# US 2019/0170665 A1 · Defect inspection device, defect inspection method, and program > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0170665 A1 - Document ID: US20190170665A1 - Status: Published application - Kind: A1 - Application number: 16/268,719 - Filed: 2019-02-06 - Published: 2019-06-06 - Earliest claimed: 2016-08-18 - Assignees: FUJIFILM Corporation - Applicants: FUJIFILM Corporation - Inventors: Yasuhiko KANEKO - Web page: https://patentgrep.com/patent/US20190170665A1 ## CPC - G01N 23/04: and forming images of the material - G01N 21/88: Investigating the presence of flaws or contamination - G01N 21/8851: {Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges (G01N21/8806 and G01N21/93 - G01N21/95692 take precedence; optical measurement of dimensions G01B11/00; optical scanning G02B26/10; image transformation G06T3/00; computerised image enhancement G06T5/00; image processing per se for flaw detection G06T7/0002)} - G06T 7/0004: {Industrial image inspection} - G01N 2021/8883: {involving the calculation of gauges, generating models} - G01N 2223/03: by transmission - G01N 2223/052: reflection - G01N 2223/401: image processing - G01N 2223/646: flaws, defects - G06T 2207/30108: Industrial image inspection - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) - G06T: IMAGE DATA PROCESSING OR GENERATION, IN GENERAL ## Abstract An object of the present invention is to provide a defect inspection device, a defect inspection method, and a program capable of accurately and rapidly detecting a minute defect and a defect candidate image indicated by a minute signal in a received light image of an inspection object. A defect inspection device (10) includes an image acquisition unit (I/F 16), an input unit (I/F 16), an exposure condition acquisition unit (I/F 16), a storage unit (24), and a parameter determination unit (processing unit 22) that determines an image processing parameter for a received light image on the basis of an exposure condition acquired by the exposure condition acquisition unit, a physical feature received by the input unit, and exposure information stored in the storage unit, and an image processing unit (processing unit 22) that extracts a defect candidate image which is an image corresponding to a defect candidate of the inspection object from the received light image by performing image processing of the received light image on the basis of the image processing parameter determined by the parameter determination unit (processing unit 22). ## Claims ### Claim 1 A defect inspection device comprising: an image acquisition unit that acquires a received light image created on the basis of transmitted light or reflected light of an inspection object obtained by irradiating the inspection object with radiation; an input unit that receives an input of a physical feature including at least a material of the inspection object; an exposure condition acquisition unit that acquires an exposure condition of the radiation; a storage unit that stores exposure information that is a relationship among the physical feature, an irradiation condition of the radiation, and shading of the received light image; a parameter determination unit that determines an image processing parameter for the received light image on the basis of the exposure condition acquired by the exposure condition acquisition unit, the physical feature received by the input unit, and the exposure information stored in the storage unit; an image processing unit that extracts a defect candidate image which is an image corresponding to a defect candidate of the inspection object from the received light image by performing image processing of the received light image on the basis of the image processing parameter determined by the parameter determination unit; and a thickness calculation unit that calculates a thickness of each local area of the inspection object on the basis of the received light image acquired by the image acquisition unit, the exposure condition acquired by the exposure condition acquisition unit, and the exposure information stored in the storage unit, wherein the parameter determination unit determines the image processing parameter corresponding the thickness of each local area of the inspection object calculated by the thickness calculation unit. ### Claim 2 (depends on 1) The defect inspection device according to claim 1, wherein the parameter determination unit calculates a shading condition corresponding to a thickness of the inspection object on the basis of the exposure condition acquired by the exposure condition acquisition unit, the physical feature received by the input unit, and the exposure information stored in the storage unit and calculates a noise level of the received light image on the basis of the calculated shading condition and the received light image acquired by the image acquisition unit to determine the image processing parameter. ### Claim 3 (depends on 2) The defect inspection device according to claim 2, wherein the image acquisition unit acquires a plurality of the received light images of the inspection object, the exposure condition acquisition unit acquires the exposure condition of each of the plurality of received light images, and the parameter determination unit calculates the shading condition of each of the plurality of received light images and calculates the noise level on the basis of the calculated shading condition of the plurality of received light images and the plurality of received light images acquired by the image acquisition unit, to determine the image processing parameters. ### Claim 4 A defect inspection device comprising: an image acquisition unit that acquires a received light image created on the basis of transmitted light or reflected light of an inspection object obtained by irradiating the inspection object with radiation; an input unit that receives an input of a physical feature including at least a material of the inspection object; an exposure condition acquisition unit that acquires an exposure condition of the radiation; a storage unit that stores exposure information that is a relationship among the physical feature, an irradiation condition of the radiation, and shading of the received light image; a parameter determination unit that determines an image processing parameter for the received light image on the basis of the exposure condition acquired by the exposure condition acquisition unit, the physical feature received by the input unit, and the exposure information stored in the storage unit; an image processing unit that extracts a defect candidate image which is an image corresponding to a defect candidate of the inspection object from the received light image by performing image processing of the received light image on the basis of the image processing parameter determined by the parameter determination unit; and a thickness calculation unit that calculates a thickness of each local area of the inspection object on the basis of the received light image acquired by the image acquisition unit, the exposure condition acquired by the exposure condition acquisition unit, and the exposure information stored in the storage unit, wherein the storage unit further stores a noise level according to the thickness of the inspection object, and the parameter determination unit determines the image processing parameter for each local area of the inspection object from the thickness of each local area of