# US 2019/0172645 A1 · Multilayer capacitor and board having the same

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- Number: US 2019/0172645 A1
- Document ID: US20190172645A1
- Status: Published application
- Kind: A1
- Application number: 16/270,745
- Filed: 2019-02-08
- Published: 2019-06-06
- Earliest claimed: 2017-09-06
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Jong Pil LEE; Hyo Youn LEE; Sung Kwon AN; Seung Woo SONG; Taek Jung LEE; Jin Kyung JOO
- Web page: https://patentgrep.com/patent/US20190172645A1

## CPC

- H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor
- H01G 2/06: specially adapted for mounting on a printed-circuit support
- H01G 4/012: Form of non-self-supporting electrodes
- H01G 4/248: the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence)
- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- H05K 1/181: associated with surface mounted components
- H01G 4/1227: {based on alkaline earth titanates}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 2201/10015: Non-printed capacitor
- H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

A multilayer capacitor and a board having the same provide high capacitance and low equivalent series inductance (ESL). The multilayer capacitor includes a capacitor body including an active region, including first and second internal electrodes, and first and second cover regions. Third and fourth internal electrodes are alternately disposed in the cover region adjacent to a mounting surface. First and second external electrodes respectively contact the first and second internal electrodes to provide capacitance. First and second via electrodes are disposed in the cover region, where the first via electrode connects the third internal electrode and a first band portion of the first external electrode to each other, and where the second via electrode connects the fourth internal electrode and a second band portion of the second external electrode to each other.

## Claims

### Claim 1

A multilayer capacitor comprising:
a capacitor body having first and second surfaces opposing each other and third and fourth surfaces connected to the first and second surfaces and opposing each other, and including an active region including dielectric layers and pluralities of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween and first and second cover regions disposed on opposite surfaces of the active region, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively;
third and fourth internal electrodes alternately disposed in the first cover region adjacent to the first surface with respective dielectric layers interposed therebetween;
first and second external electrodes including first and second connected portions respectively formed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes and first and second band portions respectively extending from the first and second connected portions to portions of the first surface of the capacitor body;
a third external electrode disposed on the first surface of the capacitor body to be spaced apart from the first band portion;
a fourth external electrode disposed on the first surface of the capacitor body to be spaced apart from the second band portion;
a first via electrode penetrating through the first cover region to connect the third internal electrode and the third external electrode to each other; and
a second via electrode penetrating through the first cover region to connect the fourth internal electrode and the fourth external electrode to each other,
wherein the first surface is a mounting surface.

### Claim 2 (depends on 1)

The multilayer capacitor of claim 1, wherein the multilayer capacitor includes pluralities of third and fourth internal electrodes including third and fourth internal electrodes alternately disposed in the second cover region adjacent to the second surface with respective dielectric layers interposed therebetweeen,
the first and second band portions further extend from the first and second connected portions to portions of the second surface of the capacitor body,
the multilayer capacitor includes pluralities of third and fourth external electrodes including third and fourth external electrodes disposed on the second surface of the capacitor body to be spaced apart from the first and second band portions, respectively, and
the multilayer capacitor includes pluralities of first and second via electrodes including first and second via electrodes disposed in the second cover region.

### Claim 3 (depends on 1)

The multilayer capacitor of claim 1, wherein the third and fourth internal electrodes are disposed to be spaced apart from all edges of the capacitor body.

### Claim 4 (depends on 1)

The multilayer capacitor of claim 1, wherein the dielectric layer of the first cover region has first and second via through-holes formed therein with the first and second via electrodes penetrating therethrough,
the third internal electrode includes a first via hole formed to have a size corresponding to that of the first via through-hole in a position corresponding to that of the first via through-hole, and
the fourth internal electrode includes a second via hole formed to have a size corresponding to that of the second via through-hole in a position corresponding to that of the second via through-hole.

### Claim 5 (depends on 4)

The multilayer capacitor of claim 4, wherein the third internal electrode includes a first via spacing hole formed to have a size greater than that of the second via through-hole in a position corresponding to that of the second via through-hole, and
the fourth internal electrode includes a second via spacing hole formed to have a size greater than that of the first via through-hole in a position corresponding to that of the first via through-hole.

### Claim 6 (depends on 1)

The multilayer capacitor of claim 1, wherein each of the dielectric layers disposed in the first and second cover regions has a thickness equal to or greater than a thickness of each of the dielectric layers disposed in the active region.

### Claim 7 (depends on 1)

The multilayer capacitor of claim 1, wherein the multilayer capacitor includes pluralities of first and second via electrodes including the first and second via electrodes.

### Claim 8 (depends on 7)

The multilayer capacitor of claim 7, wherein the multilayer capacitor includes pluralities of third and fourth external electrodes each corresponding to and connected to a respective one of the pluralities of first and second via electrodes.

### Claim 9 (depends on 1)

A board having a multilayer capacitor, comprising:
a circuit board having first and second electrode pads disposed thereon to be spaced apart from each other; and
the multilayer capacitor of claim 1 mounted on the circuit board so that the first band portion and the third external electrode are connected to the first electrode pad and the second band portion and the fourth external electrode are connected to the second electrode pad.

### Claim 10

A multilayer capacitor comprising:
a body comprising pluralities of dielectric layers and internal electrodes alternately disposed therein; and
first and second external electrodes disposed on respective opposing first and second end surfaces of the body and each extending to third and fourth surfaces of the body,
wherein the plurality of internal electrodes includes:
first and second internal electrodes alternately disposed to overlap each other in the body and respectively extending to the first and second end surfaces of the body; and
pluralities of third and fourth internal electrodes alternately disposed to overlap each other in first and second cover regions of the body disposed between a respective one of the third and fourth surfaces of the body and an active region including the first and second internal electrodes,
the body further comprises pluralities of first and second via electrodes, a first via electrode and a second via electrode extending from the third surface to a respective one of the third and fourth internal electrodes in the first cover region, and another first via electrode and another second via electrode extending from the fourth surface to a respective one of the third and fourth internal electrodes in the second cover region, and
the first and second via electrodes in the first cover region contact extensions of the first and second external electrodes, respectively, on the third surface of the body.

### Claim 11

A multilayer capacitor comprising:
a body comprising pluralities of dielectric layers and internal electrodes alternately disposed therein; and
first and second external electrodes disposed on respective opposing first and second end surfaces of the body and each extending to third and fourth surfaces of the body,
wherein the plurality of internal electrodes includes:
first and second internal electrodes alternately disposed to overlap each other in the body and respectively extending to the first and second end surfaces of the body; and
pluralities of third and fourth internal electrodes alternately disposed to overlap each other in first and second cover regions of the body disposed between a respective one of the third and fourth surfaces of the body and an active region including the first and second internal electrodes,
the body further comprises pluralities of first and second via electrodes, a first via electrode and a second via electrode extending from the third surface to a respective one of the third and fourth internal electrodes in the first cover region, and another first via electrode and another second via electrode extending from the fourth surface to a respective one of the third and fourth internal electrodes in the second cover region, and
the multilayer capacitor further comprises third and fourth external electrodes disposed on the third surface of the body and respectively contacting the first and second via electrodes of the first cover region.