Liquid cooled chassis
AssigneeDell Products L.P.
InventorsDAVID L. MOSS, WILLIAM K. COXE
Life of this patent
Estimating the term…
Abstract
An information handling system (IHS) includes a node enclosure containing one or more heat-generating functional components. A cold plate is attached to an inner surface of the node enclosure. The cold plate presents a conduction surface to a selected at least one of the one or more heat-generating functional components. A spring is positioned between the inner surface of the node enclosure and the cold plate. The spring positions the conduction surface into conductive proximity with the selected at least one of the one or more heat-generating functional components.
Claims18
An information handling system (IHS) comprising:
- a node enclosure containing one or more heat-generating functional components;
- a cold plate attached to an inner surface of the node enclosure and presenting a conduction surface to a selected at least one of the one or more heat-generating functional components;
- a compliant, thermally conductive member placed between the cold plate and the selected at least one of the one or more heat-generating function components;
- a spring positioned between the inner surface of the node enclosure and the cold plate to position the conduction surface into conductive proximity with the selected at least one of the one or more heat-generating functional components;
- wherein the cold plate, the spring, and the compliant, thermally conductive member comprise a first cold plate assembly that is attached beneath the selected at least one of the one or more heat-generating functional components;
- and
- a second cold plate assembly attached above another one of the one or more heat-generating functional components.
(canceled)
A liquid cooling (LC) subsystem comprising:
- a cold plate attachable to an inner surface of a node enclosure of an Information Handling System (IHS) and presenting a conduction surface to a selected one or more heat-generating functional components inside the node enclosure;
- a compliant, thermally conductive member placed between the cold plate and the selected at least one of the one or more heat-generating function components;
- a spring positionable between the inner surface of the node enclosure and the cold plate to position the conduction surface into conductive proximity with the selected one or more heat-generating functional components;
- wherein the cold plate, the spring, and the compliant, thermally conductive member comprise a first cold plate assembly that is attached beneath the selected at least one of the one or more heat-generating functional components;
- and
- the LC subsystem further comprising a second cold plate assembly that is attached above another one of the one or more heat-generating functional components.
(canceled)
A method comprising:
- attaching a cold plate of a liquid cooling subsystem to an inner surface of a node enclosure of an information handling system (IHS);
- inserting a spring between the cold plate and the inner surface of the node enclosure;
- and
- presenting a conduction surface of the cold plate to a selected one or more heat-generating functional components of the IHS physically located within the node enclosure;
- providing a compliant, thermally conductive member placed between the cold plate and the selected at least one of the one or more heat-generating function components;
- wherein the cold plate, the spring, and the compliant, thermally conductive member comprise a first cold plate assembly that is attached beneath the selected at least one of the one or more heat-generating functional components;
- and
- providing a second cold plate assembly attached above another one of the one or more heat-generating functional components.
Dependencies are inferred from the claim text.