# US 2019/0169470 A1 · Water Vapor-Blocking Adhesive Compound Having Highly Functionalized Poly(meth)acrylate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0169470 A1 - Document ID: US20190169470A1 - Status: Published application - Kind: A1 - Application number: 16/097,779 - Filed: 2017-03-15 - Published: 2019-06-06 - Earliest claimed: 2016-05-02 - Assignees: Tesa SE - Applicants: Tesa SE - Inventors: Thilo DOLLASE; Jessika GARGIULO; Marco KUPSKY; Bastian WEDEL - Web page: https://patentgrep.com/patent/US20190169470A1 ## CPC - C09J 133/068: {containing glycidyl groups} - C08L 33/06: of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical - C09J 5/06: involving heating of the applied adhesive - C09J 7/22: Plastics; Metallised plastics - C09J 7/385: {Acrylic polymers} - C09J 11/06: organic - H10K 59/873: {Encapsulations} - C08F 2800/20: as weight or mass percentages - C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors - C09J 2301/302: the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C - C09J 2301/312: parameters being the characterizing feature - C09J 2433/00: Presence of (meth)acrylic polymer - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS ## Abstract The present invention relates to a curable adhesive compound for encapsulating an electronic or optoelectronic arrangement against permeates, made of the following components: (A) 20 to 99.9 wt % (relative to the total amount of the curable adhesive compound) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass in the range of at least 5,000 g/mol, based on more than 30 to 100 wt %, preferably 50 to 100 wt %, (relative to the total amount of the monomers on which the epoxide-functionalized (co)polymer is based) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1 to 5 wt % (relative to the total amount of the curable adhesive compound) of at least one curing agent which can induce, thermally and/or by the application of UV radiation, the curing, in particular the cationic curing, of the (co)polymer (A) under reaction of its epoxy groups, (C) optionally 0 to 79.9 wt % of additional components. ## Claims ### Claim 1 A curable adhesive composition for encapsulation of an electronic or optoelectronic arrangement against permeants, comprising the following components: (A) 20% to 99.9% by weight (based on the entirety of the curable adhesive composition) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass in the region of at least 5000 g/mol, based on more than 30% to 100% by weight, (based on the entirety of the parent monomers of the epoxy-functionalized (co)polymer) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1% to 5% by weight (based on the entirety of the curable adhesive composition) of at least one curing agent that can induce the curing of the (co)polymer (A) with reaction of its epoxy groups by thermal means and/or by supply of UV radiation, (C) optionally 0% to 79.9% by weight of further constituents. ### Claim 2 (depends on 1) The curable adhesive composition as claimed in claim 1, wherein the weight-average molar mass of the epoxy-functionalized (co)polymer is at least 10 000 g/mol, and/or at most 200 000 g/mol. ### Claim 3 (canceled) ### Claim 4 (depends on 1) The curable adhesive composition as claimed in claim 1, having pressure-sensitive adhesive properties. ### Claim 5 (depends on 1) The curable adhesive composition as claimed in claim 1, wherein cycloaliphatic epoxides are used for one, more than one, or all the (meth)acrylic (co)monomers (a) functionalized with an epoxy group. ### Claim 6 (depends on 5) The curable adhesive composition as claimed in claim 5, wherein the cycloaliphatic epoxides are 3,4-epoxycyclohexyl-substituted monomers. ### Claim 7 (depends on 1) The curable adhesive composition as claimed in claim 1, wherein comonomers used in the preparation of the functionalized (co)polymer are silicon compounds. ### Claim 8 (depends on 1) The curable adhesive composition as claimed in claim 1, comprising thermally activatable curing agents for cationic curing of epoxides in the form of thermally activatable acid formers, and/or photoinitiators as curing agent, and/or at least one tackifying resin, and/or at least one reactive resin that is aliphatic or cycloaliphatic, and/or one or more additives, and/or one or more fillers. ### Claim 9 (depends on 8) The curable adhesive composition as claimed in claim 8, wherein the thermally activatable curing agents are selected from the group consisting of: pyridinium salts, ammonium salts, sulfonium salts, and lanthanoid triflates. ### Claim 10 (canceled) ### Claim 11 (depends on 8) The adhesive composition as claimed in claim 8, wherein the photoinitiators absorb UV light above 250 nm and below 350 nm. ### Claim 12 (canceled) ### Claim 13 (canceled) ### Claim 14 (canceled) ### Claim 15 (depends on 1) The adhesive composition as claimed in claim 1, wherein one or more silanes have been mixed in. ### Claim 16 (canceled) ### Claim 17 (depends on 1) The adhesive composition as claimed in claim 1, being transparent in the visible light of the spectrum (wavelength range from about 400 nm to 800 nm) and/or has a transmission (by test F1) of at least 75%. ### Claim 18 (depends on 1) The adhesive composition as claimed in claim 1, showing a haze (by test F2) of not more than 5.0%. ### Claim 19 (depends on 1) The adhesive composition as claimed in claim 1, having a lag time by test B of at least 150 h. ### Claim 20 (depends on 1) An adhesive tape comprising at least one layer of an adhesive composition as claimed in claim 1 and a carrier, wherein the carrier has a permeation barrier of WVTR<0.1 g/(m2 d) and OTR<0.1 cm3/(m2 d bar). ### Claim 21 (depends on 20) The adhesive tape as claimed in claim 20, wherein the carrier is a coated polymer film, and/or the carrier has a layer of a flexible thin glass having a layer thickness of not more than 1 mm. ### Claim 22 (canceled) ### Claim 23 (depends on 21) The adhesive tape as claimed in claim 21, wherein the thin glass is in strip geometry. ### Claim 24 (depends on 1) A method for encapsulation of an (opto)electronic arrangement, said method comprising a step of applying an adhesive composition or of a single- or double-sided adhesive tape formed with the adhesive composition according to claim 1 to a substrate. ### Claim 25 (depends on 24) The method as claimed in claim 24, wherein the adhesive composition and/or the regions of the (opto)electronic arrangement to be encapsulated are heated before, during and/or after the application of the adhesive composition. ### Claim 26 (depends on 24) The method as claimed in claim 24, wherein the adhesive composition is partly or finally crosslinked after application to the (opto)electronic arrangement. ### Claim 27 (depends on 1) An electronic arrangement having an electronic structure, and an adhesive composition, wherein the (opto)electronic structure has been at least partly encapsulated by the adhesive composition, and wherein the adhesive composition is formed according to claim 1 and is in cured form.