# US 2019/0169478 A1 · Debondable compositions

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2019/0169478 A1
- Document ID: US20190169478A1
- Status: Published application
- Kind: A1
- Application number: 16/000,193
- Filed: 2018-06-05
- Published: 2019-06-06
- Earliest claimed: 2015-12-09
- Assignees: Henkel IP & Holding GmbH; Henkel AG & Co. KGaA
- Applicants: Henkel IP & Holding GmbH; Henkel AG & Co. Kgaa
- Inventors: Shengqian KONG; Yayun LIU; Wenhua ZHANG; Stephen HYNES; John G. WOODS; Jiangbo OUYANG; Chunyu SUN; Bahram ISSARI
- Web page: https://patentgrep.com/patent/US20190169478A1

## CPC

- C09J 183/06: containing silicon bound to oxygen-containing groups (C09J183/12 takes precedence)
- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- B32B 37/12: characterised by using adhesives
- B32B 37/18: involving the assembly of discrete sheets or panels only
- B32B 43/006: {Delaminating}
- C09J 5/00: Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J 5/06: involving heating of the applied adhesive
- B32B 2310/0831: using UV radiation
- B32B 2457/00: Electrical equipment
- C08G 77/12: containing silicon bound to hydrogen
- C08G 77/20: containing silicon bound to unsaturated aliphatic groups
- C09J 7/35: Heat-activated
- C09J 131/00: Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid (based on hydrolysed polymers C09J129/00); Adhesives based on derivatives of such polymers
- C09J 2301/40: characterized by the presence of essential components
- C09J 2301/414: presence of a copolymer
- C09J 2301/416: use of irradiation
- C09J 2301/502: process for debonding adherents
- C09J 2483/00: Presence of polysiloxane
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS

## Abstract

Dual-cure compositions for use in high temperature adhesive applications, and particularly for temporarily adhesively attaching one substrate to another substrate, are provided. These dual-cure adhesives are silicone-based compositions that can be B-staged by exposure UV radiation to provide initial green strength, followed by a C-stage cure to give adhesives that can survive high temperature processes above 200° C., especially above 300° C., yet easy to debond afterwards to allow separation of the top and bottom substrates.

## Claims

### Claim 1

A composition comprising
(a) a polysiloxane resin having one or more vinyl groups;
(b) a (meth)acrylate polysiloxane resin having at least two (meth)acrylate groups; and
(c) an initiator comprising the combination of a photoinitiator and one of a peroxide or a hydridosiloxane or hydridopolysiloxane.

### Claim 2 (depends on 1)

The composition of claim 1, wherein the hydridosiloxane or hydridopolysiloxane is present and further comprising a metal catalyst.

### Claim 3 (depends on 1)

The composition of claim 1, wherein at least one of the polysiloxane resin having vinyl groups or the (meth)acrylate polysiloxane resin having at least two (meth)acrylate groups have pendant vinyl groups or (meth)acrylate groups, respectively.

### Claim 4 (depends on 1)

The composition of claim 1, curable by at least one of exposure to radiation in the electromagnetic spectrum or exposure to elevated temperature conditions.

### Claim 5 (depends on 1)

The composition of claim 1, wherein the initial storage modulus (measured at room temperature at a frequency of 1 Hz) exceeds 103 Pa, after exposure to radiation in the electromagnetic spectrum.

### Claim 6 (depends on 1)

The composition of claim 1, wherein the initial storage modulus (measured at room temperature at a frequency of 1 Hz) exceeds 5×103 Pa but is less than 106 Pa, after exposure to radiation in the electromagnetic spectrum.

### Claim 7 (depends on 1)

The composition of claim 1, wherein the initial storage modulus (measured at room temperature at a frequency of 1 Hz) exceeds 5×103 Pa but is less than less than 3×105 Pa, after exposure to radiation in the electromagnetic spectrum.

### Claim 8 (depends on 1)

The composition of claim 1, wherein the final storage modulus exceeds 106 Pa (measured at room temperature at a frequency of 1 Hz), after exposure to elevated temperature conditions.

### Claim 9 (depends on 1)

The composition of claim 1, wherein the vinyl polysiloxane has a mole % vinylmethylsiloxane unit in the range of 1-99%.

### Claim 10 (depends on 1)

The composition of claim 1, wherein the vinyl polysiloxane has a mole % vinylmethylsiloxane unit in the range of 4.0-13.0%

### Claim 11 (depends on 1)

The composition of claim 1, wherein the ratio of vinyl polysiloxane to (meth)acrylate polysiloxane resin is from 99:1 to 40:60.

### Claim 12 (depends on 1)

The composition of claim 1, wherein the ratio of vinyl functionality to (meth)acrylate functionality is 21:1 to 0.29:1.

### Claim 13 (depends on 1)

An assembly comprising:
a substrate,
a carrier, and
a composition of claim 1 disposed between the carrier and the substrate.

### Claim 14 (depends on 1)

A method for bonding a substrate to a carrier comprising:
(a) providing a substrate;
(b) providing a carrier;
(c) composing a composition of claim 1 onto at least one of the substrate or the carrier;
(d) contacting the substrate and carrier so that the composition is disposed between the carrier and the substrate, forming an assembly; and
(e) radically curing the composition by
(i) exposing the assembly to radiation in the electromagnetic spectrum;
(ii) exposing the assembly to elevated temperature conditions, or
(iii) (i) followed by (ii).

### Claim 15 (depends on 1)

A method for debonding a substrate from a carrier to which it is adhesively bonded, comprising:
(a) providing an assembly comprising a substrate and a carrier with a composition of claim 1 therebetween; and
(b) separating the substrate from the carrier.

### Claim 16 (depends on 15)

The method of claim 15, wherein the composition shows at least one of initial storage modulus (measured at room temperature at a frequency of 1 Hz) exceeds 103 Pa, after exposure to radiation in the electromagnetic spectrum; initial storage modulus (measured at room temperature at a frequency of 1 Hz) exceeds 5×103 Pa but is less than 106 Pa, after exposure to radiation in the electromagnetic spectrum; initial storage modulus (measured at room temperature at a frequency of 1 Hz) exceeds 5×103 Pa but is less than less than 3×105 Pa, after exposure to radiation in the electromagnetic spectrum and final storage modulus exceeds 106 Pa (measured at room temperature at a frequency of 1 Hz), after exposure to elevated temperature conditions.

### Claim 17 (depends on 1)

The composition of claim 1, wherein the a polysiloxane resin having one or more vinyl groups (a) is a vinylmethylsiloxane-dimethylsiloxane copolymer, trimethylsiloxy terminated; the a (meth)acrylate polysiloxane resin having at least two (meth)acrylate groups (b) is an (acryloxypropyl)methylsiloxane-dimethylsiloxane copolymer; and the initiator comprising the combination of a photoinitiator and one of a peroxide or a hydridosiloxane or hydridopolysiloxane (c) is (i)
and 1,1-di-(t-amylperoxy)-cyclohexane or (ii)
polymethyl hydrosiloxane, trimethylsiloxyterminated, 3,5-dimethyl-hexyn-3-ol, and platinum-divinyltetramethyldisiloxane complex.