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US 2019/0166722 A1Published application
Electronic device
AssigneeMurata Manufacturing Co., Ltd.
InventorTaku Ogura
Life of this patent
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Abstract
An electronic device that includes a printed board with a surface over which a heating element is mounted, and a hermetically sealed housing that has thermal conductivity and accommodates the printed board therein. The printed board has a through hole therein, and a projection on a surface of the housing is thermally coupled to the heating element through the through hole.
Claims15
An electronic device comprising:
- a printed board having first and second opposing surfaces and defining a through hole extending between the first and second surfaces;
- a heating element adjacent the first surface of the printed board and extending over the through hole;
- and
- a hermetically sealed housing that has thermal conductivity and accommodates the printed board therein, the housing including a projection on a surface thereof, the projection being thermally coupled to the heating element through the through hole.
1 more element
Dependencies are inferred from the claim text.