# US 2019/0170816 A1 · Probe head securing mechanism for probe assembly

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- Number: US 2019/0170816 A1
- Document ID: US20190170816A1
- Status: Published application
- Kind: A1
- Application number: 15/829,676
- Filed: 2017-12-01
- Published: 2019-06-06
- Earliest claimed: 2017-12-01
- Assignees: Xilinx, Inc.
- Applicants: Xilinx, Inc.
- Inventors: Mohsen H. Mardi; Lik Huay Lim; King Yon Lew; Andy Widjaja
- Web page: https://patentgrep.com/patent/US20190170816A1

## CPC

- G01R 1/07371: {using an intermediate card or back card with apertures through which the probes pass}
- G01R 31/2889: {Interfaces, e.g. between probe and tester (G01R31/31905 and G01R1/07364 take precedence)}
- G01R 31/2886: {Features relating to contacting the IC under test, e.g. probe heads; chucks (G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06)}
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)

## Abstract

Methods and apparatus are described relating to a probe assembly having a probe head securing mechanism that includes a lock ring housing and a lock ring disposed in the lock ring housing. In an example, a probe assembly includes a rigid substrate, a circuit board coupled to the rigid substrate, and a probe head securing mechanism. The probe head securing mechanism includes a lock ring housing and a lock ring disposed within the lock ring housing. The circuit board has a surface. The lock ring housing is coupled to the rigid substrate. The circuit board is disposed between the lock ring housing and the rigid substrate. The lock ring is rotatable relative to the lock ring housing. Rotation of the lock ring is configured to move the lock ring in a direction perpendicular to the surface of the circuit board.

## Claims

### Claim 1

A probe assembly comprising:
a rigid substrate;
a circuit board coupled to the rigid substrate, the circuit board having a surface; and
a probe head securing mechanism comprising:
a lock ring housing coupled to the rigid substrate, the circuit board being disposed between the lock ring housing and the rigid substrate; and
a lock ring disposed within the lock ring housing, the lock ring being rotatable relative to the lock ring housing, rotation of the lock ring being configured to move the lock ring in a direction perpendicular to the surface of the circuit board.

### Claim 2 (depends on 1)

The probe assembly of claim 1, wherein the lock ring housing has an interior sidewall at least partially encircling the lock ring.

### Claim 3 (depends on 2)

The probe assembly of claim 2, wherein:
the interior sidewall has a helical channel;
the lock ring has a flange along a lateral exterior; and
the flange is engaged in the helical channel.

### Claim 4 (depends on 1)

The probe assembly of claim 1, wherein the lock ring has a central aperture, the central aperture being configured to permit a probe head assembly to be inserted therethrough and to secure the probe head assembly within the probe head securing mechanism upon insertion of the probe head assembly and rotation of the lock ring relative to the lock ring housing.

### Claim 5 (depends on 1)

The probe assembly of claim 1, wherein the lock ring has a central aperture, the lock ring having a plurality of projections extending in a direction towards a center of the central aperture.

### Claim 6 (depends on 1)

The probe assembly of claim 1, wherein:
the probe head securing mechanism further includes a ball bearing coupled to a spring;
the lock ring has a notch or a hole; and
the ball bearing and the spring are positioned to engage the notch or the hole of the lock ring when the lock ring is in a position configured to secure a probe head assembly within the probe head securing mechanism.

### Claim 7 (depends on 1)

The probe assembly of claim 1, wherein:
the lock ring has a central aperture, the central aperture being configured to permit a probe head assembly to be inserted therethrough; and
at least two guide pins extend from the circuit board, the at least two guide pins being positioned to engage the probe head assembly upon being inserted through the central aperture.

### Claim 8 (depends on 1)

The probe assembly of claim 1, wherein the probe head securing mechanism is configured such that:
rotation of the lock ring in a clockwise direction relative to the lock ring housing moves the lock ring in a direction toward the surface of the circuit board, and
rotation of the lock ring in a counterclockwise direction relative to the lock ring housing moves the lock ring in a direction away from the surface of the circuit board.

