# US 2019/0169744 A1 · Substrate treatment apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0169744 A1 - Document ID: US20190169744A1 - Status: Published application - Kind: A1 - Application number: 15/754,943 - Filed: 2016-08-02 - Published: 2019-06-06 - Earliest claimed: 2015-08-24 - Assignees: Meyer Burger (Germany) GmbH - Applicants: Meyer Burger (Germany) GmbH - Inventors: Sebastian RASCHKE; Erik ANSORGE; Mirko KEHR; Christian BOEHM - Web page: https://patentgrep.com/patent/US20190169744A1 ## CPC - C23C 16/4581: {characterised by material of construction or surface finish of the means for supporting the substrate} - C23C 14/50: Substrate holders - C23C 14/541: {Heating or cooling of the substrates} - C23C 14/56: Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks - C23C 16/4582: {Rigid and flat substrates, e.g. plates or discs (C23C16/4581 takes precedence)} - C23C 16/46: characterised by the method used for heating the substrate (C23C16/48, C23C16/50 take precedence) - C23C 16/463: {Cooling of the substrate} - C23C 16/54: Apparatus specially adapted for continuous coating - H10P 72/0432: {mainly by conduction} - H10P 72/0434: {mainly by convection} - H10P 72/0602: {Temperature monitoring} - H10P 72/7614: {characterised by a plurality of individual support members, e.g. support posts or protrusions} - H10P 72/7618: {characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel} - H10P 72/7621: {characterised by supporting two or more semiconductor substrates} - H10P 72/7624: {characterised by the mechanical construction of the susceptor, stage or support} - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A substrate treatment apparatus for treating substrates has a plate-shaped substrate carrier and at least one plate-shaped tempering device, which is arranged parallel to the substrate carrier. The substrate carrier has a substrate carrier front side for supporting at least one laminar substrate and a substrate carrier back side, which faces the tempering device. The object of the present invention is to provide a substrate treatment apparatus which enables a heat distribution as evenly as possible in the substrate carrier. For that purpose, there is provided at least one spacer element for forming a distance between the substrate carrier and the tempering device at the substrate carrier back side and/or a surface of the tempering device facing the substrate carrier. ## Claims ### Claim at position 1 1-11. (canceled) ### Claim 12 A substrate treatment apparatus for treating substrates, the substrate treatment apparatus comprising: a plate-shaped substrate carrier having a substrate carrier front side for carrying at least one planar substrate and a substrate carrier back side; at least one plate-shaped tempering device arranged in parallel to said substrate carrier and facing towards said substrate carrier back side; at least one spacer element defining a spacing distance between said substrate carrier and said tempering device; and at least one receptacle module for receiving running rails mounted to said substrate carrier. ### Claim 13 (depends on 12) The substrate treatment apparatus according to claim 12, wherein said at least one spacer element is disposed on said substrate carrier back side and/or on a surface of said tempering device facing the substrate carrier. ### Claim 14 (depends on 12) The substrate treatment apparatus according to claim 12, wherein said at least one spacer element is one of a multitude of the spacer elements for forming the distance between said substrate carrier and said tempering device. ### Claim 15 (depends on 12) The substrate treatment apparatus according to claim 12, wherein a material of said at least one spacer element has a lower thermal conductivity than a material of said substrate carrier. ### Claim 16 (depends on 12) The substrate treatment apparatus according to claim 12, wherein said at least one spacer element projects from said substrate carrier and/or from said tempering device by a height between 0.1 mm and 1 mm. ### Claim 17 (depends on 12) The substrate treatment apparatus according to claim 12, wherein said at least one spacer element is configured with a variable height. ### Claim 18 (depends on 12) The substrate treatment apparatus according to claim 12, wherein said substrate carrier is formed of an electrically conductive material. ### Claim 19 (depends on 12) The substrate treatment apparatus according to claim 12, wherein said substrate carrier is coated with at least one electrically conductive material. ### Claim 20 (depends on 12) The substrate treatment apparatus according to claim 12, wherein said substrate carrier has a thickness between said substrate carrier front side and said substrate carrier back side of between 8 mm and 21 mm. ### Claim 21 (depends on 12) The substrate treatment apparatus according to claim 12, wherein said substrate carrier back side is formed with a surface modification and/or a surface coating configured to absorb more thermal radiation than a basic material of said substrate carrier. ### Claim 22 (depends on 12) The substrate treatment apparatus according to claim 12, which comprises at least one connecting element connecting said at least one receptacle module to said substrate carrier, said connecting element having a smaller cross section and/or a greater length than a receptacle module in one connecting direction between said substrate carrier and said receptacle module. ### Claim 23 (depends on 22) The substrate treatment apparatus according to claim 22, wherein said at least one receptacle module and/or said connecting element are formed from a material or a material compound having a lower thermal conductivity than a material of said substrate carrier.