# US 2019/0172740 A1 · Modular pressing device capable of generating stage downward forces and electronic device testing apparatus comprising the same

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- Number: US 2019/0172740 A1
- Document ID: US20190172740A1
- Status: Published application
- Kind: A1
- Application number: 15/903,228
- Filed: 2018-02-23
- Published: 2019-06-06
- Earliest claimed: 2017-12-04
- Assignees: Chroma Ate Inc.
- Applicants: Chroma Ate Inc.
- Inventors: Chi-Chen WU; Yun-Jui CHENG; Chien-Ming CHEN
- Web page: https://patentgrep.com/patent/US20190172740A1

## CPC

- H10P 72/1904: {specially adapted for containing chips, dies or ICs}
- B21D 43/05: specially adapted for multi-stage presses {(B21D43/145 takes precedence)}
- B30B 15/0052: {for fluid driven presses}
- G01R 1/0425: {Test clips, e.g. for IC's}
- G01R 31/2891: {related to sensing or controlling of force, position, temperature (G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05)}
- H01R 13/629: Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure {electrical locking indicators, manufacturing tolerances (separate tools or apparatus H01R43/26)}
- H10P 72/3218: {Conveying cassettes, containers or carriers}
- H10W 78/00: Detachable holders for supporting packaged chips in operation
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B21D: WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL (working or processing of wire B21F)
- B30B: PRESSES IN GENERAL (producing ultra-high pressure or ultra-high pressure and high temperature to effect modifications of a substance, e.g. for making artificial diamonds B01J3/00 ){(compressing means for refuse receptacles B65F1/1405)}
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A modular pressing device capable of generating stage downward forces is provided. The modular pressing device comprises a non-exchangeable pressing module and an exchangeable pressing module. The non-exchangeable pressing module includes a first downward force generating unit. The exchangeable pressing module includes a second downward force generating unit. The first downward force generating unit applies a first downward force to at least one of a testing seat and an electronic device through the exchangeable pressing module. The second downward force generating unit applies a second downward force to the electronic device. Thereby, the modular pressing device is capable to generate two different downward forces to reduce the downward surge force. In addition, as the exchangeable pressing module is worn, the exchangeable pressing module can be replaced quickly such that the maintenance cost can be effectively reduced and the stability of the apparatus can be enhanced.

## Claims

### Claim 1

A modular pressing device capable of generating stage downward forces, comprising:
a non-exchangeable pressing module, disposed on an electronic device testing apparatus, and the non-exchangeable pressing module including a first downward force generating unit; and
an exchangeable pressing module, assembled to the non-exchangeable pressing module, and the exchangeable pressing module including a second downward force generating unit;
wherein, the first downward force generating unit applies a first downward force to at least one of a testing seat and an electronic device through the exchangeable pressing module, and the second downward force generating unit applies a second downward force to the electronic device.

### Claim 2 (depends on 1)

The modular pressing device capable of generating stage downward forces of claim 1, wherein the second downward force generating unit includes a fluid chamber and a pressing bar, the pressing bar includes a piston head, the piston head is disposed in the fluid chamber to divide the fluid chamber into a first fluid chamber and a second fluid chamber, and the piston head is driven by injecting fluid into at least one of the first fluid chamber and the second fluid chamber to have the pressing bar moving up or down.

### Claim 3 (depends on 2)

The modular pressing device capable of generating stage downward forces of claim 2, wherein the exchangeable pressing module further comprises a first fluid channel, a second fluid channel, and a third fluid channel, the pressing bar further comprises a negative pressure channel and a chip pick-and-place hole, one end of the negative pressure channel is connected to the chip pick-and-place hole, another end of the negative pressure channel is connected to a negative pressure fluid source via the third fluid channel, one end of the first fluid channel is connected to a positive pressure fluid source, another end of the first fluid channel is connected to the first fluid chamber, one end of the second fluid channel is connected to the positive pressure fluid source, and another end of the second fluid channel is connected to the second fluid chamber.

### Claim 4 (depends on 2)

The modular pressing device capable of generating stage downward forces of claim 2, wherein the non-exchangeable pressing module further comprises a connection head, one end of the connection head is connected to the first downward force generating unit, and the exchangeable pressing module is distachably assembled to another end of the connection head.

