# US 2019/0168486 A1 · Heat Dissipation Sheet Having Excellent Heat Dissipation Characteristics and Manufacturing Method Therefor

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- Number: US 2019/0168486 A1
- Document ID: US20190168486A1
- Status: Published application
- Kind: A1
- Application number: 16/087,221
- Filed: 2016-03-23
- Published: 2019-06-06
- Earliest claimed: 2016-03-22
- Assignees: Solueta
- Applicants: Solueta
- Inventors: Eui Hong MIN; Dong-Won LEE; Min Seong KIM; Hyun Soo NOH; Hye Jin HAN
- Web page: https://patentgrep.com/patent/US20190168486A1

## CPC

- H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)}
- B32B 9/00: Layered products comprising a {layer of a} particular substance not covered by groups B32B11/00 - B32B29/00
- B32B 9/007: {comprising carbon, e.g. graphite, composite carbon}
- B32B 9/041: {of metal}
- B32B 15/095: comprising polyurethanes
- B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)}
- B32B 27/18: characterised by the use of special additives
- B32B 27/40: comprising polyurethanes
- B32B 37/0053: {Constructional details of laminating machines comprising rollers; Constructional features of the rollers}
- B32B 37/24: with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate (B32B37/15 takes precedence)
- B32B 38/0012: {Mechanical treatment, e.g. roughening, deforming, stretching}
- B32B 38/0036: {Heat treatment (for heating or cooling of layers during lamination B32B37/06, B32B37/08)}
- H05K 7/20481: {characterised by the material composition exhibiting specific thermal properties}
- H05K 7/20509: {Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures}
- H05K 9/0081: {Electromagnetic shielding materials, e.g. EMI, RFI shielding (H05K9/0003 takes precedence)}
- B32B 2037/243: {Coating}
- B32B 2250/02: 2 layers
- B32B 2307/302: Conductive
- B32B 2311/12: Copper
- B32B 2313/04: Carbon
- B32B 2457/00: Electrical equipment
- Y10T 428/24983: Hardness
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

The present invention has been proposed to resolve the above-described problems, and it is an objective of the present invention to provide a heat dissipation sheet with excellent heat dissipation properties, which has a specific porosity, exhibits excellent horizontal heat conductivity, and exhibits an excellent effect in peel strength, and a manufacturing method thereof.

## Claims

### Claim 1

A heat dissipation sheet having enhanced heat dissipation properties, comprising:
a heat dissipation enhancing layer including a carbon material; and
a heat conductive base layer formed on one surface of the heat dissipation enhancing layer,
wherein the carbon material includes at least one selected from graphene and graphite, and
horizontal heat conductivity is in a range of 420 W/mK to 620 W/mK.

### Claim 2 (depends on 1)

The heat dissipation sheet of claim 1, wherein the heat dissipation enhancing layer does not include a binder resin.

### Claim 3 (depends on 1)

The heat dissipation sheet of claim 1, wherein the heat dissipation enhancing layer has a thickness of 2 to 20 μm, and the heat conductive base layer has a thickness of 13 to 40 μm.

### Claim 4 (depends on 1)

The heat dissipation sheet of claim 1, wherein the heat conductive base layer includes at least one selected from an electrolytic copper foil and a rolled copper foil.

### Claim 5

A method of manufacturing a heat dissipation sheet having enhanced heat dissipation properties, comprising:
a process of manufacturing a heat dissipation enhancing coating liquid including a carbon material, a binder resin, and a solvent;
a process of applying the heat dissipation enhancing coating liquid on one surface of a heat conductive base layer to form a heat dissipation layer;
a process of performing first calendering on the heat dissipation layer and the heat conductive base layer;
a process of heat treating the first calendered heat dissipation layer and heat conductive base layer to form a heat dissipation enhancing layer and the heat conductive base layer; and
a process of performing second calendering on the heat dissipation enhancing layer and the heat conductive base layer to manufacture the heat dissipation sheet.

### Claim 6 (depends on 5)

The method of claim 5, wherein the binder resin includes a first urethane resin having a solid content of 28 to 32 wt % and a second urethane resin having a solid content of 34 to 38 wt %.

### Claim 7 (depends on 6)

The method of claim 6, wherein the binder resin includes the first urethane resin and the second urethane resin in a weight ratio of 1:0.5 to 1:0.85.

### Claim 8 (depends on 5)

The method of claim 5, wherein the process of manufacturing the heat dissipation enhancing coating liquid includes:
a process of mixing and stirring 80 to 120 parts by weight of a binder resin and 180 to 220 parts by weight of a solvent based on 100 parts by weight of a carbon material for 30 to 60 minutes to manufacture a mixed solution; and
a process of stabilizing the mixed solution at a temperature of 20° C. to 30° C. for 30 to 60 minutes to manufacture the heat dissipation enhancing coating liquid.

### Claim 9 (depends on 5)

The method of claim 5, wherein the solvent includes toluene and ethyl acetate in a weight ratio of 1:0.7 to 1:1.4, and
the heat conductive base layer includes at least one selected from an electrolytic copper foil and a rolled copper foil.

### Claim 10 (depends on 5)

The method of claim 5, wherein, in the process of forming the heat dissipation layer,
the heat dissipation layer is formed such that a thickness of the heat dissipation layer is 1.2 to 2.0 times the thickness of the heat dissipation enhancing layer.

### Claim 11 (depends on 5)

The method of claim 5, wherein the heat dissipation enhancing layer does not include the binder resin.

### Claim 12 (depends on 5)

The method of claim 5, wherein the first calendering is performed at a temperature of 60° C. to 80° C. with a load of 35 to 45 tons,
the heat treatment is performed at a temperature of 400° C. to 500° C. for 0.5 to 4 hours, and
the second calendering is performed at a temperature of 120° C. to 140° C. with a load of 45 to 55 tons.