# US 2019/0172958 A1 · The infrared sensor and manufacturing method thereof

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- Number: US 2019/0172958 A1
- Document ID: US20190172958A1
- Status: Published application
- Kind: A1
- Application number: 15/856,925
- Filed: 2017-12-28
- Published: 2019-06-06
- Earliest claimed: 2017-12-01
- Assignees: Industrial Technology Research Institute
- Applicants: Industrial Technology Research Institute
- Inventors: Feng-Chia Hsu; Shing-Cheng Chang; Peng-Jen Chen; Chung-Yuan Su
- Web page: https://patentgrep.com/patent/US20190172958A1

## CPC

- G01J 5/0853: {having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid}
- H10F 77/707: {of the substrates or of layers on substrates, e.g. textured ITO layer on a glass substrate}
- G01J 5/00: Radiation pyrometry, e.g. infrared or optical thermometry
- G01J 5/024: {Special manufacturing steps or sacrificial layers or layer structures}
- H10F 39/026: {Wafer-level processing}
- H10F 39/184: {Infrared image sensors}
- H10N 10/17: characterised by the structure or configuration of the cell or thermocouple forming the device
- G01J: MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY (light sources F21, H01J, H01K, H05B; investigating properties of materials by optical means G01N)
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

## Abstract

An infrared sensor including a substrate, an infrared absorption layer and a concave is provided. The infrared absorption layer is formed on a substrate and has a sensing surface. The concave extends toward the substrate from a sensing surface of the infrared absorption layer.

## Claims

### Claim 1

An infrared sensor, comprising:
a substrate:
an infrared absorption layer formed on the substrate and having a sensing surface; and
a concave extending towards the substrate from the sensing surface of the infrared absorption layer.

### Claim 2 (depends on 1)

The infrared sensor according to claim 1, further comprising:
a thermal conduction layer formed on a wall surface of the concave.

### Claim 3 (depends on 1)

The infrared sensor according to claim 1, comprising a plurality of the concaves.

### Claim 4 (depends on 1)

The infrared sensor according to claim 1, wherein the concave comprises a first groove and a second groove, the first groove extends to the second groove from the sensing surface, the second groove extends towards the substrate from the first groove, and the first groove has a diameter different from that of the second groove.

### Claim 5 (depends on 4)

The infrared sensor according to claim 4, wherein the diameter of the first groove is larger than that of the second groove.

### Claim 6 (depends on 4)

The infrared sensor according to claim 4, further comprising:
a thermal conduction layer formed on a bottom wall of the first groove and a bottom wall of the second groove.

### Claim 7 (depends on 1)

The infrared sensor according to claim 1, wherein the substrate has a cavity extending towards an interior of the substrate from an upper surface of the substrate.

### Claim 8 (depends on 7)

The infrared sensor according to claim 7. wherein the infrared absorption layer has a penetrating portion extending to the cavity from the sensing surface and surrounding the concave.

### Claim 9 (depends on 1)

The infrared sensor according to claim 1, further comprising:
a thermoelectric element formed on the substrate, wherein one end of the thermoelectric element is adjacent to the concave.

### Claim 10 (depends on 9)

The infrared sensor according to claim 9, wherein the thermoelectric element comprises:
a first thermosensitive line formed on the substrate, wherein one end of the first thermosensitive line is adjacent to the concave;
a second thermosensitive line formed on the substrate, wherein one end of the second thermosensitive line is adjacent to the concave; and
wherein the infrared sensor comprises a connection member formed in the infrared absorption layer for connecting the one end of the first thermosensitive line to the one end of the second thermosensitive line.

### Claim 11

A manufacturing method of an infrared sensor, comprising:
providing a substrate and an infrared absorption layer, wherein the infrared absorption layer is formed on the substrate and has a sensing surface; and
forming a concave extending towards the substrate from the sensing surface of the infrared absorption layer.

### Claim 12 (depends on 11)

The manufacturing method according to claim 11, further comprising:
forming a penetrating portion extending to the substrate from the sensing surface and surrounding the concave.

### Claim 13 (depends on 11)

The manufacturing method according to claim 11, further comprising:
forming a cavity extending towards an interior of the substrate from an upper surface of the substrate.

### Claim 14 (depends on 11)

The manufacturing method according to claim 11, further comprising:
forming a penetrating portion extending to the substrate from the sensing surface; and
forming a cavity through the penetrating portion, wherein the cavity extends towards an interior of the substrate from the penetrating portion.