# US 2019/0169432 A1 · Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high-speed communication-compatible module

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- Number: US 2019/0169432 A1
- Document ID: US20190169432A1
- Status: Published application
- Kind: A1
- Application number: 16/305,930
- Filed: 2017-05-30
- Published: 2019-06-06
- Earliest claimed: 2016-06-02
- Assignees: Hitachi Chemical Company, Ltd.
- Applicants: Hitachi Chemical Company, Ltd.
- Inventors: Shunsuke TONOUCHI; Tomokazu SHIMADA; Kazutoshi DANJOUBARA; Tomio FUKUDA; Minoru KAKITANI
- Web page: https://patentgrep.com/patent/US20190169432A1

## CPC

- C08L 79/02: Polyamines
- B32B 5/02: characterised by structural features of a {fibrous or filamentary} layer {(layer formed of metallic wires B32B15/02; layer formed of natural mineral fibres B32B19/02; layer formed of wood fibres B32B21/02)}
- B32B 5/28: impregnated with or embedded in a plastic substance {(not used)}
- B32B 15/08: of synthetic resin
- B32B 15/088: comprising polyamides
- B32B 15/14: next to a fibrous or filamentary layer
- B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)}
- C08G 73/00: Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00 {(polycarbodiimides prepared from isocyanates C08G18/025, C08G18/797)}
- C08G 73/0246: {Polyamines containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain}
- C08G 73/125: {the unsaturated precursors containing atoms other than carbon, hydrogen, oxygen or nitrogen in the main chain}
- C08J 5/244: {using glass fibres}
- C08L 15/00: Compositions of rubber derivatives (C08L11/00, C08L13/00 take precedence)
- C08L 35/06: Copolymers with vinyl aromatic monomers
- C08L 79/00: Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L 79/085: {Unsaturated polyimide precursors}
- H05K 1/03: Use of materials for the substrate
- H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)}
- B32B 2260/046: Synthetic resin
- C08G 73/0273: {Polyamines containing heterocyclic moieties in the main chain}
- C08G 73/028: {Polyamidoamines}
- C08G 73/10: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08J 2379/02: Polyamines
- C08J 2409/06: Copolymers with styrene
- C08J 2425/08: Copolymers of styrene (C08J2429/08, C08J2435/06, C08J2455/02 take precedence)
- C08L 25/08: Copolymers of styrene (C08L29/08, C08L35/06, C08L55/02 take precedence)
- C08L 79/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08L 2207/04: Thermoplastic elastomer
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A thermosetting resin composition containing: (A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2), (B) a thermoplastic elastomer, and (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.

## Claims

### Claim 1

A thermosetting resin composition comprising:
(A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2),
(B) a thermoplastic elastomer, and
(C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.

### Claim 2 (depends on 1)

The thermosetting resin composition according to claim 1, wherein the structural unit derived from an aromatic vinyl compound is represented by the following general formula (C-1) and the structural unit derived from a carboxylic acid anhydride is a structural unit derived from a maleic anhydride represented by the following general formula (C-2):
wherein RC1 represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, RC2 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms or an aromatic hydrocarbon group having 6 to 20 carbon atoms, and x represents an integer of 0 to 3.

### Claim 3 (depends on 2)

The thermosetting resin composition according to claim 2, comprising, as the component (C), a copolymer resin wherein RC1 is a hydrogen atom and x is 0 in the general formula (C-1) and the content ratio of the structural unit represented by the general formula (C-1) to the structural unit represented by the general formula (C-2) [(C-1)/(C-2)] (by mol) is from 5 to 10.

### Claim 4 (depends on 1)

The thermosetting resin composition according to claim 1, wherein the content of the component (B) is from 4 to 20 parts by mass relative to 100 part by mass of the solid content of the resin component in the thermosetting resin composition, and the content of the component (C) is from 2 to 20 parts by mass relative to 100 part by mass of the solid content of the resin component in the thermosetting resin composition.

### Claim 5 (depends on 1)

The thermosetting resin composition according to claim 1, wherein the component (a2) contains a modified siloxane having an amino group at the end thereof.

### Claim 6 (depends on 1)

The thermosetting resin composition according to claim 1, wherein the component (B) is a hydrogenated styrene-based thermoplastic elastomer, and the content of the structural unit derived from styrene in the hydrogenated styrene-based thermoplastic elastomer is from 20 to 60% by mass.

### Claim 7 (depends on 1)

The thermosetting resin composition according to claim 1, further comprising (D) a curing accelerator.

### Claim 8 (depends on 1)

The thermosetting resin composition according to claim 1, further comprising (E) an inorganic filler.

### Claim 9 (depends on 1)

A prepreg, which is formed by infiltrating a thermosetting resin composition of claim 1 into a fiber substrate.

### Claim 10 (depends on 9)

A laminated board, which is obtained by subjecting a prepreg of claim 9 to a laminate molding.

### Claim 11 (depends on 9)

A printed wiring board, which is produced using the prepreg of claim 9.

### Claim 12 (depends on 11)

A high-speed communication-compatible module, which is produced using a printed wiring board of claim 11.

### Claim 13 (depends on 1)

A printed wiring board, which is produced using the thermosetting resin composition of claim 1.

### Claim 14 (depends on 13)

A high-speed communication-compatible module, which is produced using a printed wiring board of claim 13.