# US 2019/0169398 A1 · Curable particulate silicone composition, semiconductor member containing the same, and molding method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0169398 A1 - Document ID: US20190169398A1 - Status: Published application - Kind: A1 - Application number: 16/324,029 - Filed: 2017-08-04 - Published: 2019-06-06 - Earliest claimed: 2016-08-08 - Assignees: Dow Corning Toray Co., Ltd. - Applicants: Dow Corning Toray Co., Ltd. - Inventors: Ryosuke YAMAZAKI - Web page: https://patentgrep.com/patent/US20190169398A1 ## CPC - C08J 5/18: Manufacture of films or sheets - C08K 3/36: Silica - B29C 45/0001: {characterised by the choice of material} - B29C 45/7207: {of the moulded articles} - C08G 77/442: containing vinyl polymer sequences - C08J 5/00: Manufacture of articles or shaped materials containing macromolecular substances (manufacture of semi-permeable membranes B01D67/00 - B01D71/00) - C08K 3/00: Use of inorganic substances as compounding ingredients - C08K 3/22: of metals - C08K 7/18: inorganic - C08L 83/04: Polysiloxanes - H10W 74/01: Manufacture or treatment - H10W 74/016: {using moulds} - H10W 74/10: characterised by their shape or disposition - H10W 74/40: characterised by their materials - H10W 74/473: {containing a filler} - H10W 74/476: {Organic materials comprising silicon} - B29K 2083/00: Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material - B29L 2031/34: Electrical apparatus, e.g. sparking plugs or parts thereof - C08G 77/12: containing silicon bound to hydrogen - C08G 77/20: containing silicon bound to unsaturated aliphatic groups - C08J 2383/04: Polysiloxanes - C08K 3/013: Fillers, pigments or reinforcing additives - C08K 2003/2227: {of aluminium} - C08K 2201/005: Additives being defined by their particle size in general - H10W 90/00: Package configurations - C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29) - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES ## Abstract Provided are a curable particulate silicone composition having hot-melt properties, excellent handling workability and curing characteristics, high light reflectance in the visible wavelength region, and excellent flexibility and toughness at a temperature of from room temperature to a high temperature of about 250° C., and a pellet or the like formed by molding the composition. The curable particulate silicone composition comprises: (A) 100 parts by mass of hot-melt silicone fine particles having a softening point of 30° C. or higher and having a hydrosilylation reactive group and/or a radical reactive group; (B) 100 to 4000 parts by mass of an inorganic filler; and (C) a curing agent. A cured product of the curable particulate silicone composition has an average linear expansion coefficient of 30 ppm/° C. or less at 25° C. to 200° C. and the ratio of the storage modulus at −50° C. to the storage modulus at 250° C. is 1/1 to 1/50. ## Claims ### Claim 1 A curable particulate silicone composition comprising: (A) 100 parts by mass of hot-melt silicone fine particles having a softening point of 30° C. or higher and having a hydrosilylation reactive group and/or a radical reactive group; (B) 100 to 4000 parts by mass of an inorganic filler; and (C) a curing agent; wherein when cured, the curable particulate silicone composition provides a cured product that has an average linear expansion coefficient at a temperature range of 25° C. to 200° C. of 30 ppm/° C. or less and the ratio of the value of the storage modulus at −50° C. (G′−50) to the value of the storage modulus at 250° C. (G′250):(G′−50/G′250) is in the range of 1/1 to 1/50. ### Claim 2 (depends on 1) The curable particulate silicone composition according to claim 1, wherein component (B) is a filler that does not have a softening point or does not soften below the softening point of component (A). ### Claim 3 (depends on 1) The curable particulate silicone composition according to claim 1, wherein component (B) is substantially an inorganic filler having an average particle diameter of 10.0 μm or more. ### Claim 4 (depends on 1) The curable particulate silicone composition according to claim 1, wherein component (B) is a reinforcing filler, a white pigment, a thermally conductive filler, a conductive filler, a phosphor, or a mixture of at least two of these. ### Claim 5 (depends on 1) The curable particulate silicone composition according to claim 1, wherein component (B) is a spherical inorganic filler having an average particle diameter of 10.0 μm or more. ### Claim 6 (depends on 1) The curable particulate silicone composition according to claim 1, wherein component (A) is silicone fine particles comprising (A1) a resinous organopolysiloxane, (A2) an organopolysiloxane crosslinked product obtained by partially crosslinking at least one organopolysiloxane, (A3) a block copolymer composed of a resinous organosiloxane block and a chained organosiloxane block, or a mixture of at least two of these. ### Claim 7 (depends on 1) The curable particulate silicone composition according to claim 1, wherein component (A) is true-spherical silicone fine particles in which 10 mol % or more of the silicon atom-bonded organic groups in component (A) is an aryl group and the average primary particle diameter thereof is 1 to 10 μm. ### Claim 8 (depends on 1) The curable particulate silicone composition according to claim 1, wherein the cured product obtained by curing does not have a definite inflection point in a change in the linear expansion coefficient at a temperature range of 20° C. to 300° C. ### Claim 9 (depends on 1) The curable particulate silicone composition according to claim 1, wherein the curable particulate silicone composition is in the form of pellets or sheets. ### Claim 10 (depends on 1) A cured product formed by curing the curable particulate silicone composition according to claim 1. ### Claim 11 (depends on 10) A member for a semiconductor device, wherein the member comprises the cured product according to claim 10. ### Claim 12 (depends on 10) A semiconductor device comprising the cured product according to claim 10. ### Claim 13 (depends on 10) A power semiconductor device having a structure in which a semiconductor element or a semiconductor circuit board is overmolded with the cured product according to claim 10. ### Claim 14 (depends on 1) A method of molding a cured product, the method comprising: (I) heating and melting the curable particulate silicone composition according to claim 1 to the softening point of component (A) or higher; (II) injecting the curable silicone composition obtained in step (I) into a mold or distributing the curable silicone composition obtained in step (I) to a mold by clamping; and (III) curing the curable silicone composition injected or distributed in step (II). ### Claim 15 (depends on 2) The curable particulate silicone composition according to claim 2, wherein component (B) is substantially an inorganic filler having an average particle diameter of 10.0 μm or more. ### Claim 16 (depends on 6) The curable particulate silicone composition according to claim 6, wherein component (A) is true-spherical silicone fine particles in which 10 mol % or more of the silicon atom-bonded organic groups in component (A) is an aryl group and the average primary particle diameter thereof is 1 to 10 μm.