# US 2019/0172989 A1 · Method of manufacturing light emitting device

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- Number: US 2019/0172989 A1
- Document ID: US20190172989A1
- Status: Published application
- Kind: A1
- Application number: 16/264,481
- Filed: 2019-01-31
- Published: 2019-06-06
- Earliest claimed: 2016-07-28
- Assignees: Nichia Corporation
- Applicants: Nichia Corporation
- Inventors: Ikuko BAIKE
- Web page: https://patentgrep.com/patent/US20190172989A1

## CPC

- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 90/00: Package configurations
- H10H 20/018: {Bonding of wafers}
- H10H 20/8513: {having two or more wavelength conversion materials}
- H10H 20/852: Encapsulations
- H10H 20/853: characterised by their shape
- H10H 20/856: Reflecting means
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 74/141: {the encapsulations being on at least the sidewalls of the semiconductor body}
- H10W 74/147: {the encapsulations being multilayered}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 74/40: characterised by their materials
- H10H 20/01: Manufacture or treatment
- H10H 20/036: {of packages}
- H10H 20/0361: {of wavelength conversion means}
- H10H 20/0362: {of encapsulations}
- H10H 20/0363: {of optical field-shaping means}
- H10H 20/0364: {of interconnections}
- H10H 20/8506: {Containers}
- H10H 20/8514: {characterised by their shape, e.g. plate or foil}
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 72/0198: {batch processes}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

A method of manufacturing a light emitting device includes mounting an element set on a support substrate. The element set includes an element substrate and a plurality of light emitting elements on the element substrate. Each of the light emitting elements includes a semiconductor layered body having a surface and a pair of electrodes formed on the semiconductor layered body surface. A light reflecting member is provided between the element set and the support substrate. The element substrate is removed from the plurality of light emitting elements.

## Claims

### Claim 1

A method of manufacturing a light emitting device, the method comprising:
mounting an element set on a support substrate, the element set including an element substrate and a plurality of light emitting elements mounted on the element substrate, each of the light emitting elements including a semiconductor layered body having a surface and a pair of electrodes formed on the semiconductor layered body surface;
providing a light reflecting member between the element set and the support substrate; and
removing the element substrate from the plurality of light emitting elements.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the element substrate is a substrate for growing the plurality of light emitting elements, and removed with laser lift-off.

### Claim 3 (depends on 1)

The method according to claim 1, wherein the light reflecting member includes a thermosetting resin containing a light reflecting member.

### Claim 4 (depends on 1)

The method according to claim 1, wherein, in providing the light reflecting member between the element set and the support substrate, a projection is formed along a periphery of the light reflecting member.

### Claim 5 (depends on 1)

The method according to claim 1, further comprising:
providing a wavelength conversion layer that converts a wavelength of light emitted by the plurality of light emitting elements on an upper surface of the plurality of light emitting elements after the element substrate is removed.

### Claim 6 (depends on 5)

The method according to claim 5, wherein the wavelength conversion layer is provided with spraying.

### Claim 7 (depends on 5)

The method according to claim 5, wherein the wavelength conversion layer is provided with potting.

### Claim 8 (depends on 1)

The method according to claim 1, wherein the light emitting device includes the plurality of light emitting elements by two or more pieces.