# US 2019/0171193 A1 · Design method of semiconductor manufacturing apparatus and non-transitory computer-readable storage medium storing a program of causing computer to execute design method of semiconductor manufacturing apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0171193 A1 - Document ID: US20190171193A1 - Status: Published application - Kind: A1 - Application number: 16/207,678 - Filed: 2018-12-03 - Published: 2019-06-06 - Earliest claimed: 2017-12-06 - Assignees: Ebara Corporation - Applicants: Ebara Corporation - Inventors: Ryuichiro MITANI; Mitsunori SUGIYAMA; Akihiko OGAWA - Web page: https://patentgrep.com/patent/US20190171193A1 ## CPC - B24B 27/0023: {grinding machines with a plurality of working posts} - G05B 19/41835: {characterised by program execution} - B24B 37/013: Devices or means for detecting lapping completion - B24B 37/105: {the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement} - B24B 49/16: taking regard of the load - B24B 53/017: Devices or means for dressing, cleaning or otherwise conditioning lapping tools - G06F 30/00: Computer-aided design [CAD] - G06F 30/10: Geometric CAD - G06F 30/30: Circuit design - H10P 72/0458: {vertical arrangement} - H10P 72/0472: {comprising at least one polishing chamber} - H10P 72/0612: {Production flow monitoring, e.g. for increasing throughput} - G05B 2219/45031: Manufacturing semiconductor wafers - G05B 2219/45199: Polish - G06F 2119/18: Manufacturability analysis or optimisation for manufacturability - Y02P 90/02: Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS] - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS - G05B: CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS (systems for controlling or regulating non-electric variables G05D; systems for regulating electric or magnetic variables G05F; control devices or systems insofar as characterised by mechanical features only G05G) - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A design method of a semiconductor manufacturing apparatus which can satisfy a specification required by a user is disclosed. The design method of the semiconductor manufacturing apparatus includes creating a program setting file; creating a program installer from the program setting file; operating a processing unit of the semiconductor manufacturing apparatus; specifying a sensor corresponding to the processing unit based on the operation of the processing unit; creating a sensor setting file storing information obtained by specifying the sensor; comparing a content of a requirement specification and a content of the sensor setting file to confirm a consistency between the content of the requirement specification and the content of the sensor setting file; and introducing a program into a memory of a controller by the program installer when the content of the requirement specification and the content of the sensor setting file are consistent with each other. ## Claims ### Claim 1 A design method of a semiconductor manufacturing apparatus comprising: creating a program setting file storing setting information of a program necessary for executing a process with respect to the semiconductor manufacturing apparatus based on a requirement specification from a user; creating a program installer for introducing the program into a controller of the semiconductor manufacturing apparatus from the program setting file; operating a processing unit of the semiconductor manufacturing apparatus; specifying a sensor corresponding to the processing unit based on the operation of the processing unit; creating a sensor setting file storing information obtained by specifying the sensor; comparing a content of the requirement specification and a content of the sensor setting file to confirm a consistency between the content of the requirement specification and the content of the sensor setting file; and introducing the program into a memory of the controller by the program installer when the content of the requirement specification and the content of the sensor setting file are consistent with each other. ### Claim 2 (depends on 1) The method according to claim 1, wherein specifying the sensor comprises: operating the processing unit to output sensor data from the sensor; and specifying the sensor corresponding to the processing unit based on the output sensor data. ### Claim 3 (depends on 1) The method according to claim 1, wherein specifying the sensor comprises: rotating a plurality of polishing tables at different rotational speeds, in a state of connecting a table torque sensor to at least one of the polishing tables in the processing unit; confirming the presence or absence of output of the sensor data of the table torque sensor; and determining whether or not the table torque sensor is connected to each of the polishing tables based on the presence or absence of output of the sensor data. ### Claim 4 (depends on 3) The method according to claim 3, wherein specifying the sensor comprises: specifying the table torque sensor corresponding to each of the polishing tables based on different sensor data of a plurality of table torque sensors output corresponding to the different rotational speeds when determining connections of the table torque sensors to the polishing tables. ### Claim 5 (depends on 1) The method according to claim 1, wherein specifying the sensor comprises: rotating the polishing tables at different rotational speeds in a state of connecting a trigger sensor and a film thickness measurement sensor corresponding to the trigger sensor to at least one of the polishing tables in the processing unit; confirming the presence or absence of sensor data of the film thickness measurement sensor at a timing of a trigger signal output by the trigger sensor; and determining whether or not the film thickness measurement sensor is connected to each of the polishing tables based on the presence or absence of output of the sensor data. ### Claim 6 (depends on 5) The method according to claim 5, wherein specifying the sensor comprises: specifying the film thickness measurement sensor corresponding to each of the polishing tables based on the sensor data of the film thickness measurement sensor at different timings of trigger signals when specifying connection of film thickness measurement sensors to the polishing tables. ### Claim 7 A non-transitory computer-readable storage medium storing a program of causing a computer to execute a design method of a semiconductor manufacturing apparatus, the program causing the computer to perform operations of: creating a program setting file storing setting information of a program necessary for executing a process with respect to the semiconductor manufacturing apparatus based on a requirement specification from a user; creating a program installer for introducing the program necessary for executing the process into a controller of the semiconductor manufacturing apparatus from the program setting file; operating a processing unit of the semiconductor manufacturing apparatus; specifying a sensor corresponding to the processing unit based on the operation of the processing unit; creating a sensor setting file storing information obtained by specifying the sensor; comparing a content of the requirement specification and a content of the sensor setting file to confirm a consistency between the content of the requirement specification and the content of the sensor setting file; and introducing the program necessary for executing the process into a memory of the controller by the program installer when the content of the requirement specification and the content of the sensor setting file are consistent with each other. ### Claim 8 (depends on 7) The storage medium according to claim 7, wherein causing the computer to perform the operations comprises causing the computer to perform operations of: operating the processing unit to output sensor data from the sensor; and specifying the sensor corresponding to the processing unit based on the output sensor data. ### Claim 9 (depends on 7) The storage medium according to claim 7, wherein causing the computer to perform the operations comprises causing the computer to perform operations of: rotating a plurality of polishing tables at different rotational speeds, in a state of connecting a table torque sensor to at least one of the polishing tables in the processing unit; confirming the presence or absence of output of the sensor data of the table torque sensor; and determining whether or not the table torque sensor is connected to each of the polishing tables based on the presence or absence of output of the sensor data. ### Claim 10 (depends on 9) The storage medium according to claim 9, wherein causing the computer to perform the operations comprises causing the computer to perform operations of: specifying the table torque sensor corresponding to each of the polishing tables based on different sensor data of a plurality of table torque sensors output according to the different rotational speeds when determining connections of the table torque sensors to the polishing tables. ### Claim 11 (depends on 7) The storage medium according to claim 7, wherein causing the computer to perform the operations comprises causing the computer to perform operations of: rotating the polishing tables at different rotational speeds, respectively, in a state of connecting a trigger sensor and a film thickness measurement sensor corresponding to the trigger sensor to at least one of the polishing tables in the processing unit; confirming the presence or absence of sensor data of the film thickness measurement sensor at a timing of a trigger signal output by the trigger sensor; and determining whether or not the film thickness measurement sensor is connected to each of the polishing tables based on the presence or absence of output of the sensor data. ### Claim 12 (depends on 11) The storage medium according to claim 11, wherein causing the computer to perform the operations comprises causing the computer to perform operations of: specifying the film thickness measurement sensor corresponding to each of the polishing tables based on the sensor data of the film thickness measurement sensor at different timings of trigger signals when specifying the connections of film thickness measurement sensors to the polishing tables.