# US 2019/0172691 A1 · Heating carrier device for use on sputtering cathode assembly

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- Number: US 2019/0172691 A1
- Document ID: US20190172691A1
- Status: Published application
- Kind: A1
- Application number: 15/974,858
- Filed: 2018-05-09
- Published: 2019-06-06
- Earliest claimed: 2017-12-04
- Assignees: National Chung Shan Institute of Science and Technology
- Applicants: National Chung Shan Institute of Science and Technology
- Inventors: CHOU-YU LIN; HUI-YUN BOR; CHAO-NAN WEI; CHIEN-HUNG LIAO; SHEA-JUE WANG; SHIH-FAN CHEN
- Web page: https://patentgrep.com/patent/US20190172691A1

## CPC

- H01J 37/3497: {Temperature of target}
- C23C 14/3407: {Cathode assembly for sputtering apparatus, e.g. Target}
- C23C 14/3421: {using heated targets}
- H01J 37/3435: {Target holders (includes backing plates and endblocks)}
- H01J 37/345: {Magnet arrangements in particular for cathodic sputtering apparatus (material of magnets or magnets in general H01F1/00, H01F7/00)}
- H01J 2237/002: Cooling arrangements
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)

## Abstract

A heating carrier device for use on a sputtering cathode assembly has a heating carrier for heating a sputtering target to control a sputtering target temperature; a magnetic component for generating a magnetic field; a thermal insulation component disposed between the heating carrier and the magnetic component; and a cooling system for cooling the magnetic component. Therefore, the heating carrier device reduces the bonding strength of the sputtering target, reduces the particle size of sputtering products, and grows high-quality, uniform thin films.

## Claims

### Claim 1

A heating carrier device for use on a sputtering cathode assembly, the heating carrier device comprising:
a heating carrier for heating a sputtering target to control a sputtering target temperature;
a magnetic component for generating a magnetic field;
a thermal insulation component disposed between the heating carrier and the magnetic component; and
a cooling system for cooling the magnetic component.

### Claim 2 (depends on 1)

The heating carrier device of claim 1, wherein the heating carrier has a temperature detection component for detecting the sputtering target temperature.

### Claim 3 (depends on 1)

The heating carrier device of claim 1, wherein the heating carrier keeps the sputtering target at a control temperature ranging from room temperature to two-thirds of a melting point of a sputtering target material.

### Claim 4 (depends on 1)

The heating carrier device of claim 1, wherein the cooling system cools the sputtering target.

### Claim 5 (depends on 1)

The heating carrier device of claim 1, wherein the thermal insulation component is made of a ceramic material.

### Claim 6 (depends on 1)

The heating carrier device of claim 1, wherein the cooling system is a water-cooled cooling system.

### Claim 7 (depends on 1)

The heating carrier device of claim 1, wherein the magnetic component is a permanent magnet.