# US 2019/0169422 A1 · Thermoset Resin Composite Materials Comprising Inter-Laminar Toughening Particles

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- Number: US 2019/0169422 A1
- Document ID: US20190169422A1
- Status: Published application
- Kind: A1
- Application number: 16/256,005
- Filed: 2019-01-24
- Published: 2019-06-06
- Earliest claimed: 2012-11-15
- Assignees: Cytec Industries Inc.
- Applicants: Cytec Industries Inc.
- Inventors: Vincent AERTS; Mark BONNEAU; Judith ELDER; Emiliano FRULLONI; James Martin GRIFFIN
- Web page: https://patentgrep.com/patent/US20190169422A1

## CPC

- C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08G 59/32: Epoxy compounds containing three or more epoxy groups
- C08G 59/3227: {Compounds containing acyclic nitrogen atoms}
- C08G 59/40: characterised by the curing agents used
- C08K 5/0025: {Crosslinking or vulcanising agents; including accelerators}
- C08K 5/41: Compounds containing sulfur bound to oxygen
- C08L 77/02: Polyamides derived from omega-amino carboxylic acids or from lactams thereof (C08L77/10 takes precedence)
- C08L 77/06: Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)

## Abstract

A resin system containing: (i) a thermosetting resin precursor component comprising one or more multi-functional epoxy resin precursor(s) having a functionality of at least three, preferably wherein said precursor(s) are selected from a tri-functional epoxy resin precursor and/or a tetra-functional epoxy resin precursor; (ii) a thermoplastic polyamide particle component wherein the polyamide particles have a melting temperature TPA; and (iii) one or more curing agent(s), wherein the resin precursor component, the thermoplastic particle and the curing agent(s) are selected such that gelation of the epoxy matrix during the cure cycle of the resin system occurs at a gelation temperature TGEL which is at or below TPA.

## Claims

### Claim at position 1

1-17. (canceled)

### Claim 18

A process for producing a cured composite comprising the steps of:
(i) forming a resin composition comprising a tri-functional epoxy resin precursor and/or a tetra-functional epoxy resin precursor, one or more curing agent(s), a toughening agent selected from aromatic polvethersulphones, and polyamide particles having a melting temperature TPA,
(ii) combining said resin composition with reinforcing fibres to form a composite material, and
(iii) curing the composite material in a cure cycle in which a cure temperature Tc is attained with a cure ramp rate RCR in the range of 0.05° C./min to 3.0° C./min,
wherein the cure temperature Tc is in the range of 160° C. to about 200° C., and
wherein the gelation of the epoxy composition during the cure cycle occurs at a gelation temperature TGEL which is at or below TPA.

### Claim 19

(canceled)

### Claim 20 (depends on 18)

The process according to claim 18, wherein said cure ramp rate RCR is in the range of 0.05° C./min to 2.5° C./min.

### Claim 21 (depends on 18)

The process according to claim 18, wherein the cure temperature Tc is in the range of from 170° C. to 190° C.

### Claim 22

(canceled)

### Claim 23 (depends on 18)

The process according to claim 18, wherein said tri-functional epoxy resin precursor is O,N,N-triglycidyl-para-aminophenol (TGPAP) or O,N,N-triglycidyl-meta-aminophenol (TGMAP); and said tetra-functional epoxy resin precursor is N,N,N′,N′-tetraglycidyldiaminodiphenyl methane (TGDDM).

### Claim 24 (depends on 18)

The process according to claim 18, wherein
the resin composition comprises less than 10% by weight, based on total weight of the resin composition, of epoxy resin precursors with a functionality of less than three,
the polyamide particles in the resin composition are polyamide-12 particles, and
4,4′-diaminodiphenyl sulphone (4,4′-DDS) and isophthalic acid dihydrazide (IDH) are used as curing agents.

### Claim 25 (depends on 18)

The process according to claim 18, wherein the polyamide particles in the resin composition are polyamide-10,10 particles, and 4,4′-DDS is used as the curing agent.