# US 2019/0170171 A1 · Device for transporting a medium and assembly method

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- Number: US 2019/0170171 A1
- Document ID: US20190170171A1
- Status: Published application
- Kind: A1
- Application number: 16/208,099
- Filed: 2018-12-03
- Published: 2019-06-06
- Earliest claimed: 2017-12-04
- Assignees: Kme Germany GmbH & Co. KG; Agt-Psg GmbH & Co. KG
- Applicants: Kme Germany GmbH & Co. KG; Agt-Psg GmbH & Co. KG
- Inventors: Peter Böhlke; Raimund Boldt; Peter Daniewski; Eduard Krämer; Hans-Günther Wobker
- Web page: https://patentgrep.com/patent/US20190170171A1

## CPC

- F15D 1/02: in pipes or conduits
- F16L 9/02: of metal (F16L9/16 - F16L9/22 take precedence)
- F16L 9/12: of plastics with or without reinforcement (F16L9/16 - F16L9/22 take precedence)
- F16L 11/045: {with four or more layers without reinforcement}
- F16L 11/127: electrically conducting
- F16L 53/38: using elongate electric heating elements, e.g. wires or ribbons
- F16L 59/143: {Pre-insulated pipes}
- F16L 59/153: for flexible pipes
- H05F 3/02: by means of earthing connections
- F15D: FLUID DYNAMICS, i.e. METHODS OR MEANS FOR INFLUENCING THE FLOW OF GASES OR LIQUIDS
- F16L: PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- H05F: STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY

## Abstract

A device for transporting a medium includes at least one channel which extends in an axial direction and through which the medium is guided. The channel is enclosed by an electrically conductive inner envelope that is connected to a first potential equalization conductor. An electrically conductive outer envelope is provided between the channel and an electrically conductive outer casing and is connected to an electrically conductive second potential equalization conductor. Arranged between the channel and the outer envelope is an electrically insulating intermediate layer which is produced from heat-insulating material.

## Claims

### Claim 1

A device for transporting a medium, comprising:
a first potential equalization conductor;
an electrically conductive inner envelope configured to enclose a channel which extends in an axial direction for passage of a medium, said inner envelope being connected to the first potential equalization conductor;
an outer casing configured to be electrically conductive;
an electrically conductive second potential equalization conductor;
an electrically conductive outer envelope provided between the channel and the outer casing and connected to the second potential equalization conductor; and
an electrically insulating intermediate layer arranged between the channel and the outer envelope and produced from heat-insulating material.

### Claim 2 (depends on 1)

The device of claim 1, wherein the outer casing is made of thermoplastic resin with 1 to 6 wt % carbon nanotubes.

### Claim 3 (depends on 1)

The device of claim 1, wherein the outer casing is made of 4 to 6 wt % carbon nanotubes and thermoplastic urethane.

### Claim 4 (depends on 1)

The device of claim 1, further comprising an end piece and a conductive cap placed upon the end piece.

### Claim 5 (depends on 4)

The device of claim 4, further comprising a conductive shrink tube applied to the cap and to at least one area of the outer casing to secure the cap and to conductively connect the cap to the outer casing.

### Claim 6 (depends on 4)

The device of claim 4, wherein the cap is made of polytetrafluoroethylene (PTFE)

### Claim 7 (depends on 1)

The device of claim 1, wherein the channel is produced from thermoplastic resin.

### Claim 8 (depends on 1)

The device of claim 1, wherein the channel is produced from a metal alloy.

### Claim 9 (depends on 1)

The device of claim 1, further comprising a heating device arranged inside the channel for controlling a temperature of the medium.

### Claim 10 (depends on 1)

The device of claim 1, wherein the outer envelope is configured as a metal foil.

### Claim 11

A method for tailoring a device for transporting a medium, said method comprising:
trimming the device in at least one location to form an end piece;
sealing the end piece;
placing a conductive cap over the end piece; and
applying a conductive shrink tube upon the cap and to at least one area of an outer casing of the device.

### Claim 12 (depends on 11)

The method of claim 11, wherein the conductive cap is made of PTFE.

### Claim 13 (depends on 11)

The method of claim 11, wherein the shrink tube is made of dissipative PE and is free of lead and cadmium.

### Claim 14 (depends on 11)

The method of claim 11, wherein the shrink tube is made of dissipative PA-based adhesive and is free of lead and cadmium.

### Claim 15 (depends on 11)

The method of claim 11, wherein the shrink tube is made of dissipative PE and dissipative PA-based adhesive in the absence of lead and cadmium.