# US 2019/0169355 A1 · Epoxy formula for integral capacitance probe > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0169355 A1 - Document ID: US20190169355A1 - Status: Published application - Kind: A1 - Application number: 15/909,280 - Filed: 2018-03-01 - Published: 2019-06-06 - Earliest claimed: 2017-12-05 - Assignees: United Technologies Corporation - Applicants: United Technologies Corporation - Inventors: Eli Cole Warren; Peter J. Walsh - Web page: https://patentgrep.com/patent/US20190169355A1 ## CPC - C08G 59/06: of polyhydric phenols - F01D 17/02: Arrangement of sensing elements - C08G 59/32: Epoxy compounds containing three or more epoxy groups - C08G 59/64: Amino alcohols - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - F01D 21/003: {Arrangements for testing or measuring (for measuring vibrations G01H)} - G01B 7/14: for measuring distance or clearance between spaced objects or spaced apertures (G01B7/30 takes precedence) - C08J 2363/10: Epoxy resins modified by unsaturated compounds - F01D 21/04: responsive to undesired position of rotor relative to stator {or to breaking-off of a part of the rotor}, e.g. indicating such position - F05D 2270/80: Devices generating input signals, e.g. transducers, sensors, cameras or strain gauges - Y02T 50/60: Efficient propulsion technologies, e.g. for aircraft - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - F01D: NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES (machines or engines for liquids F03; non-positive displacement pumps F04D) - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - G01B: MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS - C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29) - F05D: INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS - Y02T: CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION ## Abstract An epoxy composition may comprise a bisphenolic resin composition comprising bisphenol AF and at least one of a filler, a fire resistant component, a chain extender, a conductivity modifier, and a dye. The bisphenolic resin composition may further comprise at least one of bisphenol A and bisphenol F. ## Claims ### Claim 1 A epoxy composition, comprising: a bisphenolic resin composition comprising bisphenol AF and at least one of a filler or a conductivity modifier. ### Claim 2 (depends on 1) The epoxy composition of claim 1, wherein the bisphenolic resin composition further comprises at least one of bisphenol A and bisphenol F and at least one of a fire resistant component, a chain extender, or a dye. ### Claim 3 (depends on 2) The epoxy composition of claim 2, wherein the bisphenolic resin composition comprises a mixture of bisphenol AF with bisphenol A at a mixture ratio of between 10% to 90% bisphenol AF to bisphenol A. ### Claim 4 (depends on 2) The epoxy composition of claim 2, wherein the bisphenolic resin composition comprises a mixture of bisphenol AF with bisphenol A at a mixture ratio of between 10% to 90% bisphenol AF to bisphenol F. ### Claim 5 (depends on 2) The epoxy composition of claim 2, wherein the bisphenolic resin composition comprises between 15% and 25% by weight of at least one of bisphenol A diglycidyl ether or bisphenol F, between 10% and 20% by weight of Alkyl(C12-14) glycidyl ether, and between 65% and 70% of bisphenol AF. ### Claim 6 (depends on 1) The epoxy composition of claim 1, wherein the conductivity modifier comprises at least one of carbon black, graphite flakes, nano powders of: silver, nickel, copper, or aluminum, micro powders of: silver, nickel, copper, or aluminum, or whiskers of: silver, nickel, copper, or aluminum. ### Claim 7 (depends on 1) The epoxy composition of claim 1, wherein the filler comprises at least one of a non-conductive filler composition comprising one of (SiO2) Silica microparticles, silica nanoparticles, silica flakes or silica whiskers, (Al2O3) Alumina microparticles, alumina nanoparticles, alumina flakes or alumina whiskers, (SiO4) Quartz microparticles, quartz nanoparticles, quartz flakes or quartz whiskers, Titania microparticles, titania nanoparticles, titania flakes or Titania whiskers, (BN) Boron nitride platelets, boron nitride flakes, Boron nitride nanomesh, and agglomerations of boron nitride platelets, flakes or nanomesh, (AlN)Aluminum nitride micro particles, nanoparticles, flakes or platelets, silica glass bubbles, glass micro fibers, or ground mica micro platelets or nano platelets. ### Claim 8 (depends on 2) The epoxy composition of claim 2, wherein the fire resistant component comprises any of brominated aliphatic polyol polyepoxy resin, Tetrabromobisphenol A, Brominated neo pentyl glycol at a weight percent of less than about 30% of weight the fire resistant component to weight the bisphenolic resin composition. ### Claim 9 (depends on 2) The epoxy composition of claim 2, wherein the chain extender comprises antimony trioxide at about 1% to about 10% of weight Antimony trioxide to weight the bisphenolic resin composition. ### Claim 10 (depends on 5) The epoxy composition of claim 5, comprising between 40% and 70% by weight of the bisphenolic resin composition, between 10% and 30% by weight of the filler, between 10% and 30% by weight of the fire resistant component, between 1% and 5% of the chain extender, and less than 0.1% by weight dye. ### Claim 11 (depends on 5) The epoxy composition of claim 5, comprising between 40% and 70% by weight of the bisphenolic resin composition, between 0% and 30% by weight of the filler, between 10% and 30% by weight of the conductivity modifier, between 10% and 30% by weight of the fire resistant component, between 1% and 5% of the chain extender, and less than 0.1% by weight dye or trace reaction products. ### Claim 12 (depends on 2) The epoxy composition of claim 2, further comprising a curative comprising at least one of an amine curative, a cycloaliphatic polyamine, a polyamide, or an amino amine. ### Claim 13 An article comprising: a frame structure having a frame material having a first epoxy composition; and a sensor element disposed within the frame structure comprising a second epoxy composition, wherein the first epoxy composition and the second epoxy composition each comprise a bisphenolic resin composition comprising bisphenol AF and at least one of a filler or a conductivity modifier. ### Claim 14 (depends on 13) The article of claim 13, wherein the bisphenolic resin composition further comprises at least one of bisphenol A and bisphenol F and at least one of a fire resistant component, a chain extender, or a dye. ### Claim 15 (depends on 14) The article of claim 14, wherein the bisphenolic resin composition comprises between 15% and 25% by weight of at least one of bisphenol A diglycidyl ether or bisphenol F, between 10% and 20% by weight of Alkyl(C12-14) glycidyl ether, and between 65% and 70% of bisphenol AF. ### Claim 16 (depends on 15) The article of claim 15, wherein the first epoxy composition comprises between 40% and 70% by weight of the bisphenolic resin composition, between 10% and 30% by weight of the filler, between 10% and 30% by weight of the fire resistant component, between 1% and 5% of the chain extender, and less than 0.1% by weight dye or trace reaction products. ### Claim 17 (depends on 15) The article of claim 15, wherein the second epoxy composition comprises between 40% and 70% by weight of the bisphenolic resin composition, between 0% and 30% by weight of the filler, between 10% and 30% by weight of the conductivity modifier, between 10% and 30% by weight of the fire resistant component, between 1% and 5% of the chain extender, and less than 0.1% by weight dye or trace reaction products. ### Claim 18 (depends on 17) The article of claim 17, wherein the second epoxy composition a resistivity not more than 10−7 Ohm-m when combined with a curative. ### Claim 19 (depends on 17) The article of claim 17, wherein the first epoxy composition has a dielectric strength greater than 26.6 kV/mm, a volume resistivity at room temperature greater than 1014 Ohm-cm and greater than 1011 at 570° F., and a dielectric constant at room temperature and 8500 MHz of 9±5 when combined with a curative. ### Claim 20 (depends on 17) The article of claim 17, wherein the first epoxy composition and the second epoxy composition have a porosity of zero when combined with a curative.