the inspection object calculated by the thickness calculation unit and the noise level stored in the storage unit. ### Claim 5 (depends on 1) The defect inspection device according to claim 1, wherein the storage unit stores a plurality of pieces of the exposure information. ### Claim 6 (depends on 4) The defect inspection device according to claim 4, wherein the storage unit stores a plurality of pieces of the exposure information. ### Claim 7 (depends on 1) The defect inspection device according to claim 1, wherein the storage unit stores the exposure information based on an exposure diagram. ### Claim 8 (depends on 4) The defect inspection device according to claim 4, wherein the storage unit stores the exposure information based on an exposure diagram. ### Claim 9 (depends on 1) The defect inspection device according to claim 1, further comprising: a depth calculation unit that calculates a depth from a surface of the inspection object to a position of the defect candidate on the basis of the received light image acquired by the image acquisition unit, the exposure condition acquired by the exposure condition acquisition unit, and the exposure information stored in the storage unit. ### Claim 10 (depends on 4) The defect inspection device according to claim 4, further comprising: a depth calculation unit that calculates a depth from a surface of the inspection object to a position of the defect candidate on the basis of the received light image acquired by the image acquisition unit, the exposure condition acquired by the exposure condition acquisition unit, and the exposure information stored in the storage unit. ### Claim 11 (depends on 1) The defect inspection device according to claim 1, wherein the physical feature regarding the material includes at least one of a density or an atomic number of the inspection object. ### Claim 12 (depends on 4) The defect inspection device according to claim 4, wherein the physical feature regarding the material includes at least one of a density or an atomic number of the inspection object. ### Claim 13 (depends on 1) The defect inspection device according to claim 1, wherein the irradiation condition is at least one of an irradiation intensity or an irradiation time of the radiation. ### Claim 14 (depends on 4) The defect inspection device according to claim 4, wherein the irradiation condition is at least one of an irradiation intensity or an irradiation time of the radiation. ### Claim 15 (depends on 1) The defect inspection device according to claim 1, wherein the input unit receives an input of a thickness of the inspection object as the physical feature, and the exposure condition acquisition unit calculates an appropriate exposure condition on the basis of the thickness and the material which are the physical features of the inspection object, and the exposure information stored in the storage unit to thereby acquire the exposure condition. ### Claim 16 (depends on 1) The defect inspection device according to claim 1, wherein the exposure condition acquisition unit acquires information on a state of a radiation source in a case where the received light image acquired by the image acquisition unit has been created, and calculates the exposure condition on the basis of the information on the state of the radiation source. ### Claim 17 A defect inspection method comprising: an image acquisition step of acquiring a received light image created on the basis of transmitted light or reflected light of an inspection object obtained by irradiating the inspection object with radiation; an input step of receiving an input of a physical feature including at least a material of the inspection object; an exposure condition acquisition step of acquiring an exposure condition of the radiation; a storage step of storing exposure information that is a relationship among the physical feature, an irradiation condition of the radiation, and shading of the received light image; a parameter determination step of determining an image processing parameter for the received light image on the basis of the exposure condition acquired in the exposure condition acquisition step, the physical feature received in the input step, and the exposure information stored in the storage step; an image processing step of extracting a defect candidate image which is an image corresponding to a defect candidate of the inspection object from the received light image by performing image processing of the received light image on the basis of the image processing parameter determined in the parameter determination step; and. a thickness calculation step of calculating a thickness of each local area of the inspection object on the basis of the received light image acquired in the image acquisition step, the exposure condition acquired in the exposure condition acquisition step, and the exposure information stored in the storage step, wherein the parameter determination step determines the image processing parameter corresponding the thickness of each local area of the inspection object calculated in the thickness calculation step. ### Claim 18 A defect inspection method comprising: an image acquisition step of acquiring a received light image created on the basis of transmitted light or reflected light of an inspection object obtained by irradiating the inspection object with radiation; an input step of receiving an input of a physical feature including at least a material of the inspection object; an exposure condition acquisition step of acquiring an exposure condition of the radiation; a storage step of storing exposure information that is a relationship among the physical feature, an irradiation condition of the radiation, and shading of the received light image; a parameter determination step of determining an image processing parameter for the received light image on the basis of the exposure condition acquired in the exposure condition acquisition step, the physical feature received in the input step, and the exposure information stored in the storage step; an image processing step of extracting a defect candidate image which is an image corresponding to a defect candidate of the inspection object from the received light image by performing image processing of the received light image on the basis of the image processing parameter determined in the parameter determination step; and. a thickness calculation step of calculating a thickness of each local area of the inspection object on the basis of the received light image acquired in the image acquisition step, the exposure condition acquired in the exposure condition acquisition step, and the exposure information stored in the storage step, wherein the storage step includes further storing a noise level according to the thickness of the inspection object, and the parameter determination step includes determining the image processing parameter for each local area of the inspection object from the thickness of each local area of the inspection object calculated in the thickness calculation step and the noise level stored in the storage step. ### Claim 19 (depends on 17) A non-transitory computer-readable tangible medium storing a program which causes a computer to realize the defect inspection method according to claim 17. ### Claim 20 (depends on 18) A non-transitory computer-readable tangible medium storing a program which causes a computer to realize the defect inspection method according to claim 18.