# US 2019/0168511 A1 · Fluid level sensor

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- Number: US 2019/0168511 A1
- Document ID: US20190168511A1
- Status: Published application
- Kind: A1
- Application number: 16/092,652
- Filed: 2016-04-21
- Published: 2019-06-06
- Earliest claimed: 2016-04-21
- Assignees: Hewlett-Packard Development Company, L.P.
- Applicants: Hewlett-Packard Development Company, L.P.
- Inventors: Chien-Hua Chen; Michael W. Cumbie; Anthony D. Studer
- Web page: https://patentgrep.com/patent/US20190168511A1

## CPC

- B41J 2/17566: {Ink level or ink residue control}
- G01F 23/247: {for discrete levels}
- G01F 23/248: {Constructional details; Mounting of probes}
- B41J 2002/17579: {Measuring electrical impedance for ink level indication}
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- G01F: MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME

## Abstract

A method of forming a fluid level sensor includes coupling an array of heating elements and sensors to a first side of a substrate. A second side of the substrate is coupled to a carrier. The method also includes coupling an electrical interface to the carrier and electrically coupling the array to the electrical interface via a conductive wire. The method further includes overmolding the electrical interface, the first side of the substrate, and the conductive wire to form an overmolded fluid level sensor. The carrier may be coupled to the second side of the substrate and the electrical interface via a releasable adhesive and may be removed after overmolding the fluid level sensor.

## Claims

### Claim 1

A method of forming a fluid level sensor comprising:
coupling an array of heating elements and sensors to a first side of a substrate;
coupling a second side of the substrate to a carrier;
coupling an electrical interface to the carrier;
electrically coupling the array to the electrical interface via a conductive wire; and
overmolding the electrical interface, the first side of the substrate, and the conductive wire to form an overmolded fluid level sensor.

### Claim 2 (depends on 1)

The method of claim 1, wherein coupling the array of heating elements and the sensors to the first side of a substrate comprises:
coupling the heating elements to the first side of a substrate; and
coupling the sensors to the first side of the substrate juxtaposition to the heating elements.

### Claim 3 (depends on 1)

The method of claim 1, wherein the overmold is an epoxy molding compound (EMC).

### Claim 4 (depends on 1)

The method of claim 1, comprising coupling the overmolded fluid level sensor to a container, the overmolded fluid level sensor protruding into the container.

### Claim 5 (depends on 4)

The method of claim 4, further comprising sealing the container with respect to an exterior of the container and the overmolded fluid level sensor.

### Claim 6 (depends on 1)

The method of claim 1, wherein coupling the substrate and the electrical interface to the carrier comprises coupling the substrate and the electrical interface to the carrier via a releasable adhesive.

### Claim 7 (depends on 1)

The method of claim 1, wherein the substrate comprises silicon.

### Claim 8 (depends on 1)

The method of claim 1, comprising thinning the substrate to approximately 100 micrometers (μm) or less.

### Claim 9 (depends on 1)

The method of claim 1, comprising removing the carrier, wherein removing the carrier comprises removing the carrier via a releasable adhesive used to couple the carrier to the second side of the substrate and the electrical interface.

### Claim 10

A fluid level sensor comprising:
a substrate;
an array of heating elements and sensors coupled to a first side of the substrate;
an electrical interface;
a wire bond electronically coupling the array to the electrical interface; and
an overmold, the overmold covering the electrical interface, the first side of the substrate, and the conductive wire to form an overmolded fluid level sensor.

### Claim 11 (depends on 10)

The fluid level sensor of claim 10, wherein the substrate is approximately 100 micrometers (μm) thick or less.

### Claim 12 (depends on 10)

The fluid level sensor of claim 10, wherein the overmold is an epoxy molding compound (EMC).

### Claim 13

A printable fluid reservoir comprising:
a fluid level sensor comprising:
a substrate;
an array of heating elements and sensors coupled to a first side of the substrate; and
an overmold, the overmold covering the first side of the substrate to form an overmolded fluid level sensor.

### Claim 14 (depends on 13)

The printable fluid reservoir of claim 13, comprising:
an electrical interface; and
a wire bond electronically coupling the array to the electrical interface,
wherein the overmold covers the electrical interface, the first side of the substrate, and the wire bond to form the overmolded fluid level sensor.

### Claim 15 (depends on 13)

The printable fluid reservoir of claim 13, comprising:
a seal interposed between the overmolded fluid level sensor and the printable fluid reservoir to seal the printable fluid reservoir with respect to an exterior of the printable fluid reservoir and the overmolded fluid level sensor.