### Claim 9

A method of testing, comprising:
securing a probe head assembly in a probe assembly comprising:
inserting the probe head assembly through a lock ring of the probe assembly, the lock ring being at a first position relative to a lock ring housing of the probe assembly, the lock ring being disposed in the lock ring housing of the probe assembly, the lock ring housing being attached to a rigid substrate of the probe assembly, a circuit board being disposed between the lock ring housing and the rigid substrate; and
rotating the lock ring relative to the lock ring housing to a second position relative to the lock ring housing, the lock ring at the second position applying a force to the probe head assembly to secure the probe head assembly; and
testing a wafer using the probe head assembly secured in the probe assembly.

### Claim 10 (depends on 9)

The method of claim 9 further comprising, after testing the wafer, removing the probe head assembly from the probe assembly comprising:
rotating the lock ring relative to the lock ring housing to the first position relative to the lock ring housing; and
removing the probe head assembly through the lock ring at the first position relative to the lock ring housing.

### Claim 11 (depends on 10)

The method of claim 10, wherein:
rotating the lock ring relative to the lock ring housing to the second position relative to the lock ring housing is in a clockwise direction; and
rotating the lock ring relative to the lock ring housing to the first position relative to the lock ring housing is in a counterclockwise direction.

### Claim 12 (depends on 9)

The method of claim 9, wherein:
the lock ring housing has an interior sidewall at least partially encircling the lock ring;
the interior sidewall has a helical channel;
the lock ring has a flange along a lateral exterior;
the flange is engaged in the helical channel; and
rotating the lock ring relative to the lock ring housing causes the flange to move along the helical channel.

### Claim 13 (depends on 9)

The method of claim 9, wherein:
the lock ring has a central aperture having an aperture layout pattern, the lock ring having locking projections extending toward a center of the central aperture;
the probe head assembly has a probe head layout pattern corresponding to the aperture layout pattern, the probe head assembly having probe projections in the probe head layout pattern;
the probe head assembly is inserted through the central aperture of the lock ring;
as the probe head assembly is being inserted through the central aperture, the probe projections extend between respective neighboring pairs of the locking projections; and
when the lock ring is at the second position securing the probe head assembly, the locking projections overlap and apply the force to the probe projections.

### Claim 14 (depends on 9)

The method of claim 9, wherein inserting the probe head assembly through the lock ring comprises engaging at least two guide pins extending from the circuit board to respective guide pin holes of the probe head assembly.

### Claim 15 (depends on 9)

The method of claim 9, wherein, at the second position relative to the lock ring housing, a ball bearing of the lock ring housing engages a notch or a hole of the lock ring.

### Claim 16

A probe assembly comprising:
a rigid substrate;
a circuit board coupled to the rigid substrate; and
a probe head securing mechanism comprising:
a lock ring having a flange along a lateral exterior; and
a lock ring housing coupled to the rigid substrate, the circuit board being disposed between the lock ring housing and the rigid substrate, the lock ring housing having an interior sidewall at least partially encircling the lock ring, the interior sidewall having a helical channel, the flange of the lock ring being engaged in the helical channel, the lock ring being rotatable relative to the lock ring housing, the flange being moveable along the helical channel during rotation of the lock ring.

### Claim 17 (depends on 16)

The probe assembly of claim 16, wherein:
the lock ring has a central aperture configured to permit a probe head assembly to be inserted therethrough; and
the lock ring further has projections extending towards a center of the central aperture, the projections being configured to overlap and apply a force to at least a portion of the probe head assembly when the lock ring is rotated relative to the lock ring housing to a position to secure the probe head assembly in the probe head securing mechanism.

### Claim 18 (depends on 17)

The probe assembly of claim 17, wherein respective surfaces of the projections configured to apply the force have Teflon® thereon.

### Claim 19 (depends on 16)

The probe assembly of claim 16, wherein:
the probe head securing mechanism further includes a ball bearing coupled to a spring;
the lock ring has a notch or a hole; and
the ball bearing is positioned to engage the notch or the hole of the lock ring when the lock ring is in a position configured to secure a probe head assembly within the probe head securing mechanism.

### Claim 20 (depends on 16)

The probe assembly of claim 16, wherein:
the lock ring has a central aperture, the central aperture being configured to permit a probe head assembly to be inserted therethrough; and
at least two guide pins extend from the circuit board, the at least two guide pins being positioned to engage the probe head assembly upon being inserted through the central aperture.