# US 2019/0168354 A1 · Substrate polishing apparatus, substrate polishing method, and apparatus for regulating temperature of polishing surface of polishing pad used in polishing apparatus

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- Number: US 2019/0168354 A1
- Document ID: US20190168354A1
- Status: Published application
- Kind: A1
- Application number: 16/268,984
- Filed: 2019-02-06
- Published: 2019-06-06
- Earliest claimed: 2009-12-28
- Assignees: Ebara Corporation
- Applicants: Ebara Corporation
- Inventors: Tadakazu SONE; Yasuyuki MOTOSHIMA; Toru MARUYAMA; Katsutoshi ONO; Yoichi SHIOKAWA
- Web page: https://patentgrep.com/patent/US20190168354A1

## CPC

- B24B 37/015: Temperature control
- B24B 37/042: {operating processes therefor}
- B24B 37/10: for single side lapping
- B24B 37/34: Accessories
- B24B 55/02: Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant (cooling or lubricating during dressing operation B24B53/095; incorporated in grinding wheels B24D)
- B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS

## Abstract

An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.

## Claims

### Claim at position 1

1-24. (canceled)

### Claim 25

A pad-temperature regulating apparatus for regulating a temperature of a polishing surface of a polishing pad for use in a substrate polishing apparatus, said pad-temperature regulating apparatus comprising:
a solid member having a fluid passage formed therein and having a contact surface which is brought into contact with the polishing surface of the polishing pad; and
a support structure configured to support said solid member while allowing said solid member to pivot in a radial direction and a circumferential direction of the polishing pad.

### Claim 26 (depends on 25)

The pad-temperature regulating apparatus according to claim 25, wherein said contact surface is made of SiC or alumina.

### Claim 27 (depends on 25)

The pad-temperature regulating apparatus according to claim 25, wherein said solid member is placed in contact with the polishing surface by its own weight.

### Claim 28 (depends on 25)

The pad-temperature regulating apparatus according to claim 25, further comprising:
a raising mechanism capable of raising up said solid member to an upright position at a periphery of said polishing pad so that said solid member does not hinder replacement of the polishing pad.