### Claim 5 (depends on 4)

The modular pressing device capable of generating stage downward forces of claim 4, wherein the connection head comprises a first fluid runner, a second fluid runner, and a third fluid runner, the exchangeable pressing module further comprises a first fluid channel, a second fluid channel, and a third fluid channel, the pressing bar further comprises a negative pressure channel and a chip pick-and-place hole, one end of the negative pressure channel is connected to the chip pick-and-place hole, another end of the negative pressure channel is connected to a negative pressure fluid source via the third fluid channel and the third fluid runner, one end of the first fluid channel is connected to a positive pressure fluid source via the first fluid runner, another end of the first fluid channel is connected to the first fluid chamber, one end of the second fluid channel is connected to the positive pressure fluid source via the second fluid runner, and another end of the second fluid channel is connected to the second fluid chamber.

### Claim 6 (depends on 1)

The modular pressing device capable of generating stage downward forces of claim 1, wherein the modular pressing device is disposed on the load carrying device, the load carrying device moves an electronic device carried by the modular pressing device to a testing seat, the modular pressing device presses the electronic device to have the electronic device installed in the testing seat, and the testing seat tests the electronic device.

### Claim 7

A modular pressing device capable of generating stage downward forces, comprising:
a non-exchangeable pressing module, including a first downward force generating unit and a second downward force generating unit; and
an exchangeable pressing module, assembled to the non-exchangeable pressing module, the exchangeable pressing module including a chip pick-and-place bar, and the chip pick-and-place bar connected to the second downward force generating unit;
wherein the first downward force generating unit applies a first downward force to at least one of a testing seat and an electronic device through the exchangeable pressing module, and the second downward force generating unit applies a second downward force to the electronic device through the chip pick-and-place bar.

### Claim 8 (depends on 7)

The modular pressing device capable of generating stage downward forces of claim 7, wherein the second downward force generating unit includes a fluid chamber and a pressing bar, the pressing bar includes a piston head, the piston head is disposed in the fluid chamber to divide the fluid chamber into a first fluid chamber and a second fluid chamber, the chip pick-and-place bar is connected to the pressing bar, and the piston head is driven by injecting fluid into at least one of the first fluid chamber and the second fluid chamber to have the pressing bar moving up or down.

### Claim 9 (depends on 8)

The modular pressing device capable of generating stage downward forces of claim 8, wherein the non-exchangeable pressing module further comprises a first fluid channel, a second fluid channel, and a third fluid channel, the exchangeable pressing module further comprises a negative pressure connection channel, the chip pick-and-place bar further comprises a negative pressure channel and a chip pick-and-place hole, one end of the negative pressure channel is connected to the chip pick-and-place hole, another end of the negative pressure channel is connected to a negative pressure fluid source via the negative pressure connection channel and the third fluid channel, one end of the first fluid channel is connected to a positive pressure fluid source, another end of the first fluid channel is connected to the first fluid chamber, one end of the second fluid channel is connected to the positive pressure fluid source, and another end of the second fluid channel is connected to the second fluid chamber.

### Claim 10 (depends on 7)

The modular pressing device capable of generating stage downward forces of claim 7, wherein the exchangeable pressing module comprises a pressing block and at least one reset elastic element, the pressing block has a through hole, the chip pick-and-place bar penetrates the through hole, the through hole includes at least one radial concave, the chip pick-and-place bar includes at least one radial protrusion placed in the at least one radial concave, the at least one reset elastic element is located in the at least one radial concave and presses against the at least one radial protrusion of the chip pick-and-place bar, and as the chip pick-and-place bar moves up or down, the at least one reset elastic element forces the chip pick-and-place bar back to an original position.

### Claim 11 (depends on 7)

The modular pressing device capable of generating stage downward forces of claim 7, wherein the modular pressing device is disposed on the load carrying device, the load carrying device moves an electronic device carried by the modular pressing device to a testing seat, the modular pressing device presses the electronic device to have the electronic device installed in the testing seat, and the testing seat tests the electronic device.
