# US 2019/0172984 A1 · Light-emitting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0172984 A1 - Document ID: US20190172984A1 - Status: Published application - Kind: A1 - Application number: 16/206,883 - Filed: 2018-11-30 - Published: 2019-06-06 - Earliest claimed: 2017-12-01 - Assignees: Stanley Electric Co., Ltd. - Applicants: Stanley Electric Co., Ltd. - Inventors: Jiro Higashino; Satoshi Hirama; Sho Nozawa; Hiroyuki Ishiko - Web page: https://patentgrep.com/patent/US20190172984A1 ## CPC - H10H 20/8514: {characterised by their shape, e.g. plate or foil} - H10H 20/851: Wavelength conversion means - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 90/00: Package configurations - H10H 20/0361: {of wavelength conversion means} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A light-emitting device with high luminance which has high uniformity in color and intensity can be provided. The light-emitting device includes a mounting substrate, a plurality of light-emitting elements disposed on the mounting substrate side by side, a wavelength conversion plate provided over the plurality of light-emitting elements and having a side surface, and a plurality of bumps disposed on the mounting substrate to abut against the side surface of the wavelength conversion plate, so as to determine a position of the wavelength conversion plate. ## Claims ### Claim 1 A light-emitting device comprising: a mounting substrate; a plurality of light-emitting elements disposed on the mounting substrate side by side; a wavelength conversion plate provided over the plurality of light-emitting elements and having a side surface; and a plurality of bumps disposed on the mounting substrate to abut against the side surface of the wavelength conversion plate, so as to determine a position of the wavelength conversion plate. ### Claim 2 (depends on 1) The light-emitting device according to claim 1, wherein each of the bumps is configured to include a bottom portion, an intermediate portion on the bottom portion, and a top portion on the intermediate portion, and the bottom portion has a width smaller than those of the intermediate portion and the top portion. ### Claim 3 (depends on 2) The light-emitting device according to claim 2, wherein the intermediate portion of each of the bumps has a width larger than that of the top portion, and each of the bumps abuts against the side surface of the wavelength conversion plate at the intermediate portion thereof. ### Claim 4 (depends on 1) The light-emitting device according to claim 1, wherein each of the bumps is configured to include a first metal bump formed on the mounting substrate, and a second metal bump formed on the first metal bump and disposed on a side closer to the wavelength conversion plate than the first metal bump, and each of the bumps abuts against the side surface of the wavelength conversion plate at the second metal bump thereof. ### Claim 5 (depends on 1) The light-emitting device according to claim 1, wherein each of the bumps is configured to include a first metal bump formed on the mounting substrate and having a stepped structure, and a second metal bump formed on the first metal bump and having a stepped structure and a width larger than that of the first metal bump, and each of the bumps abuts against the side surface of the wavelength conversion plate at the second metal bump thereof. ### Claim 6 (depends on 2) The light-emitting device according to claim 2, wherein each of the bumps is configured to include a first metal bump formed on the mounting substrate and having a stepped structure, and a second metal bump formed on the first metal bump and having a stepped structure and a width larger than that of the first metal bump, and each of the bumps abuts against the side surface of the wavelength conversion plate at the second metal bump thereof. ### Claim 7 (depends on 1) The light-emitting device according to claim 1, wherein the light-emitting elements are arranged in a row, the bumps are arranged in a direction in which the light-emitting elements are arranged, and the wavelength conversion plate has a rectangular upper surface whose long side direction is the direction in which the light-emitting elements are arranged. ### Claim 8 (depends on 2) The light-emitting device according to claim 2, wherein the light-emitting elements are arranged in a row, the bumps are arranged in a direction in which the light-emitting elements are arranged, and the wavelength conversion plate has a rectangular upper surface whose long side direction is the direction in which the light-emitting elements are arranged. ### Claim 9 (depends on 3) The light-emitting device according to claim 3, wherein the light-emitting elements are arranged in a row, the bumps are arranged in a direction in which the light-emitting elements are arranged, and the wavelength conversion plate has a rectangular upper surface whose long side direction is the direction in which the light-emitting elements are arranged. ### Claim 10 (depends on 4) The light-emitting device