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US 2019/0166721 A1Published application
Heat dissipation structure and electronic device having the same
AssigneeChiun Mai Communication Systems, Inc.
InventorYU-WEI CHANG
Life of this patent
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Abstract
A heat dissipation structure comprises a channel structure and a cooling material received and sealed in the channel structure. The cooling material is a low-boiling-point electrical insulating fluid. The channel structure is made of an electrical insulating material. The channel structure comprises an evaporation portion, a condenser portion, and at least one channel connecting the evaporation portion and the condenser portion. An electronic device using the heat dissipation structure is also provided.
Claims17
A heat dissipation structure comprising:
- a channel structure;
- and
- a cooling material received and sealed in the channel structure;
- wherein the cooling material is an electrical insulating fluid with a boiling point below an operating temperature of a heat source, the channel structure is made of an electrical insulating material, the channel structure comprises an evaporation portion, a condenser portion, and at least one channel connecting the evaporation portion and the condenser portion.
1 more element
An electronic device comprising:
- a housing;
- a heat source received in the housing;
- and
- a heat dissipation structure comprising:
- a channel structure;
- and
- a cooling material received and sealed in the channel structure;
- wherein the cooling material is an electrical insulating fluid with a low boiling point below an operating temperature of the heat source, the channel structure is made of an electrical insulating material, the channel structure comprises an evaporation portion, a condenser portion, and at least one channel connecting the evaporation portion and the condenser portion, the evaporation portion is attached to the heat source.
5 more elements
Dependencies are inferred from the claim text.