# US 2019/0169435 A1 · Curable particulate silicone composition, light reflecting material containing the same, and a manufacturing method thereof

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- Number: US 2019/0169435 A1
- Document ID: US20190169435A1
- Status: Published application
- Kind: A1
- Application number: 16/324,001
- Filed: 2017-08-04
- Published: 2019-06-06
- Earliest claimed: 2016-08-08
- Assignees: Dow Corning Toray Co., Ltd.
- Applicants: Dow Corning Toray Co., Ltd.
- Inventors: Ryosuke YAMAZAKI
- Web page: https://patentgrep.com/patent/US20190169435A1

## CPC

- C08L 83/04: Polysiloxanes
- B29C 45/0001: {characterised by the choice of material}
- B29C 45/0013: {using fillers dispersed in the moulding material, e.g. metal particles}
- C08G 77/12: containing silicon bound to hydrogen
- C08G 77/20: containing silicon bound to unsaturated aliphatic groups
- C08G 77/70: {Siloxanes defined by use of the MDTQ nomenclature}
- C08G 77/80: {Siloxanes having aromatic substituents, e.g. phenyl side groups}
- C08J 3/244: {Stepwise homogeneous crosslinking of one polymer with one crosslinking system, e.g. partial curing}
- C08J 5/00: Manufacture of articles or shaped materials containing macromolecular substances (manufacture of semi-permeable membranes B01D67/00 - B01D71/00)
- C08K 3/00: Use of inorganic substances as compounding ingredients
- C08K 3/011: Crosslinking or vulcanising agents, e.g. accelerators
- C08K 3/013: Fillers, pigments or reinforcing additives
- C08K 3/22: of metals
- C09D 183/04: Polysiloxanes
- H10H 20/8511: {characterised by their material, e.g. binder}
- H10H 20/856: Reflecting means
- H10W 74/01: Manufacture or treatment
- B29C 2045/0091: {Pellets or granules, e.g. their structure, composition, length, height, width}
- B29K 2083/00: Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
- B29K 2509/02: Ceramics
- B29K 2995/003: Reflective
- B29L 2011/0083: {Reflectors}
- C08J 2383/04: Polysiloxanes
- C08K 2003/2241: {Titanium dioxide}
- C08K 2201/005: Additives being defined by their particle size in general
- C08L 2203/20: use in electrical or conductive gadgets
- C08L 2205/025: containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
- C08L 2205/18: Spheres
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES

## Abstract

A curable particulate silicone composition is provided which has hot-melt properties, excellent handling workability and curing characteristics, high light reflectance in the visible wavelength region, and excellent flexibility and toughness at a temperature of from room temperature to a high temperature of about 150° C. The composition comprises: (A) hot-melt silicone fine particles having a softening point of 30° C. or higher and having a hydrosilylation reactive group and/or a radical reactive group; (B) an inorganic filler substantially free of coarse particles having an average particle diameter of 5 μm or more (fine particles); and (C) a curing agent. When cured, the composition provides a cured product that has: a storage modulus (G′) at 25° C. of 2000 MPa or less; and a storage modulus (G′) at 150° C. of 100 MPa or less; and a spectral reflectance of 90% or more at a wavelength of 450 nm at a thickness of 100 μm.

## Claims

### Claim 1

A curable particulate silicone composition comprising:
(A) hot-melt silicone fine particles having a softening point of 30° C. or higher and having a hydrosilylation reactive group and/or a radical reactive group;
(B) an inorganic filler substantially free of coarse particles having an average particle diameter of 5 μm or more; and
(C) a curing agent;
wherein when cured, the curable particulate silicone composition provides a cured product that has:
a storage modulus (G′) at 25° C. of 2000 MPa or less; and
a storage modulus (G′) at 150° C. of 100 MPa or less; and
a spectral reflectance of 90% or more at a wavelength of 450 nm at a thickness of 100 μm.

### Claim 2 (depends on 1)

The curable particulate silicone composition according to claim 1, wherein component (B) is a filler that does not have a softening point or does not soften below the softening point of component (A).

### Claim 3 (depends on 1)

The curable particulate silicone composition according to claim 1, wherein 90 mass % or more of component (B) is (B1) titanium oxide fine particles having an average particle diameter of 0.5 μm or less.

### Claim 4 (depends on 1)

The curable particulate silicone composition according to claim 1, wherein component (B) consists essentially of (B1) titanium oxide fine particles having an average particle diameter of 0.5 μm or less.

### Claim 5 (depends on 1)

The curable particulate silicone composition according to claim 1, wherein component (A) is silicone fine particles comprising (A1) a resinous organopolysiloxane, (A2) an organopolysiloxane crosslinked product obtained by partially crosslinking at least one organopolysiloxane, (A3) a block copolymer composed of a resinous organosiloxane block and a chained organosiloxane block, or a mixture of at least two of these.

### Claim 6 (depends on 1)

The curable particulate silicone composition according to claim 1, wherein component (A) is true-spherical silicone fine particles in which 10 mol % or more of the silicon atom-bonded organic groups in component (A) is an aryl group and the average primary particle diameter thereof is 1 to 10 μm.

### Claim 7 (depends on 1)

The curable particulate silicone composition according to claim 1, wherein the amount of component (B) is 10 to 2000 parts by mass with regard to 100 parts by mass of component (A).

### Claim 8 (depends on 1)

The curable particulate silicone composition according to claim 1, which provides a cured product having a spectral reflectance of 90% or more at a wavelength of 700 nm at a thickness of 100 μm.

### Claim 9 (depends on 1)

The curable particulate silicone composition according to claim 1, wherein the curable particulate silicone composition is in the form of pellets or sheets.

### Claim 10 (depends on 1)

A cured product formed by curing the curable particulate silicone composition according to claim 1.

### Claim 11 (depends on 10)

The cured product according to claim 10, wherein the light reflectance (ρ450) at a wavelength of 450 nm and the light reflectance (ρ700) at a wavelength of 700 nm at a thickness of 100 μm are both 90% or more, and
the differences in the respective light reflectance expressed as (ρ700/ρ450)*100(%) are less than 10%.

### Claim 12 (depends on 10)

A light reflecting material comprising the cured product according to claim 10.

### Claim 13 (depends on 1)

An optical semiconductor device comprising a cured product of the curable silicone composition according to claim 1 as a light reflecting material.

### Claim 14 (depends on 13)

The optical semiconductor device according to claim 13, which is a chip scale package type optical semiconductor device.

### Claim 15 (depends on 1)

A method of molding a cured product, comprising:
(I) heating and melting the curable particulate silicone composition according to claim 1 to the softening point of component (A) or higher;
(II) injecting the curable silicone composition obtained in step (I) into a mold or distributing the curable silicone composition obtained in step (I) to a mold by clamping; and
(III) curing the curable silicone composition injected or distributed in step (II).

### Claim 16 (depends on 2)

The curable particulate silicone composition according to claim 2, wherein 90 mass % or more of component (B) is (B1) titanium oxide fine particles having an average particle diameter of 0.5 μm or less.

### Claim 17 (depends on 5)

The curable particulate silicone composition according to claim 5, wherein component (A) is true-spherical silicone fine particles in which 10 mol % or more of the silicon atom-bonded organic groups in component (A) is an aryl group and the average primary particle diameter thereof is 1 to 10 μm.