# US 2019/0172779 A1 · Semiconductor Chip Comprising a Multiplicity of External Contacts, Chip Arrangement and Method for Checking an Alignment of a Position of a Semiconductor Chip > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0172779 A1 - Document ID: US20190172779A1 - Status: Published application - Kind: A1 - Application number: 16/204,445 - Filed: 2018-11-29 - Published: 2019-06-06 - Earliest claimed: 2017-12-01 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Dietrich Bonart - Web page: https://patentgrep.com/patent/US20190172779A1 ## CPC - H10W 70/635: {Through-vias} - H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects} - H10P 74/277: {Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers} - H10W 46/00: Marks applied to devices, e.g. for alignment or identification - H10W 70/69: Insulating materials thereof - H10W 74/129: {forming a chip-scale package [CSP]} - H10W 90/00: Package configurations - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 46/301: {for alignment} - H10W 46/601: {for use after dicing} - H10W 72/01: {Manufacture or treatment} - H10W 72/072: {of bump connectors} - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/248: {Top-view layouts, e.g. mirror arrays} - H10W 90/722: {between stacked chips} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor chip includes a mounting surface having a plurality of first conductive contacts and at least one second conductive contact. Each of the first contacts is arranged in a regularly spaced apart array such that centroids of immediately adjacent first contacts are separated from one another in a first direction by a first distance. Each of the first contacts have an identical first lateral extent. The second conductive contact is at least partially within an area which has the first lateral extent and is separated from an immediately first contact by the first distance. Either the second conductive contact has a second lateral extent that is less than the first lateral extent; or a centroid of the second conductive contact is separated in the first direction from the centroid of one of the first contacts by a second distance that is different from the first distance. ## Claims ### Claim 1 A semiconductor chip, comprising: a mounting surface comprising a plurality of first conductive contacts and at least one second conductive contact, wherein each of the first contacts in the plurality is arranged in a regularly spaced apart array such that centroids of immediately adjacent ones of the first contacts are separated from one another in a first direction by a first distance, wherein each of the first contacts in the plurality have an identical first lateral extent, wherein the at least one second conductive contact is at least partially within an area which has the first lateral extent and is separated from an immediately adjacent one of the first contacts in the first direction by the first distance, and wherein at least one of the following is true: the at least one second conductive contact has a second lateral extent that is less than the first lateral extent; or a centroid of the at least one second conductive contact is separated in the first direction from the centroid of the immediately adjacent one of the first contacts by a second distance that is different from the first distance. ### Claim 2 (depends on 1) The semiconductor chip of claim 1, wherein the at least one second conductive contact has the second lateral extent, and wherein a centroid of the at least one second conductive contact is separated in the first direction from the centroid of an immediately adjacent one of the first contacts by the first distance. ### Claim 3 (depends on 1) The semiconductor chip of claim 1, wherein the centroid of the at least one second conductive contact is separated in the first direction from the centroid of the immediately adjacent one of the first contacts by the second distance. ### Claim 4 (depends on 3) The semiconductor chip of claim 3, wherein the at least one second conductive contact has a second lateral extent that is less than the first lateral extent. ### Claim 5 (depends on 3) The semiconductor chip of claim 3, wherein the second distance is greater than the first distance. ### Claim 6 (depends on 1) The semiconductor chip of claim 1, wherein the regularly spaced apart array comprises at least one row of the first contacts and at least one column of the first contacts, wherein the at least one row comprises two or more of the first contacts each being separated from one another in the first direction by the first distance, wherein the at least one column comprises two or more of the first contacts each being separated from one another in a second direction by a third distance. ### Claim 7 (depends on 6) The semiconductor chip of claim 6, wherein the third distance is different from the first distance. ### Claim 8 (depends on 6) The semiconductor chip of claim 6, wherein the semiconductor chip comprises four of the second contacts, and wherein the four of the second contacts are disposed at outer corners of the regularly spaced apart array. ### Claim 9 (depends on 8) The semiconductor chip of claim 8, wherein each of the second contacts at the outer corners overlaps with a location that is separated from an outer edge side of an immediately adjacent one of the first contacts in the first direction by the first distance, wherein each of the four second contacts overlaps with a location that is separated from an outer edge side of an immediately adjacent one of the first contacts in the second direction by the third distance. ### Claim 10 A semiconductor chip, comprising: a mounting surface comprising a plurality of first conductive contacts and a second conductive contact, wherein each of the first contacts in the plurality is arranged in a regularly spaced apart array such that centroids of immediately adjacent ones of the first contacts are separated from one another in a first direction by a first distance, wherein each of the first contacts in the plurality have an identical first lateral extent, and wherein the second conductive contact is disposed in the first direction between the regularly spaced apart array and a first outer edge side of the semiconductor chip, wherein at least one of the following is true: the second conductive contact has a second lateral extent that is less than the first lateral extent; or a centroid of the second conductive contact is separated in the first direction from the centroid of an immediately adjacent one of the first contacts by a second distance that is different from the first distance. ### Claim 11 (depends on 10) The semiconductor chip of claim 10, wherein the semiconductor chip further comprises a third conductive contact, and wherein the third conductive contact is disposed between the regularly spaced apart array and a second outer edge side of the semiconductor chip, the first and second outer edge sides being opposite from one another, and wherein at least one of the following is true: the third conductive contact has a third lateral extent that is less than the first lateral extent; or a centroid of the third conductive contact is separated in the first direction from the centroid of an immediately adjacent one of the third contacts by a third distance that is different from the first distance. ### Claim 12 (depends on 11) The semiconductor chip of claim 11, wherein the third distance is different from the second distance. ### Claim 13 (depends on 11) The semiconductor chip of claim 11, wherein the second conductive contact has a second lateral extent that is less than the first lateral extent, and wherein the third conductive contact has a third lateral extent that is less than the first lateral extent. ### Claim 14 A semiconductor chip, comprising: a mounting surface comprising a plurality of first conductive contacts and a second conductive contact, wherein each of the first contacts in the plurality is arranged in a regularly spaced apart array such that centroids of immediately adjacent ones of the first contacts are separated from one another in a first direction by a first distance, wherein a central one of the first contacts is surrounded on either side by outer ones of the first contacts, wherein each of the first contacts in the plurality have an identical first lateral extent, wherein the second contact has a second lateral extent that is less than the first lateral extent, and wherein the second conductive contact is disposed between two of the first contacts in the first direction such that first and second distances between the second conductive contact and the two of the first contacts are each less than the first distance. ### Claim 15 (depends on 14) The semiconductor chip of claim 14, wherein the regularly spaced apart array comprises at least one row of the first contacts and at least one column of the first contacts, wherein each of the at least one rows comprise two or more of the first contacts each being separated from one another in the first direction by the first distance, wherein each of the at least one columns comprises two or more of the first contacts each being separated from one another in a second direction by a third distance, wherein the second conductive contact is located in the first direction between two of the first contacts from one of the rows, and wherein the second conductive contact is located in the second direction between two of the first contacts from one of the columns. ### Claim 16 (depends on 14) The semiconductor chip of claim 14, wherein the wherein the regularly spaced apart array comprises three of the rows and three of the columns, and wherein the central one of the first contacts is surrounded in the first direction and in the second direction by outer ones of the first contacts.