# US 2019/0170950 A1 · Semiconductor chip package having optical interface > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0170950 A1 - Document ID: US20190170950A1 - Status: Published application - Kind: A1 - Application number: 16/251,244 - Filed: 2019-01-18 - Published: 2019-06-06 - Earliest claimed: 2015-11-11 - Assignees: Giparang Co., Ltd. - Applicants: Giparang Co., Ltd. - Inventors: Sang Don LEE - Web page: https://patentgrep.com/patent/US20190170950A1 ## CPC - G02B 6/423: {using guiding surfaces for the alignment} - G02B 6/4206: {Optical features (G02B6/4207, G02B6/421 take precedence)} - G02B 6/4242: {Mounting of the optical light guide to the lid of the package} - G02B 6/4256: {Details of housings} - G02B 6/428: {containing printed circuit boards [PCB]} - H10W 70/611: {for connecting multiple chips together} - H10W 70/635: {Through-vias} - H10W 70/65: Shapes or dispositions of interconnections - H10W 72/50: Bond wires - H10W 90/00: Package configurations - G02B 6/4214: {the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence)} - G02B 6/4284: {of optical modules with disconnectable electrical connectors (latching arms for electrical connectors H01R13/627)} - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 44/248: {for antennas} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 70/682: {comprising holes having chips therein} - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/5522: {comprising gold [Au]} - H10W 72/9413: {on encapsulations} - H10W 72/951: {Materials of bond pads} - H10W 74/10: characterised by their shape or disposition - H10W 74/117: {the substrate having spherical bumps for external connection} - H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation} - H10W 74/47: comprising organic materials, e.g. plastics or resins - H10W 90/10: Configurations of laterally-adjacent chips - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract A semiconductor package including: a chip having a first surface; a mold having a first surface and a second surface configured to encapsulate the chip; a conduction structure electrically connecting the first surface and the second surface of the mold; an optical device arranged on the first surface of the mold to be electrically connected to the conduction structure; a wiring pattern configured to electrically connect the conduction structure and a pad formed on the first surface of the chip, and perform electrical connection in the semiconductor package; and an external connection terminal configured to electrically connect the semiconductor package to the outside. ## Claims ### Claim 1 A semiconductor package comprising: a chip having a first surface; a mold having a first surface and a second surface configured to encapsulate the chip; a conduction structure electrically connecting the first surface and the second surface of the mold; an optical device arranged on the first surface of the mold to be electrically connected to the conduction structure; a wiring pattern configured to electrically connect the conduction structure and a pad formed on the first surface of the chip, and perform electrical connection in the semiconductor package; and an external connection terminal configured to electrically connect the semiconductor package to the outside. ### Claim 2 (depends on 1) The semiconductor package of claim 1, wherein the conduction structure comprises a vertical conductive channel that passes through the mold from the first surface to the second surface. ### Claim 3 (depends on 1) The semiconductor package of claim 1, wherein the conduction structure comprises: a via substrate having a via that passes through the via substrate; and a vertical conductive channel that penetrates the mold from the first surface and electrically connected to the via, wherein the via electrically connects the vertical conductive channel and the wiring pattern. ### Claim 4 (depends on 1) The semiconductor package of claim 1, wherein the chip comprises at least one of: an amplifier circuit configured to process an electrical signal supplied from the optical device; and a driver circuit configured to supply the electrical signal to the optical device. ### Claim 5 (depends on 1) The semiconductor package of claim 1, wherein the semiconductor package comprises a plurality of chips, wherein the plurality of chips comprise at least one of: a chip including an amplifier circuit; and a chip including a driver circuit. ### Claim 6 (depends on 1) The semiconductor package of claim 1, further comprising at least one signal processing chip. ### Claim 7 (depends on 1) The semiconductor package of claim 1, wherein the mold is a hardened epoxy mold compound (EMC). ### Claim 8 (depends on 1) The semiconductor package of claim 1, wherein the semiconductor package comprises a plurality of chips, wherein the wiring pattern electrically connects the plurality of chips to one another. ### Claim 9 (depends on 1) The semiconductor package of claim 1, wherein the optical device comprises at least one of: a light-emitting device; and a light-receiving device. ### Claim 10 (depends on 9) The semiconductor package of claim 9 wherein the light-emitting device comprises one of: a light-emitting diode; and a vertical cavity surface emitting laser (VCSEL), wherein the light-receiving device is a photodiode. ### Claim 11 (depends on 1) The semiconductor package of claim 1, wherein the optical device comprises an optical module configured to disperse or concentrate light. ### Claim 12 (depends on 1) The semiconductor package of claim 1, wherein the optical device and the conduction structure are electrically connected to each other via a pad formed on one surface of the optical device and by wire-bonding with the vertical conductive channel or are electrically connected to each other when a pad formed on a rear surface of the optical device is connected to the conduction structure. ### Claim 13 (depends on 1) The semiconductor package of claim 1, wherein the external connection terminal comprises a solder ball or a metal bump. ### Claim 14 (depends on 1) The semiconductor package of claim 1, further comprising an optical-cable fixing member configured to fix an optical cable which transmits an optical signal to the optical device from the outside of the semiconductor package or transmits an optical signal to the outside of the semiconductor package from the optical device. ### Claim 15 (depends on 14) The semiconductor package of claim 14, wherein the optical-cable fixing member comprises: a housing; and an opening formed through which the optical cable is inserted into the housing. ### Claim 16 (depends on 14) The semiconductor package of claim 14, wherein the optical-cable fixing member further comprises an optical-path change member configured to reflect or refract an optical signal supplied between the optical cable and the optical device so as to change a path of the optical signal. ### Claim 17 (depends on 14) The semiconductor package of claim 14, wherein the optical-cable fixing member is aligned with the optical device, and is arranged on either the mold or a circuit board having the semiconductor package thereon. ### Claim 18 (depends on 14) The semiconductor package of claim 14, wherein the optical-cable fixing member further comprises an optical module configured to disperse or concentrate an optical signal supplied via the optical cable or an optical signal to be supplied to the optical cable. ### Claim 19 (depends on 1) The semiconductor package of claim 1, wherein the external connection terminal comprises a conductive strip provided on a surface of the semiconductor package. ### Claim 20 (depends on 1) The semiconductor package of claim 1, wherein the conductive strip is arranged to satisfy a data transmission standard. ### Claim 21 (depends on 20) The semiconductor package of claim 20, wherein the data transmission standard comprises one of Universal Serial Bus (USB), IEEE 1394 Firewire, Thunderbolt, lightning, and High-Definition Multimedia Interface (HDMI). ### Claim 22 (depends on 1) The semiconductor package of claim 1, wherein the semiconductor package is accommodated in a housing, wherein the housing fixes an optical cable via which an optical signal is transmitted to or received from the optical device. ### Claim 23 (depends on 1) The semiconductor package of claim 1, wherein the semiconductor package is accommodated in a housing, wherein the housing comprises an intermediate connection terminal configured to electrically connect an external device and the semiconductor package to each other.