# US 2019/0169022 A1 · Microelectromechanical system (mems) device packaging > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0169022 A1 - Document ID: US20190169022A1 - Status: Published application - Kind: A1 - Application number: 16/270,703 - Filed: 2019-02-08 - Published: 2019-06-06 - Earliest claimed: 2016-07-27 - Assignees: Knowles Electronics, LLC - Applicants: Knowles Electronics, LLC - Inventors: Tony K. Lim; Norman Dennis Talag - Web page: https://patentgrep.com/patent/US20190169022A1 ## CPC - B81C 1/0023: {Packaging together an electronic processing unit die and a micromechanical structure die (MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261)} - B81B 7/007: {Interconnections between the MEMS and external electrical signals} - B81C 1/00269: {Bonding of solid lids or wafers to the substrate} - H04R 19/005: {using semiconductor materials} - H04R 19/016: {for microphones} - H04R 31/006: {Interconnection of transducer parts (of diaphragm and outer suspension by moulding H04R31/003)} - B81B 2201/0257: Microphones or microspeakers - B81B 2207/095: through the lid - B81B 2207/096: through the substrate - B81C 2203/019: characterised by the material or arrangement of seals between parts - H04R 2201/003: Mems transducers or their use - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K) ## Abstract Systems, apparatuses, and methods for manufacturing a microelectromechanical system (MEMS) device. The MEMS device includes a substrate, a cap, a microelectromechanical component, and a tag. The cap is coupled to the substrate such that the substrate and the cap cooperatively define an interior cavity. One of the substrate or the cap defines a port. The microelectromechanical component is disposed within the interior cavity. The tag is coupled to the substrate and an exterior surface of the cap to secure the cap to the substrate. ## Claims ### Claim 1 A microelectromechanical system (MEMS) device comprising: a substrate; a cap coupled to the substrate such that the substrate and the cap cooperatively define an interior cavity, wherein one of the substrate or the cap defines a port; a microelectromechanical component disposed within the interior cavity; and a non-continuous tag coupled to the substrate and the cap, wherein the non-continuous tag is positioned at one or more discrete locations along a periphery of the cap to secure the cap to the substrate. ### Claim 2 (depends on 1) The MEMS device of claim 1, wherein the microelectromechanical component is coupled to the one of the substrate or the cap that defines the port such that the microelectromechanical component is positioned over the port. ### Claim 3 (depends on 1) The MEMS device of claim 1, further comprising a guard ring positioned between the substrate and the cap. ### Claim 4 (depends on 3) The MEMS device of claim 3, wherein the guard ring defines at least one of an aperture or a semi-cutout, and wherein the non-continuous tag is positioned to at least one of seal the aperture or latch onto the semi-cutout of the guard ring. ### Claim 5 (depends on 1) The MEMS device of claim 1, wherein the cap defines at least one of an aperture or a semi-cutout, and wherein the non-continuous tag is positioned to at least one of seal the aperture or latch onto the semi-cutout of the cap. ### Claim 6 A microelectromechanical system (MEMS) device comprising: a substrate; a cap coupled to the substrate such that the substrate and the cap cooperatively define an interior cavity, wherein one of the substrate or the cap defines a port; a microelectromechanical component disposed within the interior cavity; and a tag coupled to the substrate and an exterior surface of the cap to secure the cap to the substrate. ### Claim 7 (depends on 6) The MEMS device of claim 6, wherein the microelectromechanical component is coupled to the one of the substrate or the cap that defines the port such that the microelectromechanical component is positioned over the port to at least partially isolate the port from the interior cavity. ### Claim 8 (depends on 6) The MEMS device of claim 6, wherein the tag is a non-continuous tag positioned at a discrete location along a periphery of the cap. ### Claim 9 (depends on 8) The MEMS device of claim 8, wherein the non-continuous tag is a first non-continuous tag, further comprising a second non-continuous tag coupled to the substrate and the exterior surface of the cap, the second non-continuous tag positioned at a second discrete location along the periphery of the cap. ### Claim 10 (depends on 7) The MEMS device of claim 7, wherein the tag extends along at least a portion of a periphery of the cap. ### Claim 11 (depends on 10) The MEMS device of claim 10, wherein the tag extends along the entire periphery of the cap. ### Claim 12 (depends on 6) The MEMS device of claim 6, wherein the substrate defines the port. ### Claim 13 (depends on 6) The MEMS device of claim 6, wherein the cap defines the port. ### Claim 14 (depends on 6) The MEMS device of claim 6, wherein the microelectromechanical component includes at least one of a pierced microphone or a non-pierced microphone. ### Claim 15 (depends on 6) The MEMS device of claim 6, further comprising a guard ring positioned between the substrate and the cap. ### Claim 16 (depends on 15) The MEMS device of claim 15, wherein the guard ring defines at least one of an aperture or a semi-cutout. ### Claim 17 (depends on 16) The MEMS device of claim 16, wherein the tag is positioned to at least one of seal the aperture or latch onto the semi-cutout of the guard ring. ### Claim 18 (depends on 6) The MEMS device of claim 6, wherein the cap defines at least one of an aperture or a semi-cutout. ### Claim 19 (depends on 18) The MEMS device of claim 18, wherein the tag is positioned to at least one of seal the aperture or latch onto the semi-cutout of the cap. ### Claim 20 A populated printed-circuit-board (PCB) blank comprising: a substrate; a plurality of microelectromechanical devices positioned along the substrate, each of the plurality of microelectromechanical devices including: a lid coupled to the substrate, wherein the substrate and the lid cooperatively define an interior cavity; and a microelectromechanical component positioned within the interior cavity; and a plurality of tags, wherein each of the plurality of tags is positioned between adjacent microelectromechanical devices such that (i) at least a portion of a first end of each lid is secured to the substrate and (ii) at least a portion of an opposing second end of each lid is secured to the substrate.