch antennas located at a first level; and a second patch antenna array comprising a second plurality of patch antennas located at a second level above the first level. ### Claim 14 (depends on 11) The system of claim 11 further comprising an amplifier dish for amplifying transmissions to/from the patch antenna array. ### Claim 15 (depends on 11) The system of claim 11, wherein the signal processing chipset comprises a Peraso chipset. ### Claim 16 (depends on 11) The system of claim 11, wherein the first transceiver dongle and the second transceiver dongle further include a USB connector for interconnecting with the first circuitry and the second circuitry respectively. ### Claim 17 (depends on 11) The system of claim 11, wherein the second circuitry further comprises a WiFi router to transmit signals in the format to the wireless devices within the building. ### Claim 18 (depends on 11) The system of claim 11 further including an inductive coupling system for providing power to the first circuitry, the inductive coupling system further comprising: a first inductive coil located on the interior of the building and connected to a power system located in the interior of the building; and a second inductive coil located on the exterior of the building and inductively coupled to the first inductive coil, the second inductive coil connected to provide electrical energy to the first circuitry. ### Claim 19 (depends on 11) The system of claim 11, wherein the losses further include at least one of absorption losses, scattering losses and reflection losses. ### Claim 20 (depends on 11) The system of claim 11, further including: first power circuitry for providing power to the first circuitry located on the outside of the building; and second power circuitry for providing power to the second circuitry located on the interior of the building. ### Claim 21 A system for enabling signal penetration into a building, comprising: first circuitry, located on an outside of the building, for receiving millimeter wave signals and converting the millimeter wave signals into a format that overcomes losses caused by penetrating a structure of the building over a wireless communications link, wherein the first circuitry further comprises: a first transceiver dongle including a Peraso chipset for converting the received millimeter wave signals to the format that overcomes the losses occurring when the millimeter wave signals penetrates the structure of the building; and second circuitry, located on the interior of the building, for receiving the signals in the format that overcomes the losses caused by penetrating the structure of the building over the wireless communications link and converting the signals in the format that overcomes the losses caused by penetrating the structure of the building to a second format for transmission to the wireless devices within the building, wherein the second circuitry further comprises: a second transceiver dongle including the Peraso chipset for converting the received millimeter signals in the format that overcomes the losses caused by penetrating the structure of the building into the second format; and a WiFi router to transmit signals to the wireless devices within the building ### Claim 22 (depends on 21) The system of claim 21, wherein the first and the second transceiver dongles further comprise: transceiver circuitry for transmitting and receiving signals in the format that overcomes the losses caused by penetrating the structure of the building; baseband circuitry for converting between the millimeter wave signals and the signals in the format that overcomes the losses caused by penetrating the structure of the building; and a patch antenna array for transmitting the signals in the format that overcomes the losses caused by penetrating the structure of the building. ### Claim 23 (depends on 21) The system of claim 21, wherein the patch antenna array further comprises: a first patch antenna array comprising a plurality of patch antennas located at a first level; and a second patch antenna array comprising a second plurality of patch antennas located at a second level above the first level. ### Claim 24 (depends on 21) The system of claim 21 further comprising an amplifier dish for amplifying transmissions to/from the patch antenna array. ### Claim 25 (depends on 21) The system of claim 21, wherein the first transceiver dongle and the second transceiver dongle further include a USB connector for interconnecting with the first circuitry and the second circuitry respectively. ### Claim 26 (depends on 21) The system of claim 21 further including an inductive coupling system for providing power to the first circuitry, the inductive coupling system further comprising: a first inductive coil located on the interior of the building and connected to a power system located in the interior of the building; and a second inductive coil located on the exterior of the building and inductively coupled to the first inductive coil, the second inductive coil connected to provide electrical energy to the first circuitry. ### Claim 27 (depends on 21) The system of claim 21, wherein the losses further include at least one of absorption losses, scattering losses and reflection losses. ### Claim 28 (depends on 21) The system of claim 21, further including: first power circuitry for providing power to the first circuitry located on the outside of the building; and second power circuitry for providing power to the second circuitry located on the interior of the building.