# US 2019/0173214 A1 · Electrical Contact Element For An Electrical Connector Having Microstructured Caverns Under The Contact Surface

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- Number: US 2019/0173214 A1
- Document ID: US20190173214A1
- Status: Published application
- Kind: A1
- Application number: 16/270,716
- Filed: 2019-02-08
- Published: 2019-06-06
- Earliest claimed: 2016-08-08
- Assignees: TE Connectivity Germany GmbH; Steinbeiss-Forschungszentrum
- Applicants: TE Connectivity Germany GmbH; Steinbeiss-Forschungszentrum
- Inventors: Michael Leidner; Frank Mucklich; Leander Reinert; Herr Kim Eric Trinh Quoc; Helge Schmidt; Stefan Thoss
- Web page: https://patentgrep.com/patent/US20190173214A1

## CPC

- H01R 13/03: characterised by the material, e.g. plating, or coating materials
- B32B 15/01: all layers being exclusively metallic {(making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00)}
- B32B 15/018: {one layer being formed of a noble metal or a noble metal alloy}
- C22C 9/00: Alloys based on copper
- H01R 13/533: Bases, cases made for use in extreme conditions, e.g. high temperature, radiation, vibration, corrosive environment, pressure (H01R13/52 takes precedence)
- H01R 43/005: {for making dustproof, splashproof, drip-proof, waterproof, or flameproof connection, coupling, or casing}
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C22C: ALLOYS (treatment of alloys C21D, C22F)

## Abstract

An electrically conductive contact element for an electrical connector comprises a contact surface having a plurality of caverns arranged under the contact surface in a microstructure and an auxiliary material filled in the plurality of caverns.

## Claims

### Claim 1

An electrically conductive contact element for an electrical connector, comprising:
a contact surface having a plurality of caverns arranged under the contact surface in a microstructure; and
an auxiliary material filled in the plurality of caverns.

### Claim 2 (depends on 1)

The electrically conductive contact element of claim 1, wherein the microstructure extends parallel to the contact surface.

### Claim 3 (depends on 1)

The electrically conductive contact element of claim 1, wherein the caverns form a substantially homogeneous pattern with the microstructure.

### Claim 4 (depends on 1)

The electrically conductive contact element of claim 1, wherein the microstructure forms a pattern that is periodic at least in sections.

### Claim 5 (depends on 4)

The electrically conductive contact element of claim 4, wherein the microstructure has a period length of 0.5 μm to 300 μm in at least one direction.

### Claim 6 (depends on 5)

The electrically conductive contact element of claim 5, wherein the period length is 1 μm to 100 μm in at least one direction.

### Claim 7 (depends on 1)

The electrically conductive contact element of claim 1, wherein the auxiliary material is selected from the group of an antioxidant, a corrosion protection agent, a lubricant, and an acid.

### Claim 8 (depends on 1)

The electrically conductive contact element of claim 1, wherein the contact surface has a surface texture.

### Claim 9 (depends on 8)

The electrically conductive contact element of claim 8, wherein the surface texture is congruent with the microstructure.

### Claim 10 (depends on 9)

The electrically conductive contact element of claim 9, wherein the surface texture is elevated above the caverns of the microstructure.

### Claim 11

An electrical connector, comprising:
an electrically conductive contact element including a contact surface having a plurality of caverns arranged under the contact surface in a microstructure and an auxiliary material filled in the plurality of caverns.

### Claim 12

A method for enclosing an auxiliary material under a contact surface of an electrically conductive contact element, comprising:
forming a microstructure at the contact surface;
applying the auxiliary material onto the contact surface; and
enclosing the auxiliary material in the microstructure.

### Claim 13 (depends on 12)

The method of claim 12, wherein the applying step occurs before the forming step.

### Claim 14 (depends on 13)

The method of claim 13, wherein the auxiliary material is enclosed in the microstructure during the forming step.

### Claim 15 (depends on 12)

The method of claim 12, wherein the applying step occurs after the forming step.

### Claim 16 (depends on 15)

The method of claim 15, wherein the contact surface is mechanically deformed during the enclosing step.

### Claim 17 (depends on 15)

The method of claim 15, wherein a sealant is applied onto the contact surface in the enclosing step.

### Claim 18 (depends on 12)

The method of claim 12, wherein the forming step includes treating the contact surface with a laser radiation having an interference pattern.
