# US 2019/0173044 A1 · Method of producing a component module and component module

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- Number: US 2019/0173044 A1
- Document ID: US20190173044A1
- Status: Published application
- Kind: A1
- Application number: 15/776,000
- Filed: 2017-08-25
- Published: 2019-06-06
- Earliest claimed: 2016-08-26
- Assignees: OSRAM OLED GmbH
- Applicants: OSRAM OLED GmbH
- Inventors: Erwin Lang; Thomas Wehlus; Arne Fleißner; Sebastian Wittmann
- Web page: https://patentgrep.com/patent/US20190173044A1

## CPC

- H10K 50/84: Passivation; Containers; Encapsulations
- H10K 50/87: Arrangements for heating or cooling
- H10K 2102/311: {Flexible OLED}
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

A method of producing a component module includes providing a component holder having a curved upper side and a radiation-emitting bendable component, and bending and fastening the component to the upper side so that the component has a curved shape.

## Claims

### Claim at position 1

-20. (canceled)

### Claim 21

A method of producing a component module comprising:
providing a component holder having a curved upper side and a radiation-emitting bendable component, and
bending and fastening the component to the upper side, so that the component has a curved shape.

### Claim 22 (depends on 21)

The method according to claim 21, wherein the component holder comprises a heat-distributing region on the upper side and the bending and fixing of the component proceeds on the heat-distributing region so that the component forms into a curved shape.

### Claim 23 (depends on 21)

The method according to claim 21, wherein, during fastening, the bendable component is laminated on the upper side of the component holder.

### Claim 24 (depends on 23)

The method according to claim 23, wherein the lamination comprises fastening the component on the upper side of the component holder by an adhesive layer or a double-sided adhesive tape.

### Claim 25 (depends on 22)

The method according to claim 22, wherein production of the component holder comprises milling, casting, stamping or bending so that the heat-distributing region is formed as a curved and continuously metallic region from the upper side to an underside of the component holder.

### Claim 26 (depends on 21)

The method according to claim 21, wherein the component holder is formed by applying a heat-distributing layer to a curved upper side of a holder body.

### Claim 27 (depends on 26)

The method according to claim 26, wherein the heat-distributing layer is applied by forming a growth layer on the top side of the holder body and the heat-distributing layer is applied on the growth layer by galvanic deposition, or
the heat-distributing layer is applied by a heat-distributing film laminated onto the upper side of the holder body.

### Claim 28 (depends on 21)

The method according to claim 21, wherein bending and fixing the component comprises connecting the component with a curved encapsulation cover, and fixing the arrangement of the curved encapsulation cover and the curved component on the component holder,
or bending and fixing the component comprises fixing the component on the curved upper side of the component holder and fixing a curved encapsulation cover on the arrangement of the component holder and the curved component.

### Claim 29 (depends on 21)

The method according to claim 21, wherein the component is bent and connected to the component holder so that the component holder encapsulates the component on a side facing the component holder.

### Claim 30 (depends on 21)

The method according to claim 21, wherein the bendable component is an organic light-emitting diode.

### Claim 31

A component module comprising:
a component holder having a curved upper side, and
a radiation-emitting component arranged in a curved shape on the upper side.

### Claim 32 (depends on 31)

The component module according to claim 31, wherein the component holder comprises a heat-distributing region on the upper side, and
a neutral fiber running inside the curved component.

### Claim 33 (depends on 31)

The component module according to claim 31, wherein an adhesive lies planar between the bent component and the upper side, and the adhesive fixes the component on the upper side.

### Claim 34 (depends on 32)

The component module according to claim 32, wherein the heat-distributing region is formed as a curved, continuously metallic region from the upper side to a lower side of the component holder.

### Claim 35 (depends on 31)

The component module according to claim 31, wherein the component holder has a heat-distributing layer on a curved upper side of a holder body.

### Claim 36 (depends on 35)

The component module according to claim 35, wherein the heat-distributing layer comprises a galvanically applied layer on the top side of the holder body or is laminated as a heat-distributing film on the upper side of the holder body.

### Claim 37 (depends on 31)

The component module according to claim 31, wherein a pre-bent encapsulation cover is arranged on the component.

### Claim 38 (depends on 37)

The component module according to claim 37, wherein the encapsulation cover is a glass.

### Claim 39 (depends on 37)

The component module according to claim 37, wherein the encapsulation cover is pre-shaped such that its curvature corresponds to that of the rigid component holder.

### Claim 40 (depends on 31)

The component module according to claim 31, wherein the component holder encapsulates the component on a side facing the component holder.