according to claim 4, wherein the light-emitting elements are arranged in a row, the bumps are arranged in a direction in which the light-emitting elements are arranged, and the wavelength conversion plate has a rectangular upper surface whose long side direction is the direction in which the light-emitting elements are arranged. ### Claim 11 (depends on 5) The light-emitting device according to claim 5, wherein the light-emitting elements are arranged in a row, the bumps are arranged in a direction in which the light-emitting elements are arranged, and the wavelength conversion plate has a rectangular upper surface whose long side direction is the direction in which the light-emitting elements are arranged. ### Claim 12 (depends on 7) The light-emitting device according to claim 7, wherein the mounting substrate includes a pad terminal, each of the light-emitting elements includes a light-emitting portion disposed on a support substrate, and a pad electrode disposed on the support substrate to connect to the light-emitting portion and connected to the pad electrode of the mounting substrate by a bonding wire, the pad electrodes of the respective light-emitting elements are aligned in the direction in which the light-emitting elements are arranged, and each of the bumps is disposed on the pad electrode at a position closer to the light-emitting portion than the bonding wire. ### Claim 13 (depends on 8) The light-emitting device according to claim 8, wherein the mounting substrate includes a pad terminal, each of the light-emitting elements includes a light-emitting portion disposed on a support substrate, and a pad electrode disposed on the support substrate to connect to the light-emitting portion and connected to the pad electrode of the mounting substrate by a bonding wire, the pad electrodes of the respective light-emitting elements are aligned in the direction in which the light-emitting elements are arranged, and each of the bumps is disposed on the pad electrode at a position closer to the light-emitting portion than the bonding wire. ### Claim 14 (depends on 9) The light-emitting device according to claim 9, wherein the mounting substrate includes a pad terminal, each of the light-emitting elements includes a light-emitting portion disposed on a support substrate, and a pad electrode disposed on the support substrate to connect to the light-emitting portion and connected to the pad electrode of the mounting substrate by a bonding wire, the pad electrodes of the respective light-emitting elements are aligned in the direction in which the light-emitting elements are arranged, and each of the bumps is disposed on the pad electrode at a position closer to the light-emitting portion than the bonding wire. ### Claim 15 (depends on 1) The light-emitting device according to claim 1, comprising: a base substrate to which the mounting substrate is fixed; a frame disposed on the base substrate to surround the mounting substrate; and a sealing portion configured to fill inside the frame to seal the light-emitting elements and expose the wavelength conversion plate. ### Claim 16 A light emitting device comprising: a mounting substrate; a light-emitting element disposed on the mounting substrate; a wavelength conversion plate disposed on the light-emitting element and having a side surface; and a plurality of bumps disposed on the mounting substrate to abut against the side surface of the wavelength conversion plate, so as to determine a position of the wavelength conversion plate. ### Claim 17 (depends on 16) The light emitting device according to claim 16, wherein the side surface of the wavelength conversion plate includes side surfaces extending in mutually different directions, and the bumps abut against the side surfaces correspondingly. ### Claim 18 (depends on 16) The light-emitting device according to claim 16, wherein the mounting substrate includes a pad terminal, the light-emitting element includes a light-emitting portion disposed on a support substrate, and a pad electrode disposed on the support substrate to connect to the light-emitting portion and connected to the pad electrode of the mounting substrate by a bonding wire, and each of the bumps is disposed on the support substrate at a position closer to the light-emitting portion than the bonding wire. ### Claim 19 (depends on 17) The light-emitting device according to claim 17, wherein the mounting substrate includes a pad terminal, the light-emitting element includes a light-emitting portion disposed on a support substrate, and a pad electrode disposed on the support substrate to connect to the light-emitting portion and connected to the pad electrode of the mounting substrate by a bonding wire, and each of the bumps is disposed on the support substrate at a position closer to the light-emitting portion than the bonding wire. ### Claim 20 (depends on 18) The light-emitting device according to claim 18, wherein each of the bumps is disposed on the support substrate in a region between the light-emitting portion and the pad electrode.