# US 2019/0172647 A1 · Multilayer ceramic capacitor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0172647 A1 - Document ID: US20190172647A1 - Status: Published application - Kind: A1 - Application number: 16/260,702 - Filed: 2019-01-29 - Published: 2019-06-06 - Earliest claimed: 2017-01-25 - Assignees: Holy Stone Enterprise Co., Ltd. - Applicants: Holy Stone Enterprise Co., Ltd. - Inventors: Atsuo NAGAI; Sheng-Yi CHEN - Web page: https://patentgrep.com/patent/US20190172647A1 ## CPC - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G 4/008: Selection of materials - H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)} - H01G 4/1227: {based on alkaline earth titanates} - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/2325: {characterised by the material of the terminals} - H01G 4/248: the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) - H05K 1/181: associated with surface mounted components - H05K 2201/10015: Non-printed capacitor - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A multilayer ceramic capacitor and a method of manufacturing the same are disclosed. A base part of the multilayer ceramic capacitor includes ceramic dielectric and inner electrodes formed inside the ceramic dielectric, and a terminal of each of the inner electrodes is exposed out of one of the two opposite sides of the base part, to form inner electrode terminals. First outer electrodes are formed on the two sides of the base part and the outside of the inner electrode terminals, and second outer electrodes are formed on the first outer electrodes. The first outer electrodes and the base part are formed together by sintering manner, and the second outer electrodes are formed by metal powder and resin material, thereby solving the problem that the vitreous component diffuses around, or solving the problem that plating solution permeates into the base part or the ceramic dielectric during plating process. ## Claims ### Claim 1 A multilayer ceramic capacitor, comprising: a base part comprising ceramic dielectric and a plurality of inner electrodes; an outer electrode layer formed at two opposite sides of the base part; wherein each of the plurality of inner electrodes comprises an inner electrode terminal exposed out of one of the two opposite sides of the ceramic dielectric, and the outer electrode layer comprises first outer electrodes formed at the two opposite sides of the base part and second outer electrodes formed on outside of the first outer electrodes; wherein the first outer electrodes are formed by sintering the base part and powder of nickel and barium titanate with particle size in 0.5 μm, and the first outer electrodes are electrical connected to the inner electrode terminals at the sides of the inner electrodes. ### Claim 2 (depends on 1) The multilayer ceramic capacitor according to claim 1, wherein the first outer electrode comprises dielectric layer comprising barium titanate and nickel as primary component, and a volume percentage of barium titanate to nickel is in range of 15 vol % to 55 vol %. ### Claim 3 (depends on 2) The multilayer ceramic capacitor according to claim 2, wherein the volume percentage of barium titanate to nickel is in range of 15 vol % to 50 vol %. ### Claim 4 (depends on 2) The multilayer ceramic capacitor according to claim 2, wherein a thickness of the first outer electrode is in range of 5 μm to 70 μm. ### Claim 5 (depends on 4) The multilayer ceramic capacitor according to claim 4, wherein a second outer electrode is formed by metal powder and resin material, and the metal powder is selected from the group consisting of silver powder, nickel powder and copper powder, and a particle size of the metal powder is in range of 0.3 μm to 1.0 μm. ### Claim 6 (depends on 5) The multilayer ceramic capacitor according to claim 5, wherein an outer electrode layer further comprises third outer electrodes formed by performing a plating process on outside of the second outer electrodes. ### Claim 7 (depends on 5) The multilayer ceramic capacitor according to claim 5, further comprising a substrate or a circuit board, wherein the substrate or the circuit board comprises at least one conductive line electrically connected to the second outer electrode. ### Claim 8 (depends on 4) The multilayer ceramic capacitor according to claim 4, wherein second outer electrodes are formed by metal powder and resin material, and the metal powder is selected from the group consisting of silver powder, nickel powder and the copper powder, and includes a particle size of the metal powder in a range of 0.3 μm to 1.0 μm. ### Claim 9 A multilayer ceramic capacitor, comprising: a base part comprising ceramic dielectric and a plurality of inner electrodes; an outer electrode layer formed at two opposite sides of the base part; wherein each of the plurality of inner electrodes comprises an inner electrode terminal exposed out of one of the two opposite sides of the ceramic dielectric, and the outer electrode layer comprises first outer electrodes formed at the two opposite sides of the base part and second outer electrodes formed on outside of the first outer electrodes; wherein the first outer electrodes are formed by sintering the base part and powder of nickel and barium titanate with the same particle size, which is in a smaller range than 1.0 μm, and the first outer electrodes are electrical connected to the inner electrode terminals at the sides of the inner electrodes. ### Claim 10 (depends on 9) The multilayer ceramic capacitor according to claim 9, wherein the first outer electrode comprises dielectric layer comprising barium titanate and nickel as primary component, and a volume percentage of barium titanate to nickel is in range of 15 vol % to 55 vol %. ### Claim 11 (depends on 10) The multilayer ceramic capacitor according to claim 10, wherein the volume percentage of barium titanate to nickel is in range of 15 vol % to 50 vol %. ### Claim 12 (depends on 10) The multilayer ceramic capacitor according to claim 10, wherein a thickness of the first outer electrode is in range of 5 μm to 70 μm. ### Claim 13 (depends on 12) The multilayer ceramic capacitor according to claim 12, wherein a second outer electrode is formed by metal powder and resin material, and the metal powder is selected from the group consisting of silver powder, nickel powder and copper powder, and a particle size of the metal powder is in range of 0.3 μm to 1.0 μm. ### Claim 14 (depends on 13) The multilayer ceramic capacitor according to claim 13, wherein an outer electrode layer further comprises third outer electrodes formed by performing a plating process on outside of the second outer electrodes. ### Claim 15 (depends on 13) The multilayer ceramic capacitor according to claim 13, further comprising a substrate or a circuit board, wherein the substrate or the circuit board comprises at least one conductive line electrically connected to the second outer electrode. ### Claim 16 (depends on 12) The multilayer ceramic capacitor according to claim 12, wherein second outer electrodes are formed by metal powder and resin material, and the metal powder is selected from the group consisting of silver powder, nickel powder and the copper powder, and includes a particle size of the metal powder in a range of 0.3 μm to 1.0 μm.