# US 2019/0171785 A1 · Radio frequency isolation structure

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2019/0171785 A1
- Document ID: US20190171785A1
- Status: Published application
- Kind: A1
- Application number: 16/267,914
- Filed: 2019-02-05
- Published: 2019-06-06
- Earliest claimed: 2012-07-13
- Assignees: Skyworks Solutions, Inc.
- Applicants: Skyworks Solutions, Inc.
- Inventors: Howard E. Chen; Matthew Sean Read; Hoang Mong Nguyen; Anthony James LoBianco; Guohao Zhang; Dinhphuoc Vu Hoang
- Web page: https://patentgrep.com/patent/US20190171785A1

## CPC

- G06F 30/392: Floor-planning or layout, e.g. partitioning or placement
- H05K 1/181: associated with surface mounted components
- H10W 42/00: Arrangements for protection of devices (arrangements for thermal protection H10W40/00)
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation}
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 70/635: {Through-vias}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 72/50: Bond wires
- H10W 74/014: {using batch processing}
- H10W 44/206: {Wires}
- H10W 44/209: {Vertical interconnections, e.g. vias}
- H10W 44/226: {for HF amplifiers}
- H10W 44/248: {for antennas}
- H10W 72/0198: {batch processes}
- H10W 72/073: {of die-attach connectors}
- H10W 72/075: {of bond wires}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Aspects of the present disclosure relate to a packaged module with a radio frequency isolation structure that includes a racetrack, a conductive layer, and a conductive feature in an electrical path between the racetrack and the conductive layer. The racetrack can be disposed in a substrate and configured at a ground potential. The racetrack can include a break.

## Claims

### Claim 1

(canceled)

### Claim 2

A packaged module comprising:
a substrate having a major surface;
a radio frequency component coupled to the major surface of the substrate; and
a radio frequency isolation structure including a racetrack in the substrate, a conductive layer positioned such that the radio frequency component is located between the conductive layer and the major surface of the substrate, and a conductive feature in an electrical path between the racetrack and the conductive layer, the racetrack configured at a ground potential and disposed around the radio frequency component, and the racetrack having a break.

### Claim 3 (depends on 2)

The packaged module of claim 2 wherein the radio frequency component includes a power amplifier.

### Claim 4 (depends on 2)

The packaged module of claim 2 wherein the break in the racetrack is disposed in an area of the packaged module that is associated with a minimum radiation around a perimeter of the packaged module.

### Claim 5 (depends on 2)

The packaged module of claim 2 wherein the radio frequency isolation structure further includes a via in an electrical path between the racetrack and the conductive feature.

### Claim 6 (depends on 2)

The packaged module of claim 2 wherein the break is located in a low radiating area that is associated with less electromagnetic radiation than other portions of the racetrack.

### Claim 7 (depends on 6)

The packaged module of claim 6 further comprising a via in the substrate, the conductive feature being a wire bond in contact with a wire bond pad, and the via being in an electrical path between the racetrack and the wire bond pad.

### Claim 8 (depends on 2)

The packaged module of claim 2 wherein the break is located in a low radiating area of the packaged module, and the radio frequency component is configured to emit less electromagnetic radiation to the low radiating area of the packaged module than to other areas of the packaged module.

### Claim 9 (depends on 2)

The packaged module of claim 2 wherein the break is located in a low radiating area of the packaged module, and the low radiating area has a lower activity factor relative to other areas of the packaged module.

### Claim 10 (depends on 2)

The packaged module of claim 2 further comprising a second racetrack in the substrate, the second racetrack being in the electrical path between the racetrack and the conductive layer.

### Claim 11 (depends on 2)

The packaged module of claim 2 wherein the racetrack has at least one narrowed section.

### Claim 12 (depends on 2)

The packaged module of claim 2 wherein the radio frequency component includes a high band portion and a low band portion.

### Claim 13 (depends on 2)

The packaged module of claim 2 wherein the radio frequency component includes at least one of a voltage-controlled oscillator, a filter, or a switch.

### Claim 14

A wireless device comprising:
an antenna configured to facilitate at least one of transmitting or receiving a radio frequency signal;
a packaged module including a substrate having a major surface; a radio frequency component coupled to the major surface of the substrate, the radio frequency component in communication with the antenna; and a radio frequency isolation structure including a racetrack in the substrate, a conductive layer positioned such that the radio frequency component is located between the conductive layer and the major surface of the substrate, and a conductive feature in an electrical path between the racetrack and the conductive layer, the racetrack configured at a ground potential and disposed around the radio frequency component, and the racetrack having a break; and
an other electronic module in communication with the packaged module.

### Claim 15 (depends on 14)

The wireless device of claim 14 wherein the break is disposed in a low radiating area of the packaged module.

### Claim 16 (depends on 15)

The wireless device of claim 15 wherein the radio frequency component is configured to emit less electromagnetic radiation to the low radiating area of the packaged module than to other areas of the packaged module.

### Claim 17 (depends on 15)

The wireless device of claim 15 wherein the packaged module is configured to receive less electromagnetic radiation at the low radiating area of the packaged module from the other electronic module than at other areas of the packaged module.

### Claim 18 (depends on 14)

The wireless device of claim 14 wherein the break is located in a low radiating area that is associated with less electromagnetic radiation than other portions of the racetrack.

### Claim 19 (depends on 18)

The packaged module of claim 18 further comprising a via in the substrate, the conductive feature being a wire bond in contact with a wire bond pad, and the via being in an electrical path between the racetrack and the wire bond pad.

### Claim 20 (depends on 14)

The wireless device of claim 14 wherein the radio frequency component includes a power amplifier.

### Claim 21 (depends on 14)

The wireless device of claim 14 wherein the packaged module further includes a via in the substrate, the via being in the electrical path between the racetrack and the conductive layer.