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US 2019/0169403 A1Published application
Resin composition and resin molded body
AssigneeFuji Xerox Co., Ltd.
InventorsMasahiro MORIYAMA, Kenji YAO
Life of this patent
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Abstract
Provided is a resin composition containing: a cellulose acetate in which the weight average polymerization degree is 120-330 and the degree of substitution of an acetyl group is 2.10-2.60; a (meth)acrylic polymer having a weight average molecular weight of 1000-30000; and a plasticizer.
Claims20
A resin component comprising:
- a cellulose acetate having a weight average polymerization degree of from 120 to 330 and an acetyl group substitution degree of from 2.10 to 2.60;
- (meth) acrylic polymer having a weight average molecular weight of from 1000 to 30000;
- and
- a plasticizer.
1 more element
Dependencies are inferred from the claim text.