Substrate, power supply device, and substrate insulation method
AssigneeRicoh Company, Ltd.
InventorsYukihiro Mitani, Keita Yoshikawa
Life of this patent
Estimating the term…
Abstract
A substrate includes a primary circuit; a secondary circuit; and a ground (GND) patterns. In a path between the primary circuit and the secondary circuit without passing through the GND pattern, reinforced insulation is provided between the primary circuit and the secondary circuit. In a path between the primary circuit and the secondary circuit through the GND pattern, one of 1) a combination of reinforced insulation and functional insulation and 2) a combination of basic insulation, additional insulation, and functional insulation is provided between the primary circuit and the secondary circuit.
Claims6
A substrate comprising:
- a primary circuit;
- a secondary circuit;
- and
- a ground (GND) patterns,
- wherein, in a path between the primary circuit and the secondary circuit without passing through the GND pattern, reinforced insulation is provided between the primary circuit and the secondary circuit, and
- wherein, in a path between the primary circuit and the secondary circuit through the GND pattern, one of 1) a combination of reinforced insulation and functional insulation and 2) a combination of basic insulation, additional insulation, and functional insulation is provided between the primary circuit and the secondary circuit.
An insulation method comprising:
- providing reinforced insulation between a primary circuit and a secondary circuit in a path between the primary circuit and the secondary circuit without passing through a GND pattern;
- and
- providing one of a combination of reinforced insulation and functional insulation and a combination of basic insulation, additional insulation, and functional insulation between the primary circuit and the secondary circuit, in a path between the primary circuit and the secondary circuit through the GND pattern of a substrate.
Dependencies are inferred from the claim text.