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US 2019/0172735 A1Published application
Apparatus and method for processing wafer
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYou-Hua CHOU, Min-Hao HONG, Kuan-Chung CHEN
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Abstract
A method includes delivering a wafer into a process chamber, applying a thermal energy to the wafer by a heat source, and moving the heat source substantially along a longitudinal direction of the heat source with respect to the wafer. An apparatus that performs the method is also disclosed.
Claims20
A method, comprising:
- delivering a wafer into a process chamber;
- applying a thermal energy to the wafer by a heat source;
- and
- moving the heat source substantially along a longitudinal direction of the heat source with respect to the wafer.
1 more element
A method, comprising:
- delivering a wafer into a process chamber;
- applying thermal energy to the wafer by a heat source;
- and
- rotating the heat source using a spherical joint.
1 more element
An apparatus, comprising:
- a process chamber;
- a wafer support in the process chamber;
- a sleeve in the process chamber;
- and
- a lamp socket movably received in the sleeve.
2 more elements
Dependencies are inferred from the claim text.