# US 2019/0169424 A1 · Curable composition and cured product thereof

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- Number: US 2019/0169424 A1
- Document ID: US20190169424A1
- Status: Published application
- Kind: A1
- Application number: 16/313,244
- Filed: 2017-06-22
- Published: 2019-06-06
- Earliest claimed: 2016-07-06
- Assignees: DIC Corporation
- Applicants: DIC Corporation
- Inventors: Yutaka Satou; Akito Kawasaki; Tatsuya Okamoto
- Web page: https://patentgrep.com/patent/US20190169424A1

## CPC

- C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08G 59/4223: {aromatic}
- C08G 59/621: {Phenols}
- C08K 3/36: Silica
- C09D 163/00: Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- H05K 1/03: Use of materials for the substrate
- H05K 1/0326: {containing O}
- H10W 74/10: characterised by their shape or disposition
- H10W 74/40: characterised by their materials
- H10W 74/47: comprising organic materials, e.g. plastics or resins
- C08K 5/0025: {Crosslinking or vulcanising agents; including accelerators}
- C08K 5/12: of cyclic polycarboxylic acids
- H05K 3/285: {Permanent coating compositions}
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Provided are a curable composition capable of both exhibiting a low shrinkage percentage during curing and forming a cured product having a low elastic modulus under high temperature conditions, a cured product of the curable composition, and a semiconductor encapsulating material and a printed wiring board which are produced using the curable composition. The curable composition includes an active ester compound (A) that is an esterification product of a phenolic compound (a1) and an aromatic polycarboxylic acid or an acid halide thereof (a2); and a curing agent. Also provided are a cured product of the curable composition, and a semiconductor encapsulating material and a printed wiring board which are produced using the curable composition.

## Claims

### Claim 1

A curable composition comprising:
an active ester compound (A) an acid halide thereof (a2); and
represented by the following Structural Formula (1):
wherein R1s each independently represent any one of an aliphatic hydrocarbon group, an aryl group, and an aralkyl group and may be bonded to any carbon atom on a benzene ring, and n is 1 or 2; and
a curing agent.

### Claim 2

(canceled)

### Claim 3 (depends on 1)

A cured product comprising a product obtained by curing the curable resin composition according to claim 1.

### Claim 4 (depends on 1)

A semiconductor encapsulating material comprising the curable composition according to claim 1.

### Claim 5 (depends on 1)

A printed wiring board comprising a product obtained using the curable composition according to claim 1.

### Claim 6 (depends on 1)

The curable composition according to claim 1, wherein the curing agent is at least one epoxy resin selected from a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, a naphthol novolac type epoxy resin, a bisphenol novolac type epoxy resin, a biphenol novolac type epoxy resin, a triphenol methane type epoxy resin, a tetraphenol ethane type epoxy resin, a dicyclopentadiene-phenol addition reaction type epoxy resin, a phenol aralkyl type epoxy resin, and a naphthol aralkyl type epoxy resin.