# US 2019/0168257 A1 · Practical method and apparatus of plating substrates with carbon nanotubes (CNT)

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- Number: US 2019/0168257 A1
- Document ID: US20190168257A1
- Status: Published application
- Kind: A1
- Application number: 14/967,837
- Filed: 2015-12-14
- Published: 2019-06-06
- Earliest claimed: 2015-10-29
- Inventors: Phillip T. Holmes
- Web page: https://patentgrep.com/patent/US20190168257A1

## CPC

- B05D 3/207: {post-treatment by magnetic fields}
- B82Y 30/00: Nanotechnology for materials or surface science, e.g. nanocomposites
- C01B 32/158: Carbon nanotubes
- B82Y 40/00: Manufacture or treatment of nanostructures
- B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02)
- B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- C01B: NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; {METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C}

## Abstract

An apparatus for forming a CNT coating on a substrate includes a CNT dispensing device to dispense CNT particles to the substrate to form the CNT coating; an electro magnet to apply a magnetic field to the CNT coating; and a heater to heat the CNT coating. The CNT particles may be biased to a first voltage and the substrate may be biased to a second voltage.

## Claims

### Claim 1

1) An apparatus for forming a CNT coating on a substrate, comprising:
a CNT dispensing device to dispense CNT particles to the substrate to form the CNT coating;
an electro magnet to apply a magnetic field to the CNT coating;
a heater to heat the CNT coating;
wherein the CNT particles are biased to a first voltage and the substrate is biased to a second voltage.

### Claim 2 (depends on 1)

2) An apparatus for forming a CNT coating on a substrate as in claim 1, wherein the first voltage is an opposite polarity of the second voltage.

### Claim 3 (depends on 1)

3) An apparatus for forming a CNT coating on a substrate as in claim 1, wherein the apparatus includes a biasing device to bias the CNT particles.

### Claim 4 (depends on 3)

4) An apparatus for forming a CNT coating on a substrate as in claim 3, wherein the biasing device includes a voltage plate to bias the CNT particles.

### Claim 5 (depends on 1)

5) An apparatus for forming a CNT coating on a substrate as in claim 1, wherein the apparatus includes a resistance meter to measure the resistance of the CNT coating.

### Claim 6 (depends on 5)

6) An apparatus for forming a CNT coating on a substrate as in claim 5, wherein the flow of the CNT particles is controlled by the resistance of the CNT coating.

### Claim 7

7) A method for forming a CNT coating on a substrate, comprising the steps of:
dispensing CNT particles to the substrate to form the CNT coating;
applying a magnetic field to the CNT coating;
heating the CNT coating;
biasing the CNT particles to a first voltage and biasing the substrate to a second voltage.

### Claim 8 (depends on 7)

8) A method for forming a CNT coating on a substrate as in claim 7, wherein the first voltage is an opposite polarity of the second voltage.

### Claim 9 (depends on 7)

9) A method for forming a CNT coating on a substrate as in claim 7, wherein the biasing step is performed by a biasing device to bias the CNT particles.

### Claim 10 (depends on 9)

10) A method for forming a CNT coating on a substrate as in claim 9, wherein the biasing device includes a voltage plate to bias the CNT particles.

### Claim 11 (depends on 7)

11) as in claim 7, wherein the method includes the step of measuring the resistance of the CNT coating.

### Claim 12 (depends on 11)

12) A method for forming a CNT coating on a substrate as in claim 11, wherein the method includes the step of controlling the flow of the CNT particles by the resistance of the CNT coating.
