# US 2019/0170571 A1 · Emitter Module for an LED Illumination Device

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- Number: US 2019/0170571 A1
- Document ID: US20190170571A1
- Status: Published application
- Kind: A1
- Application number: 16/231,925
- Filed: 2018-12-24
- Published: 2019-06-06
- Earliest claimed: 2014-06-25
- Assignees: Lutron Ketra, LLC
- Applicants: Lutron Ketra, LLC
- Inventors: Kuo-Lih Chang; Mickey Malone; Horace C. Ho
- Web page: https://patentgrep.com/patent/US20190170571A1

## CPC

- G01J 1/0252: {Constructional arrangements for compensating for fluctuations caused by, e.g. temperature, or using cooling or temperature stabilization of parts of the device; Controlling the atmosphere inside a photometer; Purge systems, cleaning devices (protection against electromagnetic interferences G01J2001/0276)}
- G01J 1/32: adapted for automatic variation of the measured or reference value (regulation of light intensity G05D25/00)
- G01J 3/0286: {Constructional arrangements for compensating for fluctuations caused by temperature, humidity or pressure, or using cooling or temperature stabilization of parts of the device; Controlling the atmosphere inside a spectrometer, e.g. vacuum}
- G01J 3/465: {taking into account the colour perception of the eye; using tristimulus detection}
- G01J 3/502: {using a dispersive element, e.g. grating, prism}
- G01J 3/505: {measuring the colour produced by lighting fixtures other than screens, monitors, displays or CRTs}
- H05B 45/20: Controlling the colour of the light
- H05B 45/46: having LEDs disposed in parallel lines
- H05B 47/19: via wireless transmission
- G01J 2001/4252: {for testing LED's}
- G01J 2001/444: {Compensating; Calibrating, e.g. dark current, temperature drift, noise reduction or baseline correction; Adjusting}
- G01J: MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY (light sources F21, H01J, H01K, H05B; investigating properties of materials by optical means G01N)
- H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL

## Abstract

An illumination device comprises one or more emitter modules having improved thermal and electrical characteristics. According to one embodiment, each emitter module comprises a plurality of light emitting diodes (LEDs) configured for producing illumination for the illumination device, one or more photodetectors configured for detecting the illumination produced by the plurality of LEDs, a substrate upon which the plurality of LEDs and the one or more photodetectors are mounted, wherein the substrate is configured to provide a relatively high thermal impedance in the lateral direction, and a relatively low thermal impedance in the vertical direction, and a primary optics structure coupled to the substrate for encapsulating the plurality of LEDs and the one or more photodetectors within the primary optics structure.

## Claims

### Claim 1

An illumination device comprising:
a substrate comprising a top surface and a bottom surface;
a light source configured for producing illumination for the illumination device, the light source mounted to the top surface of the substrate; and
a heat sink coupled to the bottom surface of the substrate; and
wherein the substrate comprises:
a first routing layer coupled to electrical contacts of the light source;
a first dielectric layer coupled to a bottom surface the first routing layer and configured for providing electrical isolation between the electrical contacts and the heat sink;
a second routing layer coupled to a bottom surface of the first dielectric layer and configured for routing electrical signals; and
a second dielectric layer coupled to a bottom surface of the second routing layer and configured for providing a first thermal impedance in a lateral direction, and a second thermal impedance lower than the first thermal impedance in a vertical direction.

### Claim 2 (depends on 1)

The illumination device as recited in claim 1, wherein the light source comprises at least one light emitting diode (LED).

### Claim 3 (depends on 2)

The illumination device as recited in claim 2, further comprising a primary optics structure coupled to the top surface of the substrate for encapsulating the at least one LED within the primary optics structure.

### Claim 4 (depends on 3)

The illumination device as recited in claim 3, wherein the second routing layer is configured for routing electrical signals between the first routing layer and external electrical contacts arranged outside of the primary optics structure.

### Claim 5 (depends on 2)

The illumination device as recited in claim 2, wherein the at least one LED comprises at least four LEDs, which are mounted on the substrate close together and arranged in an array near a center of the primary optics structure.

### Claim 6 (depends on 2)

The illumination device as recited in claim 2, wherein the at least one LED comprises a red LED, a green LED, a blue LED and a white or yellow LED.

### Claim 7 (depends on 6)

The illumination device as recited in claim 6, further comprising one or more photodetectors mounted on the substrate in proximity to the at least one LED, wherein the photodetectors comprise at least one of a red LED, an orange LED or a yellow LED.

### Claim 8 (depends on 2)

The illumination device as recited in claim 2, wherein the at least one LED comprises a chain of red LEDs, a chain of green LEDs, a chain of blue LEDs, and a chain of white or yellow LEDs, and wherein each chain comprises two to four LEDs of a same color.

### Claim 9 (depends on 1)

The illumination device as recited in claim 1, wherein a thickness of the heat sink ranges between about 1 mm and about 10 mm.

### Claim 10 (depends on 1)

The illumination device as recited in claim 1, wherein the heat sink is formed from a material having a thermal conductivity that ranges between about 200 W/(mK) and about 400 W/(mK).

### Claim 11 (depends on 1)

The illumination device as recited in claim 1, wherein heat sink is formed from a copper, copper-alloy, aluminum, or aluminum alloy material.

### Claim 12 (depends on 1)

The illumination device as recited in claim 1, wherein a thickness of the substrate ranges between about 300 μm and about 500 μm.

### Claim 13 (depends on 1)

The illumination device as recited in claim 1, wherein the first dielectric layer is formed from a material having a relative permittivity that ranges between about 8 and 12 and a thermal conductivity less than about 150 W/(mK), and wherein a thickness of the first dielectric layer ranges between about 10 μm and about 100 μm.

### Claim 14 (depends on 1)

The illumination device as recited in claim 1, wherein the second dielectric layer is formed from a material having a relative permittivity that ranges between about 3 and 12 and a thermal conductivity less than about 150 W/(mK), and wherein a thickness of the second dielectric layer ranges between about 100 μm and about 1000 μm.

### Claim 15 (depends on 1)

The illumination device as recited in claim 1, wherein first dielectric layer and the second dielectric layer are each formed from an aluminum nitride material or an aluminum oxide material.

### Claim 16 (depends on 1)

The illumination device as recited in claim 1, wherein the second dielectric layer provides the first thermal impedance in the lateral direction by implementing the second dielectric layer with a material having a thermal conductivity less than about 150 W/(mK), and wherein the second dielectric layer provides the second thermal impedance in the vertical direction by including a plurality of thermally conductive lines, which extend vertically through the second dielectric layer between the second routing layer and the heat sink.

### Claim 17 (depends on 16)

The illumination device as recited in claim 16, wherein the plurality of thermally conductive lines are formed from a material having a thermal conductivity that ranges between about 200 W/(mK) and about 400 W/(mK).

### Claim 18 (depends on 16)

The illumination device as recited in claim 16, wherein the plurality of thermally conductive lines are formed from a copper, copper-alloy, aluminum, or aluminum alloy material.

### Claim 19 (depends on 16)

The illumination device as recited in claim 16, wherein the plurality of thermally conductive lines are formed as a plurality of densely packed, metal filled vias.

### Claim 20 (depends on 16)

The illumination device as recited in claim 16, further comprising a third routing layer coupled between the second dielectric layer and the heat sink, wherein the third routing layer extends across an upper surface of the heat sink for improving thermal contact between the plurality of thermally conductive lines and the heat sink and improving heat spreading there across.