# US 2019/0172776 A1 · Method Of Making A Wire Support Leadframe For A Semiconductor Device

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- Number: US 2019/0172776 A1
- Document ID: US20190172776A1
- Status: Published application
- Kind: A1
- Application number: 16/253,151
- Filed: 2019-01-21
- Published: 2019-06-06
- Earliest claimed: 2015-12-30
- Assignees: Texas Instruments Incorporated
- Applicants: Texas Instruments Incorporated
- Inventors: YUH-HARNG CHIEN; CHIH-CHIEN HO; STEVEN SU
- Web page: https://patentgrep.com/patent/US20190172776A1

## CPC

- H10W 70/421: {Shapes or dispositions}
- H10W 70/411: {Chip-supporting parts, e.g. die pads}
- H10W 70/427: {Bent parts}
- H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers}
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 90/00: Package configurations
- H10W 90/811: {Multiple chips on leadframes}
- H10W 72/075: {of bond wires}
- H10W 72/354: {comprising polymers}
- H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements}
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/5525: {comprising copper [Cu]}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 72/951: {Materials of bond pads}
- H10W 74/01: Manufacture or treatment
- H10W 76/17: characterised by their materials
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/753: {between laterally-adjacent chips}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.

## Claims

### Claim 1

An integrated circuit, comprising:
a pair of die pads;
a pair of dies secured to the pair of die pads, the pair of dies electrically connected by at least one wire having a middle portion;
a support bracket extending between the die pads and having a surface for maintaining the middle portion of the at least one wire no lower than a height from the die pads during overmolding of the integrated circuit, the height preventing electrical arcing between the dies and the at least one wire; and
electrically insulating material overmolded over the pair of die pads, the at least one wire, and the pair of dies.

### Claim 2 (depends on 1)

The integrated circuit recited in claim 1, wherein the support bracket includes a middle portion including the surface and spaced equidistant from the die pads.

### Claim 3 (depends on 1)

The integrated circuit recited in claim 1, wherein the surface of the support bracket is planar.

### Claim 4 (depends on 1)

The integrated circuit recited in claim 1, wherein the surface of the support bracket extends parallel to the die pads.

### Claim 5 (depends on 1)

The integrated circuit recited in claim 1, wherein the support bracket extends from a first end to a second end, each first and second end having a triangular shape.

### Claim 6 (depends on 1)

The integrated circuit recited in claim 1, wherein the support bracket is coated with a solder resistant layer.

### Claim 7 (depends on 1)

The integrated circuit recited in claim 1, wherein the support bracket includes a plurality of spaced apart middle portions that each includes a surface for supporting the at least one wire.

### Claim 8 (depends on 1)

The integrated circuit recited in claim 1, wherein the surface of the support bracket has a width of about 4 mm.