# US 2019/0167138 A1 · Lead for an active implantable medical device with a chip for electrode multiplexing > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0167138 A1 - Document ID: US20190167138A1 - Status: Published application - Kind: A1 - Application number: 16/252,279 - Filed: 2019-01-18 - Published: 2019-06-06 - Earliest claimed: 2010-12-14 - Assignees: Sorin Crm SAS - Applicants: Sorin Crm SAS - Inventors: Jean-François Ollivier - Web page: https://patentgrep.com/patent/US20190167138A1 ## CPC - A61B 5/273: Connection of cords, cables or leads to electrodes - A61B 5/0215: by means inserted into the body - A61B 5/686: {Permanently implanted devices, e.g. pacemakers, other stimulators, biochips (A61B5/6861 takes precedence)} - A61N 1/05: for implantation or insertion into the body, e.g. heart electrode (A61N1/06 takes precedence) - A61N 1/0587: {Epicardial electrode systems; Endocardial electrodes piercing the pericardium} - H01R 43/20: for assembling or disassembling contact members with insulating base, case or sleeve - A61B 5/125: {objective methods} - A61B 8/06: Measuring blood flow - A61B 2562/125: characterised by the manufacture of electrodes - Y10S 439/909: Medical use or attached to human body - Y10T 29/49146: with encapsulating, e.g., potting, etc. - Y10T 29/49169: Assembling electrical component directly to terminal or elongated conductor - Y10T 29/49171: with encapsulating - A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D) - A61N: ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY (measurement of bioelectric currents A61B; surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body A61B18/00; anaesthetic apparatus in general A61M; incandescent lamps H01K; infrared radiators for heating H05B) - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A lead for active implantable medical devices comprising a chip, notably for electrode multiplexing. The lead includes an insulating supporting tube interposed in a flexible elongated tube, with a central bore coaxial with the lumen of the lead. The supporting tube comprises on its surface at least one crossing conductive strip extending in the axial direction. A chip on a flexible substrate is disposed with a bent or curved conformation in a receptacle of the supporting tube isolated from the conductive strip. An electrode, e.g., for cardiac sensing/pacing, carried by the supporting tube is electrically connected to an outer conductive pad of the chip. The conductive strip is connected (i) at each end, face to face to a conductive connection, housed in the sheath, and (ii) in a central region, to an inner conductive pad of the chip. ## Claims ### Claim 1 A method of manufacturing a lead for an active implantable medical device, comprising: providing a supporting tube; disposing a conductive strip on an outer surface of the supporting tube such that the conductive strip extends in an axial direction along a length of the supporting tube; mounting a chip including a first conductive contact pad and a second conductive contact pad to the supporting tube such that the first conductive contact pad is in contact with the conductive strip; fitting an electrode to the supporting tube such that the electrode is in contact with the second conductive contact pad; coupling a conductor to each end of the supporting tube such that each conductor is in contact with the conductive strip; and covering at least one of the chip and the conductors with a sheath to provide the lead. ### Claim 2 (depends on 1) The method of claim 1, further comprising separating the sheath into two or more segments by interposing the supporting tube in the sheath, the two or more segments comprising a first segment and a second segment. ### Claim 3 (depends on 1) The method of claim 1, wherein the supporting tube comprises a central region and two end regions, wherein the central region has a diameter that is greater than a diameter of the two end regions. ### Claim 4 (depends on 3) The method of claim 3, further comprising forming a cavity within the central region of the supporting tube, the cavity forming a chip receptacle configured to hold the chip. ### Claim 5 (depends on 4) The method of claim 4, further comprising forming the cavity such that a depth of the cavity corresponds with a thickness of the chip such that the exterior surface of the chip is flush with the diameter of the central region of the supporting tube when the chip is held in the cavity. ### Claim 6 (depends on 4) The method of claim 4, further comprising forming the chip with a flexible substrate such that an interior surface of the chip is formed to an outer surface of the supporting tube when the chip is held in the chip receptacle. ### Claim 7 (depends on 1) The method of claim 1, further comprising extending a conductive sleeve circumferentially around a periphery of the central region of the supporting tube. ### Claim 8 (depends on 7) The method of claim 7, further comprising structuring the conductive sleeve such that the conductive sleeve contacts the first conductive contact pad of the chip when the chip is mounted on the supporting tube. ### Claim 9 (depends on 7) The method of claim 7, further comprising heating the conductive sleeve onto the supporting tube via thermal reflow to establish electrical continuity. ### Claim 10 (depends on 7) The method of claim 7, further comprising injecting a mass of material in a space between the conducive sleeve and the central region of the supporting tube. ### Claim 11 (depends on 10) The method of claim 10, wherein the mass of material comprises a polyurethane glue. ### Claim 12 (depends on 1) The method of claim 1, wherein the first conductive contact pad is positioned on an exterior surface of a substrate of the chip and the second conductive contact pad is positioned on an interior surface of the substrate of the chip. ### Claim 13 (depends on 1) The method of claim 1, wherein the conductive strip is a first conductive strip, the method further comprising disposing a second conductive strip on the outer surface of the supporting tube, wherein the first conductive strip and the second conductive strip are disposed on diametrically opposed regions of the supporting tube. ### Claim 14 (depends on 1) The method of claim 1, further comprising defining a plurality of cavities by circumferentially extending an insulating sleeve around a periphery of the central region of the supporting tube, wherein the electrode comprises a plurality of sector electrodes, one of each of the plurality of sector electrodes disposed with each of the plurality of cavities, wherein the first conductive contact pad comprises a plurality of first conductive contact pads, and wherein each of the plurality of sector electrodes is connected to a corresponding one of the plurality of first conductive contact pads of the chip. ### Claim 15 (depends on 1) The method of claim 1, further comprising forming the supporting tube of at least one of a ceramic material and a plastic material to electrically isolate the supporting tube. ### Claim 16 A method of manufacturing a supporting tube of a lead for an active implantable medical device, comprising: providing a supporting tube; disposing a conductive strip on an outer surface of the supporting tube such that the conductive strip extends in an axial direction along a length of the supporting tube; mounting a chip including a first conductive contact pad and a second conductive contact pad to the supporting tube such that the first conductive contact pad is in contact with the conductive strip; fitting an electrode to the supporting tube such that the electrode is in contact with the second conductive contact pad; and coupling a conductor to each end of the supporting tube such that each conductor is in contact with the conductive strip. ### Claim 17 (depends on 16) The method of claim 16, further comprising extending a conductive sleeve configured as an electrode circumferentially around a periphery of a central region of the supporting tube. ### Claim 18 (depends on 17) The method of claim 17, further comprising forming a cavity within the central region of the supporting tube, the cavity forming a chip receptacle configured to hold the chip. ### Claim 19 (depends on 18) The method of claim 18, further comprising forming the cavity such that a depth of the cavity corresponds with a thickness of the chip such that the exterior surface of the chip is flush with the diameter of the central region of the supporting tube when the chip is held in the cavity. ### Claim 20 (depends on 19) The method of claim 19, further comprising forming the chip with a flexible substrate such that an interior surface of the chip is formed to an outer surface of the supporting tube when the chip is held in the chip receptacle.