# US 2019/0169019 A1 · Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0169019 A1 - Document ID: US20190169019A1 - Status: Published application - Kind: A1 - Application number: 16/266,227 - Filed: 2019-02-04 - Published: 2019-06-06 - Earliest claimed: 2016-01-13 - Assignees: Texas Instruments Incorporated - Applicants: Texas Instruments Incorporated - Inventors: Kurt Peter Wachtler; Makoto Yoshino; Ayumu Kuroda; Brian E. Goodlin; Karen Kirmse; Benjamin Cook; Genki Yano; Stuart Jacobsen - Web page: https://patentgrep.com/patent/US20190169019A1 ## CPC - B81B 7/0048: {between the MEMS die and the substrate} - B81B 7/0054: {between other parts not provided for in B81B7/0048 - B81B7/0051} - B81C 1/00325: {for reducing stress inside of the package structure} - H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation} - B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package - B81B 2207/097: Interconnects arranged on the substrate or the lid, and covered by the package seal - B81B 2207/99: Microstructural systems or auxiliary parts thereof not provided for in B81B2207/01 - B81B2207/115 - B81C 2203/0136: Growing or depositing of a covering layer - B81C 2203/0154: Moulding a cap over the MEMS device - B81C 2203/0792: Forming interconnections between the electronic processing unit and the micromechanical structure - H10W 70/421: {Shapes or dispositions} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 90/732: {between stacked chips} - H10W 90/752: {between stacked chips} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces. ## Claims ### Claim 1 An integrated circuit (IC) package comprising: a MEMS device attached to a surface of a substrate by a silicone compound. a first material having a first modulus covering the MEMS device; and a second material having a second modulus covering the first material and portions of the substrate. ### Claim 2 (depends on 1) The IC package of claim 1 further comprising a closed structure of polyimide on a surface of the substrate and surrounding the MEMS device. ### Claim 3 (depends on 1) The IC package of claim 1, wherein the substrate is a semiconductor chip. ### Claim 4 (depends on 3) The IC package of claim 3, wherein the MEMS device is electrically connected to the semiconductor chip. ### Claim 5 (depends on 3) The IC package of claim 3, wherein the semiconductor chip is attached to a pad and electrically connected to leads surrounding the pad. ### Claim 6 (depends on 5) The IC package of claim 5, wherein the semiconductor chip is attached to the pad by a polymeric compound. ### Claim 7 (depends on 1) The IC package of claim 1, wherein the second material covers portions of the surface of the substrate. ### Claim 8 (depends on 1) The IC package of claim 1, wherein the first material is silicone. ### Claim 9 (depends on 1) The IC package of claim 1, wherein the second material is molding compound. ### Claim 10 (depends on 1) The IC package of claim 1, wherein the first material has a modulus of less than 10 Mega Pascal. ### Claim 11 (depends on 2) The IC package of claim 2, wherein the first material is restricted to portions of the surface of the substrate inside the closed structure. ### Claim 12 (depends on 1) The IC package of claim 1, wherein the MEMS device is stress sensitive. ### Claim 13 (depends on 2) The IC package of claim 2, wherein the closed structure has a shape of one of a circle and a rectangle. ### Claim 14 An integrated circuit (IC) package comprising: a substrate including leads and a pad; a semiconductor chip attached to the pad via a polymeric compound, the semiconductor chip including first and second terminals, the second terminals wire bonded to the leads and the semiconductor chip; a MEMS device attached to a surface of the semiconductor chip by a layer of silicone compound, terminals of the MEMS device electrically connected to the first terminals; a first silicone material covering the MEMS device, and portions of the surface of the semiconductor chip; a second silicone material covering a surface of the first silicone material; and a molding compound covering a surface of the second silicone material, and portions of the semiconductor chip. ### Claim 15 (depends on 14) The IC package of claim 14, wherein the first and second silicone materials are low modulus silicone materials with a modulus of less than 10 Mega Pascal. ### Claim 16 (depends on 14) The IC package of claim 14, wherein the molding compound is an epoxy-based thermoset molding formulation. ### Claim 17 (depends on 14) The IC package of claim 14, wherein the MEMS device is stress sensitive. ### Claim 18 (depends on 14) The IC package of claim 14 further comprising a closed structure of polyimide on the surface of the semiconductor chip surrounding the MEMS device and the first terminals. ### Claim 19 (depends on 18) The IC package of claim 18, wherein the closed structure has a shape of one of a circle and a rectangle. ### Claim 20 (depends on 18) The IC package of claim 18, wherein the first silicone material is restricted to portions of the surface of the semiconductor chip inside the closed structure.